LGS63030EP

{
 "schema": "adom.pads/1",
 "slug": "lgs63030ep",
 "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm",
 "generated_from": {
  "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.475,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 4,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "FB",
   "type": "input",
   "description": "Feedback input. Connected to an external sense resistor R_SENSE from the LED cathode string, the output current is set by I_OUT = V_FB / R_SENSE with typical V_FB = 0.2 V (0.195-0.205 V). FB bias current ≤ 50 nA.",
   "is_pin1": true,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "GND",
   "type": "power_in",
   "description": "Device ground. All voltages in the datasheet are referenced to this pin. Also serves as the return for the input decoupling capacitor which should be placed as close as possible to VIN/GND.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "SW",
   "type": "power_out",
   "description": "Internal boost power switch node (drain of the 350 mΩ low-side N-MOSFET). Connect the external boost inductor (typ. 4.7 µH) and Schottky freewheeling diode (e.g. PMEG6020R) at this pin. Absolute max SW-to-GND voltage: -0.3 V to +60 V; peak switch current up to 3 A. ESOP-8 exposes SW on pins 3 and 4, which must be tied together on the PCB.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "SW",
   "type": "power_out",
   "description": "Second SW pin on the ESOP-8 package - electrically identical to pin 3, providing parallel current path and heat spreading for the internal 350 mΩ boost switch. Must be shorted to pin 3 on the PCB and connected to the boost inductor / Schottky diode node.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "VIN",
   "type": "power_in",
   "description": "Main power input, 3.0 V to 60 V (absolute max 60 V, -0.3 V to +60 V). UVLO rising ≈ 3.0 V / falling ≈ 2.6 V. Bypass with a 4.7 µF (or larger) X5R/X7R ceramic capacitor rated ≥ 100 V, placed as close as possible to VIN and GND.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "NC",
   "type": "unconnected",
   "description": "No connect. No external component is required; leave the pin floating (suspended). Do not tie to any signal or plane.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "OVP",
   "type": "input",
   "description": "Output over-voltage protection sense. Connect the midpoint of a resistor divider from V_OUT to GND to this pin. OVP trips when V_OVP rises above ≈ 1 V (recovery ≈ 0.86 V); the resulting V_OUT_OVP = (1 + R1/R2) × 1 V. Absolute max -0.3 V to +6 V; keep the pin voltage below 1 V in normal operation.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "EN",
   "type": "input",
   "description": "Enable / dimming input. Accepts a DC level (analog dimming 0.6-1.2 V on LGS63030) or a PWM square wave (100 Hz-1 kHz on LGS63030, 100 Hz-25 kHz on LGS63032) to dim the LED output. Drive > 0.5 V (typ. 0.31 V rising / 0.35 V falling for digital thresholds) to enable the boost; drive < 0.4 V to enter low-power sleep. Internal 800 kΩ pull-down; do not float. Input current ≤ 10 µA at V_EN = 5 V. Absolute max -0.3 V to +6 V.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    0.0,
    0.0
   ],
   "rot": 0.0,
   "size": [
    2.41,
    3.3
   ],
   "layers": [],
   "thermal": true,
   "pin": "9",
   "name": "EXPOSED PAD",
   "type": "power_in",
   "description": "Exposed thermal pad. Present in the package land pattern; connect it per the manufacturer datasheet thermal recommendation. Added because the footprint carries this pad and the symbol had no pin for it.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}