# JFC1206-2250FS

**Shenzhen JDT Fuse** · Disposable Fuses · 1206

JFC1206-2250FS from Shenzhen JDT Fuse, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (one end cap of the 3.20 x 1.60 mm 1206 body), non-polarized; the JFC1206-2250FS is the 25 A fast-acting rating, operating temperature -55 to 150°C. |
| 2 | 2 | passive | Fuse terminal 2 (opposite end cap of the 3.20 x 1.60 mm 1206 body), non-polarized; the JFC1206-2250FS is the 25 A fast-acting rating, operating temperature -55 to 150°C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Rated current | In |  | 25 |  | A | JFC1206-2250FS performance table row | 3 |
| Typical cold resistance |  |  | 1.6 |  | mOhms | Measured at <10% of rated current, ambient 25°C | 3 |
| Typical voltage drop |  |  | 90 |  | mV |  | 3 |
| Typical pre-arcing I2t | I2t |  | 60 |  | A2 Sec | Measured at 10In current | 3 |
| Operating temperature |  | -55 |  | 150 | °C | With proper correction factor applied | 4 |
| Preheat temperature min (Tsmin) | Tsmin | 150 |  | 200 | °C | Lead(Pb) free solder preheat and soak | 4 |
| Preheat time (Tsmin to Tsmax) | tS | 60 |  | 120 | Secs | Lead(Pb) free solder preheat and soak | 4 |
| Average ramp-up rate (Tsmax to Tp) |  |  |  | 3 | °C/Secs | Lead(Pb) free solder reflow profile | 4 |
| Liquidous temperature (TL) | TL |  | 217 |  | °C | Lead(Pb) free solder reflow profile | 4 |
| Time at liquidous (tL) | tL | 60 |  | 150 | Secs | Lead(Pb) free solder reflow profile | 4 |
| Peak package body temperature (TP) | TP |  |  | 260 | °C | Lead(Pb) free solder infrared reflow | 4 |
| Time within 5°C of classification temperature (tP) | tP |  |  | 30 | Secs | Lead(Pb) free solder reflow profile | 4 |
| Average ramp-down rate (TP to Tsmax) |  |  |  | 6 | °C/Secs | Lead(Pb) free solder reflow profile | 4 |
| Time (25°C to peak temperature) |  |  |  | 8 | Minutes | Lead(Pb) free solder reflow profile | 4 |
| Wave solder reservoir temperature |  |  |  | 260 | °C | Wave solder | 4 |
| Wave solder time in reservoir |  |  |  | 10 | Secs | Wave solder | 4 |

## CAD (KiCad official)

- Symbol: `JFC1206-2250FS`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `jfc1206-2250fs-etched.step` / `jfc1206-2250fs-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jfc1206-2250fs.step` / `jfc1206-2250fs.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JDT Fuse datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588899539097305088) (5 pp, sha256 `2d78c30f78df5149`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/jfc1206-2250fs-datasheet.pdf)