component
LE87271EQCT
Public Made by Adomby adom
Microchip Tech Telecommunication Interface ICs, QFN-20-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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LE87271EQCT
Microchip Tech · Telecommunication Interface ICs · QFN-20-EP(4x4)
LE87271EQCT from Microchip Tech, in a QFN-20-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect, no internal connection. |
| 2 | NC | unconnected | No connect, no internal connection. |
| 3 | C0 | input | Tri-state logic-level state control input with an internal resistor pulling to the middle level when undriven (VIH 2.0 V min, VIL 0.8 V max, VIM 1.4 to 1.6 V on C0). |
| 4 | C1 | input | Logic-level state control input with an internal pull-down resistor (VIH 2.0 V min, VIL 0.8 V max). |
| 5 | C2 | input | Logic-level state control input with an internal pull-down resistor (VIH 2.0 V min, VIL 0.8 V max). |
| 6 | NC | unconnected | No connect, no internal connection. |
| 7 | IREF | passive | Bias current reference pin, connected through RREF (75 kΩ typical) to ground. |
| 8 | VDD | power_in | Power supply pin, 12.6 V to 15.4 V (14 V typical), tied together with VDD_P and VDD_N. |
| 9 | VDD_N | power_in | Power supply pin for the N output side, 12.6 V to 15.4 V (14 V typical), tied together with VDD and VDD_P. |
| 10 | NC | unconnected | No connect, no internal connection. |
| 11 | OUT_N | output | Line driver differential output (negative), high impedance in power-down and thermal shut-down. |
| 12 | NC | unconnected | No connect, no internal connection. |
| 13 | VSS | power_in | Ground pin. |
| 14 | NC | unconnected | No connect, no internal connection. |
| 15 | OUT_P | output | Line driver differential output (positive), high impedance in power-down and thermal shut-down. |
| 16 | NC | unconnected | No connect, no internal connection. |
| 17 | VDD_P | power_in | Power supply pin for the P output side, 12.6 V to 15.4 V (14 V typical), tied together with VDD and VDD_N. |
| 18 | VDD | power_in | Power supply pin, 12.6 V to 15.4 V (14 V typical), tied together with VDD_P and VDD_N. |
| 19 | IN_P | input | Line driver differential input (positive), 15 kΩ typical differential input impedance. |
| 20 | IN_N | input | Line driver differential input (negative), 15 kΩ typical differential input impedance. |
| 21 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | QFN-20-EP(4x4) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 21 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Quiescent supply current ATX4 | IVDD | 14.8 | 17.4 | 20 | mA | ATX4 | 9 |
| Quiescent supply current ATX3 | IVDD | 13.3 | 15.6 | 17.9 | mA | ATX3 | 9 |
| Quiescent supply current ATX2 | IVDD | 10.7 | 12.6 | 14.5 | mA | ATX2 | 9 |
| Quiescent supply current ATX1 | IVDD | 9.4 | 11 | 12.7 | mA | ATX1 | 9 |
| Quiescent supply current VTX4 | IVDD | 19.3 | 22.7 | 26.1 | mA | VTX4 | 10 |
| Quiescent supply current VTX3 | IVDD | 17.8 | 20.9 | 24 | mA | VTX3 | 10 |
| Quiescent supply current VTX2 | IVDD | 15.1 | 17.8 | 20.5 | mA | VTX2 | 10 |
| Quiescent supply current VTX1 | IVDD | 13.7 | 16.1 | 18.5 | mA | VTX1 | 10 |
| Quiescent supply current, power down | IVDD | 0.4 | 0.6 | 0.8 | mA | Power down state | 10 |
| Gain | AV | 7.88 | 8.03 | 8.2 | V/V | 10 | |
| Gain flatness | AVF | -0.3 | 0.3 | dB | f < Signal BW | 10 | |
| Input impedance | RI | 12 | 15 | 18 | kΩ | Differential | 10 |
| Input middle voltage C0 | VIM | 1.4 | 1.5 | 1.6 | V | C0 | 10 |
| Input high voltage | VIH | 2 | V | 10 | |||
| Input low voltage | VIL | 0.8 | V | 10 | |||
| Input high current C0 | IIH | 15 | 50 | 85 | µA | VIH = 3 V, C0 | 10 |
| Input high current C1, C2 | IIH | 60 | 120 | 180 | µA | VIH = 3 V, C1, C2 | 11 |
| Input low current C0 | IIL | -85 | -50 | -15 | µA | VIL = 0 V, C0 | 11 |
| Input low current C1, C2 | IIL | -2 | 0 | 2 | µA | VIL = 0 V, C1, C2 | 11 |
| Supply voltage VDD with respect to VSS (abs max) | VDD | -0.3 | 16 | V | VDD with respect to VSS | 8 | |
| Control inputs with respect to VSS (abs max) | -0.3 | 4 | V | Control inputs with respect to VSS | 8 | ||
| Junction temperature (abs max) | TJ | -40 | 150 | °C | 8 | ||
| Supply voltage VDD/VDD_P/VDD_N | VDD | 12.6 | 14 | 15.4 | V | 9 | |
| Ambient temperature | TA | -40 | 25 | 85 | °C | 9 | |
| Line impedance | 80 | 100 | 150 | Ω | 9 | ||
| Maximum device power dissipation, continuous | 1.37 | W | TA = 150 °C | 8 | |||
| Junction to ambient thermal resistance | θJA | 47.5 | °C/W | 4-layer JEDEC PCB, 12 thermal vias, still air | 8 | ||
| Junction-to-board thermal resistance | θJB | 25.8 | °C/W | 8 | |||
| Junction-to-case bottom (exposed pad) thermal resistance | θJP | 11.7 | °C/W | 8 | |||
| Junction-to-top characterization parameter | θJC | 30.8 | °C/W | 8 | |||
| Supply power | PVDD | 600 | mW | PLine = 13 dBm | 10 | ||
| Output voltage | VOUT | 10.5 | Vpkd | Between OUT_P/N | 10 | ||
| Drive current | IOUT | 240 | mApk | Through OUT_P/N | 10 | ||
| Logic input impedance | Zin | 25 | kΩ | 11 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | and antimony-free materials. The leads possess a matte-tin plating, which is compatible with conventional board assembly processes or newer lead-free board assembly processes. | 8 |
CAD (KiCad official)
- Symbol:
LE87271EQCT - Footprint:
Package_DFN_QFN:QFN-20-1EP_4x4mm_P0.5mm_EP2.5x2.5mm - 3D model: QFN-20-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
le87271eqct-etched.step/le87271eqct-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);le87271eqct.step/le87271eqct.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (17 pp, sha256
aa10e9981fec82b6, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).