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KNB3306C

KIA Semicon Tech · MOSFETs · TO-263

KNB3306C from KIA Semicon Tech, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input MOSFET gate control terminal; the datasheet rates gate-source voltage VGS at ±25 V as an absolute maximum.
2 Drain passive Drain terminal of the N-channel MOSFET; the datasheet rates drain-source voltage VDSS at 68 V and continuous drain current ID at 80 A (TC=25°C).
3 Source passive Source terminal of the N-channel MOSFET; the datasheet rates maximum continuous diode forward current IS at 80 A.

Key specifications

Parameter Value
Manufacturer KIA Semicon Tech
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage BVDSS 68 V VGS=0V,ID=250uA 3
Drain-source leakage current IDSS 1 uA VDS=68V, VGS=0V 3
Gate-source forward leakage IGSS -100 100 nA VGS=±20V, VDS=0V 3
Gate threshold voltage VGS(TH) 2 3 4 V VDS=VGS,ID=250uA 3
Drain-source on-resistance RDS(on) 6.5 8.5 mΩ VGS=10V,ID=20A 3
Diode forward voltage VSD 1.2 V ISD=20A,VGS=0V, TJ=25°C 3
Maximum continuous drain-source diode forward current IS 80 A 3
Maximum pulsed drain-source diode forward current ISM 320 A 3
Drain-source voltage VDSS 68 V TC=25°C unless otherwise noted 2
Continuous drain current ID 80 A TC=25°C 2
Continuous drain current ID 52 A TC=100°C 2
Pulsed drain current IDM 320 A 2
Gate-source voltage VGS -25 25 V 2
Single pulse avalanche energy EAS 260 mJ 2
Power dissipation PD 125 W TC=25°C 2
Operating junction and storage temperature range TJ,TSTG -55 150 °C 2
Maximum lead temperature for soldering purposes TL 300 °C 1/8" from case for 5 seconds 2
Thermal resistance junction-case RθJC 1 ºC/W 2

CAD (KiCad official)

  • Symbol: KNB3306C
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: knb3306c-etched.step / knb3306c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); knb3306c.step / knb3306c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: KIA Semicon Tech datasheet (7 pp, sha256 f3992d89d6c91d51, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF