component

LM2833XMY

Public Made by Adom

by adom

Texas Instruments DC-DC Converters, MSOP-10-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentpower management (pmic)lm2833xmyfactory-2.0.0extractor-text
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Generated by kicad-footprint-generator · KiCad file format 20260206
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LM2833XMY

Texas Instruments · DC-DC Converters · MSOP-10-EP

LM2833XMY from Texas Instruments, in a MSOP-10-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VINC power_in Input supply for internal bias and control circuitry; it must be locally bypassed to GND.
2 EN input Enable control input where logic high enables operation; do not let this pin float or subject it to voltages greater than VIN + 0.3V.
3 SGND power_in Signal (analog) ground; place the bottom resistor of the feedback network as close as possible to this pin for good load regulation.
4 NC unconnected No user function; the datasheet says to connect this pin to GND.
5 FB input Feedback pin that connects to the external resistor divider to set the output voltage; FB voltage absolute maximum is -0.5V to 3V.
6 PGND power_in Power ground pin that provides the ground return path for the internal driver.
7 SW output Switch pin that connects to the inductor and catch diode; SW voltage absolute maximum is -0.5V to 7V.
8 SW output Switch pin that connects to the inductor and catch diode; SW voltage absolute maximum is -0.5V to 7V.
9 VIND power_in Input supply voltage pin; connect a bypass capacitor locally from this pin to PGND.
10 VIND power_in Input supply voltage pin; connect a bypass capacitor locally from this pin to PGND.
11 DAP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-10-EP
Category Power Management (PMIC)
Pins 11

CAD (KiCad official)

  • Symbol: LM2833XMY
  • Footprint: Package_SO:MSOP-10-1EP_3x3mm_P0.5mm_EP1.68x1.88mm
  • 3D model: MSOP-10-EP (KiCad packages3D, STEP)
  • 3D model files: lm2833xmy-etched.step / lm2833xmy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2833xmy.step / lm2833xmy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 bf1870ef3f8a9cb6, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF