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LBSS138LT1G

LRC · MOSFETs · SOT-23

LBSS138LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-to-source voltage is ±20 Vdc continuous max, with threshold VGS(th) of 0.5 V to 1.5 V at ID = 1.0 mAdc.
2 S passive Source of the N-channel MOSFET, connected to the body diode anode in the schematic symbol.
3 D passive Drain; drain-to-source voltage is 50 Vdc max, continuous drain current 200 mA and pulsed 800 mA (tp ≤ 10 µs).

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Breakdown Voltage V(BR)DSS 50 Vdc VGS = 0 Vdc, ID = 250 µAdc 2
Zero Gate Voltage Drain Current IDSS 0.1 µAdc VDS = 25 Vdc, VGS = 0 Vdc 2
Zero Gate Voltage Drain Current IDSS 0.5 µAdc VDS = 50 Vdc, VGS = 0 Vdc 2
Gate-Source Leakage Current IGSS -0.1 0.1 µAdc VGS = ± 20 Vdc, VDS = 0 Vdc 2
Gate-Source Threshold Voltage VGS(th) 0.5 1.5 Vdc VDS = VGS, ID = 1.0 mAdc 2
Static Drain-to-Source On-Resistance rDS(on) 5.6 10 Ohms VGS = 2.75 Vdc, ID < 200 mAdc, TA = –40°C to +85°C 2
Forward Transconductance gfs 100 mmhos VDS = 25 Vdc, ID = 200 mAdc, f = 1.0 kHz 2
Input Capacitance Ciss 40 50 pF VDS = 25 Vdc, VGS = 0, f = 1 MHz 2
Output Capacitance Coss 12 25 pF VDS = 25 Vdc, VGS = 0, f = 1 MHz 2
Transfer Capacitance Crss 3.5 5 pF VDG = 25 Vdc, VGS = 0, f = 1 MHz 2
Turn-On Delay Time td(on) 20 ns 2
Turn-Off Delay Time td(off) 20 ns VDD = 30 Vdc, ID = 0.2 Adc, 2
Static Drain-to-Source On-Resistance rDS(on) 3.5 Ohms VGS = 5.0 Vdc, ID = 200 mAdc 2
Drain-to-Source Voltage VDSS 50 Vdc 1
Gate-to-Source Voltage – Continuous VGS -20 20 Vdc 1
Drain Current – Continuous ID 200 mA TA = 25°C 1
Drain Current – Pulsed IDM 800 mA tp ≤ 10 µs 1
Total Power Dissipation PD 225 mW TA = 25°C 1
Operating and Storage Temperature Range TJ, Tstg -55 150 °C 1
Thermal Resistance – Junction-to-Ambient RθJA 556 °C/W 1
Maximum Lead Temperature for Soldering Purposes TL 260 °C for 10 seconds 1

CAD (KiCad official)

  • Symbol: LBSS138LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbss138lt1g-etched.step / lbss138lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbss138lt1g.step / lbss138lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (7 pp, sha256 68ca0860943499d8, retrieved 2026-10-09, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF