component
LM385DBZ-2.5RG
Public Made by Adomby adom
HANSCHIP semiconductor Voltage Reference, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownLM385DBZ-2.5RG
HANSCHIP semiconductor · Voltage Reference · SOT-23-3
LM385DBZ-2.5RG from HANSCHIP semiconductor, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | output | Reference voltage output, 2.5V nominal with ±0.3% maximum initial error, operating current range 10µA to 20mA. |
| 2 | ANODE | power_in | Ground connection (negative supply). |
| 3 | FB | input | Feedback pin for precision voltage adjustment and calibration. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOT-23-3 |
| Category | Power Management (PMIC) |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage | 2.47 | 2.49 | 2.52 | V | Ta=25℃,10µA≤IR≤20mA | 3 | |
| Reverse breakdown voltage change with current | 1 | 1.5 | mV | 10µA ≤ IR≤1mA | 3 | ||
| Reverse breakdown voltage change with current | 10 | 25 | mV | 1mA≤IR≤20mA | 3 | ||
| Minimum operating current | 15 | 20 | µA | 3 | |||
| Reverse current | 30 | mA | 2 | ||||
| Forward current | 10 | mA | 2 | ||||
| Operating temperature range | 0 | 70 | ℃ | 2 | |||
| Storage temperature | -55 | 150 | ℃ | 2 | |||
| Soldering temperature (spot) | 260 | ℃ | 10 s spot soldering | 2 | |||
| Reverse dynamic impedance | 1 | Ω | IR=100µA, f=20Hz | 3 | |||
| Wideband noise (rms) | 60 | µV | IR=100µA,10Hz≤f≤10kHz | 3 | |||
| Long-term stability | 20 | ppm | IR=100µA, T=1000Hr, TA=25°C±0.1°C | 3 | |||
| Average temperature coefficient | 30 | ppm/℃ | IR = 100 µA | 3 |
CAD (KiCad official)
- Symbol:
LM385DBZ-2.5RG - Footprint:
Package_TO_SOT_SMD:SOT-23-3 - 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files:
lm385dbz-2-5rg-etched.step/lm385dbz-2-5rg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);lm385dbz-2-5rg.step/lm385dbz-2-5rg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (9 pp, sha256
8b65558921de94b6, retrieved 2026-09-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).