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LM2574HVM-5.0

Texas Instruments · DC-DC Converters · SOIC-14-300mil

LM2574HVM-5.0 from Texas Instruments, in a SOIC-14-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
2 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
3 FB input Feedback sense input; connect to the midpoint of the feedback divider to set VOUT for the ADJ version, or connect directly to the output capacitor for a fixed-output version.
4 SIG_GND power_in Signal ground; the ground reference for internal references and logic, to be connected to system ground.
5 ON/OFF input Enable input: high = OFF, low = ON; connect to GND to enable the regulator and do not leave this pin floating.
6 PWR_GND power_in Power ground; connect to system ground and to the ground pins of CIN and COUT, keeping the path to CIN as short as possible.
7 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
8 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
9 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
10 VIN power_in Supply input to the collector of the high-side transistor; connect to the supply and bypass capacitor CIN, with the VIN-to-CIN and PWR_GND path kept as short as possible (supply 60 V max for LM2574HV).
11 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
12 OUTPUT output Emitter of the power transistor and switching node; connect to the inductor and the cathode of the external diode.
13 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.
14 NC unconnected No internal connection, but it must be soldered to the PCB for best heat transfer.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-14-300mil
Category Power Supply Chip
Pins 14

CAD (KiCad official)

  • Symbol: LM2574HVM-5.0
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14-300mil (KiCad packages3D, STEP)
  • 3D model files: lm2574hvm-5-0-etched.step / lm2574hvm-5-0-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm2574hvm-5-0.step / lm2574hvm-5-0.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 61a9f44cec6689e8, retrieved 2026-10-10, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF