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LM25119PSQX

Texas Instruments · DC-DC Converters · WQFN-32-EP(5x5)

LM25119PSQX from Texas Instruments, in a WQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC1 power_out Channel 1 VCC bias pin; limits are -0.3 V to 15 V to AGND (recommended 4.5 V to 14 V), and it must not exceed VIN.
2 LO1 output Channel 1 low-side MOSFET gate drive output, to be connected to the synchronous MOSFET gate through a short, low-inductance path; LO1 to AGND is limited to -0.3 V to VVCC + 0.3 V.
3 PGND1 power_in Power ground return for the channel 1 low-side MOSFET gate driver, to be connected directly to the low side of the channel 1 current sense resistor.
4 CSG1 input Kelvin ground connection for the channel 1 external current sense resistor, to be connected directly to its low side.
5 CS1 input Channel 1 current sense amplifier input, to be connected to the high side of the channel 1 current sense resistor; CS1 to AGND is limited to -0.3 V to 0.3 V.
6 RAMP1 input Channel 1 PWM ramp signal; an external RC network between SW1, RAMP1 and AGND sets the emulated inductor-current ramp slope.
7 SS1 input Channel 1 soft-start pin; an external capacitor with an internal 10-µA source sets the error amplifier reference ramp rate, and SS1 is held low when VCC1 or VCC2 is below 4 V, UVLO is below 1.25 V, or during thermal shutdown.
8 VCCDIS input Optional input that disables the internal VCC regulators when VCCDIS is above 1.25 V for external bias; it has a 500-kΩ pulldown to ground.
9 FB1 input Channel 1 feedback input and inverting input of the internal error amplifier, with a regulation threshold of 0.8 V.
10 COMP1 output Channel 1 internal error amplifier output; the loop compensation network must be connected between this pin and FB1.
11 EN2 input Channel 2 enable; when low, channel 2 is disabled while channel 1 and other functions remain active, and the pin has an internal 50-kΩ pullup.
12 AGND power_in Analog ground, the return for the internal 0.8-V voltage reference and analog circuits.
13 RT input Oscillator timing pin set by a single resistor to AGND; the recommended maximum oscillator frequency is 1.5 MHz, corresponding to a 750-kHz maximum switching frequency per channel, and it can be synchronized by a positive pulse coupled through a small capacitor.
14 RES output Restart timer pin for an external capacitor that sets the hiccup-mode off time; a 10-µA source charges it to the 1.25-V restart threshold after 256 consecutive cycle-by-cycle current-limit PWM cycles.
15 COMP2 output Channel 2 internal error amplifier output; the loop compensation network must be connected between this pin and FB2.
16 FB2 input Channel 2 feedback input and inverting input of the internal error amplifier, with a regulation threshold of 0.8 V.
17 DEMB input Logic input that enables diode emulation when low and disables it when high; a 50-kΩ internal pulldown enables diode emulation if the pin is left floating.
18 SS2 input Channel 2 soft-start pin; an external capacitor with an internal 10-µA source sets the error amplifier reference ramp rate, and SS2 is held low when VCC1 or VCC2 is below 4 V, UVLO is below 1.25 V, or during thermal shutdown.
19 RAMP2 input Channel 2 PWM ramp signal; an external RC network between SW2, RAMP2 and AGND sets the emulated inductor-current ramp slope.
20 CS2 input Channel 2 current sense amplifier input, to be connected to the high side of the channel 2 current sense resistor; CS2 to AGND is limited to -0.3 V to 0.3 V.
21 CSG2 input Kelvin ground connection for the channel 2 external current sense resistor, to be connected directly to its low side.
22 PGND2 power_in Power ground return for the channel 2 low-side MOSFET gate driver, to be connected directly to the low side of the channel 2 current sense resistor.
23 LO2 output Channel 2 low-side MOSFET gate drive output, to be connected to the synchronous MOSFET gate through a short, low-inductance path; LO2 to AGND is limited to -0.3 V to VVCC + 0.3 V.
24 VCC2 power_out Channel 2 VCC bias pin; limits are -0.3 V to 15 V to AGND (recommended 4.5 V to 14 V), and it must not exceed VIN.
25 SW2 bidirectional Channel 2 buck switching node, connected to the channel 2 bootstrap capacitor, the high-side MOSFET source and the low-side MOSFET drain; SW2 to AGND is limited to -3 V to 45 V.
26 HO2 output Channel 2 high-side MOSFET gate drive output, to be connected to the gate of the high-side MOSFET through a short, low-inductance path; HO2 to SW2 is limited to -0.3 V to VHB + 0.3 V.
27 HB2 power_in Channel 2 high-side driver bootstrap supply, connected to the bootstrap diode cathode and bootstrap capacitor, which must be placed as close to the controller as possible; HB to SW is limited to 4.5 V to 14 V.
28 UVLO input Undervoltage lockout programming pin; below 0.4 V the regulator shuts down, between 0.4 V and 1.25 V it is in standby with no switching, and above 1.25 V switching is enabled, with a 20-µA hysteresis current source.
29 VIN power_in Supply voltage input for the VCC regulators; the recommended range is 4.5 V to 42 V and the absolute maximum is 45 V to AGND.
30 HB1 power_in Channel 1 high-side driver bootstrap supply, connected to the bootstrap diode cathode and bootstrap capacitor, which must be placed as close to the controller as possible; HB to SW is limited to 4.5 V to 14 V.
31 HO1 output Channel 1 high-side MOSFET gate drive output, to be connected to the gate of the high-side MOSFET through a short, low-inductance path; HO1 to SW1 is limited to -0.3 V to VHB + 0.3 V.
32 SW1 bidirectional Channel 1 buck switching node, connected to the channel 1 bootstrap capacitor, the high-side MOSFET source and the low-side MOSFET drain; SW1 to AGND is limited to -3 V to 45 V.
33 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-32-EP(5x5)
Category Power Management (PMIC)
Pins 33

CAD (KiCad official)

  • Symbol: LM25119PSQX
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: WQFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: lm25119psqx-etched.step / lm25119psqx-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm25119psqx.step / lm25119psqx.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 ce7cb7dea581ea97, retrieved 2026-10-10, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF