# LM2574HVM-5.0

**Texas Instruments** · DC-DC Converters · SOIC-14-300mil

LM2574HVM-5.0 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 2 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 3 | FB | input | Feedback sense input; connect to the midpoint of the feedback divider to set VOUT for the ADJ version, or connect directly to the output capacitor for a fixed-output version. |
| 4 | SIG_GND | power_in | Signal ground; the ground reference for internal references and logic, to be connected to system ground. |
| 5 | ON/OFF | input | Enable input: high = OFF, low = ON; connect to GND to enable the regulator and do not leave this pin floating. |
| 6 | PWR_GND | power_in | Power ground; connect to system ground and to the ground pins of CIN and COUT, keeping the path to CIN as short as possible. |
| 7 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 8 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 9 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 10 | VIN | power_in | Supply input to the collector of the high-side transistor; connect to the supply and bypass capacitor CIN, with the VIN-to-CIN and PWR_GND path kept as short as possible (supply 60 V max for LM2574HV). |
| 11 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 12 | OUTPUT | output | Emitter of the power transistor and switching node; connect to the inductor and the cathode of the external diode. |
| 13 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |
| 14 | NC | unconnected | No internal connection, but it must be soldered to the PCB for best heat transfer. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-14-300mil |
| Category | Power Supply Chip |
| Pins | 14 |

## CAD (KiCad official)

- Symbol: `LM2574HVM-5.0`
- Footprint: `Package_SO:SOIC-14_3.9x8.7mm_P1.27mm`
- 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
- 3D model files: `lm2574hvm-5-0-etched.step` / `lm2574hvm-5-0-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lm2574hvm-5-0.step` / `lm2574hvm-5-0.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/lm2574) (42 pp, sha256 `61a9f44cec6689e8`, retrieved 2026-10-10, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lm2574hvm-5-0-datasheet.pdf)