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L2N7002KWT1G

LRC · MOSFETs · SC-70

L2N7002KWT1G from LRC, in a SC-70. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the N-channel MOSFET, ESD protected to 2000 V HBM with a gate-source voltage limit of ±20 V.
2 Source passive Source terminal of the N-channel MOSFET, with a body-diode source current limit of 300 mA.
3 Drain passive Drain terminal of the N-channel MOSFET, rated for 60 V drain-source voltage and 320 mA steady-state drain current at 25°C.

Key specifications

Parameter Value
Manufacturer LRC
Package SC-70
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VBRDSS 60 Vdc VGS = 0, ID = 250 μAdc 2
Gate Threshold Voltage VGS(th) 1 Vdc VDS = VGS, ID = 250 μAdc 2
Forward Transconductance gfs 80 mS VDS = 5.0 Vdc, ID = 200 mAdc 2
Gate-Source Voltage VGS -20 20 Vdc 1
Gate-Source ESD Rating (HBM, Method 3015) 2000 V HBM, ESD Method 3015 1
Operating Junction and Storage Temperature TJ,Tstg -55 150 ºC 1
Drain-Source Voltage VDSS 60 Vdc 1
Drain Current, Steady State ID 320 mAdc Steady state, TA = 25°C 1
Drain Current, Steady State ID 230 mAdc Steady state, TA = 85°C 1
Drain Current, t<5s ID 380 mAdc t < 5 s, TA = 25°C 1
Drain Current, t<5s ID 270 mAdc t < 5 s, TA = 85°C 1
Pulsed Drain Current IDM 1.5 A tp = 10 μs 1
Source Current (Body Diode) IS 300 mA 1
Total Device Dissipation, Steady State PD 300 mW Steady state (FR-5 board, Note 1) 1
Total Device Dissipation, t<5s PD 420 mW t < 5 s (FR-5 board, Note 1) 1
Junction-to-Ambient Thermal Resistance, Steady State RΘJA 417 ºC/W Steady state (Note 1) 1
Junction-to-Ambient Thermal Resistance, t<5s RΘJA 300 ºC/W t < 5 s (Note 1) 1
Lead Temperature for Soldering Purposes TL 260 ºC 1/8 in. from case for 10 s 1

CAD (KiCad official)

  • Symbol: L2N7002KWT1G
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SC-70 (KiCad packages3D, STEP)
  • 3D model files: l2n7002kwt1g-etched.step / l2n7002kwt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); l2n7002kwt1g.step / l2n7002kwt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 999c66e559f8cee6, retrieved 2026-11-06, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF