Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

LM1881N

HGSEMI · Interface - Specialized · DIP-8

LM1881N from HGSEMI, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 COMPOSITE SYNC OUTPUT output Composite sync output, a reproduction of the sync waveform with video removed; max output sink current 5 mA.
2 COMPOSITE VIDEO INPUT input AC-coupled composite video input via a 0.1 µF capacitor, clamped to 1.5 V DC at sync tip, accepting 0.5 V to 2 V p-p.
3 VERTICAL SYNC OUTPUT output Vertical sync output pulse; max output sink current 5 mA.
4 GND power_in Ground connection.
5 BURST/BACK PORCH OUTPUT output Burst gate/back porch pulse output, about 4 µs wide; max output sink current 5 mA.
6 RSET passive Connect the RSET resistor (680 kΩ typical) to ground, with a 0.1 µF decoupling capacitor, to set internal current levels; reference voltage 1.10 V to 1.35 V.
7 ODD/EVEN OUTPUT output Odd/even field index output, low during even field and high during odd field; max output sink current 2 mA.
8 VCC power_in Supply voltage 5 V to 12 V DC, with a decoupling capacitor; absolute maximum 13.2 V.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package DIP-8
Category Communication Interface Chip/UART/485/232
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Current (outputs at logic 1) 5.2 10 mA VCC = 5V; outputs at logic 1 3
Supply Current (outputs at logic 1) 5.5 12 mA VCC = 12V; outputs at logic 1 3
DC Input Voltage 1.3 1.5 1.8 V Pin 2 3
Input Threshold Voltage 55 70 85 mV Note 6 3
Input Discharge Current 6 11 16 µA Pin 2; VIN = 2V 3
Input Clamp Charge Current 0.2 0.8 mA Pin 2; VIN = 1V 3
RSET Pin Reference Voltage 1.1 1.22 1.35 V Pin 6; Note 7 3
Composite Sync & Vertical Outputs Logic 1 voltage 4 4.5 V IOUT = 40 µA; VCC = 5V 3
Composite Sync & Vertical Outputs Logic 1 voltage 11 V IOUT = 40 µA; VCC = 12V 3
Composite Sync & Vertical Outputs Logic 1 voltage 2.4 3.6 V IOUT = 1.6 mA; VCC = 5V 3
Composite Sync & Vertical Outputs Logic 1 voltage 10 V IOUT = 1.6 mA; VCC = 12V 3
Burst Gate & Odd/Even Outputs Logic 1 voltage 4 4.5 V IOUT = 40 µA; VCC = 5V 3
Burst Gate & Odd/Even Outputs Logic 1 voltage 11 V IOUT = 40 µA; VCC = 12V 3
Composite Sync Output Logic 0 voltage 0.2 0.8 V IOUT = −1.6 mA; Pin 1 3
Vertical Sync Output Logic 0 voltage 0.2 0.8 V IOUT = −1.6 mA; Pin 3 3
Burst Gate Output Logic 0 voltage 0.2 0.8 V IOUT = −1.6 mA; Pin 5 3
Odd/Even Output Logic 0 voltage 0.2 0.8 V IOUT = −1.6 mA; Pin 7 3
Vertical Sync Width 190 230 300 µs 3
Burst Gate Width 2.5 4 4.7 µs 2.7 kΩ from Pin 5 to VCC 3
Vertical Default Time 32 65 90 µs Note 8 3
Supply Voltage 13.2 V 2
Input Voltage 3 Vp-p VCC = 5V 2
Input Voltage 6 Vp-p VCC = 8V 2
Output Sink Current 5 mA Pins 1, 3, 5 2
Output Sink Current 2 mA Pin 7 2
Package Dissipation 1100 mW Note 2 2
Storage Temperature Range -65 150 °C 2
ESD Susceptibility (Human Body Model) 2 kV Note 3; 100 pF through 1.5 kΩ 2
ESD Susceptibility (Machine Model) 200 V Note 4; 220-240 pF through all pins 2
Soldering Temperature, Dual-In-Line Package 260 °C 10 s 2
Lead Temperature (Soldering) 260 °C 10 s 2
Maximum Junction Temperature 150 °C Note 2 (derating basis) 3
Package Thermal Resistance, Junction to Ambient 110 °C/W Note 2; derate above 25°C ambient 3
Supply Voltage (operating) 5 12 V Single supply; Application Notes text 5
Composite Video Input Amplitude (operating) 0.5 2 Vp-p Positive-polarity composite video; Application Notes text 5

CAD (KiCad official)

  • Symbol: LM1881N
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: lm1881n-etched.step / lm1881n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lm1881n.step / lm1881n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (17 pp, sha256 18a032033306f1df, retrieved 2026-10-29, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF