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JFC1206-2250FS

Shenzhen JDT Fuse · Disposable Fuses · 1206

JFC1206-2250FS from Shenzhen JDT Fuse, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Fuse terminal 1 (one end cap of the 3.20 x 1.60 mm 1206 body), non-polarized; the JFC1206-2250FS is the 25 A fast-acting rating, operating temperature -55 to 150°C.
2 2 passive Fuse terminal 2 (opposite end cap of the 3.20 x 1.60 mm 1206 body), non-polarized; the JFC1206-2250FS is the 25 A fast-acting rating, operating temperature -55 to 150°C.

Key specifications

Parameter Value
Manufacturer Shenzhen JDT Fuse
Package 1206
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Rated current In 25 A JFC1206-2250FS performance table row 3
Typical cold resistance 1.6 mOhms Measured at <10% of rated current, ambient 25°C 3
Typical voltage drop 90 mV 3
Typical pre-arcing I2t I2t 60 A2 Sec Measured at 10In current 3
Operating temperature -55 150 °C With proper correction factor applied 4
Preheat temperature min (Tsmin) Tsmin 150 200 °C Lead(Pb) free solder preheat and soak 4
Preheat time (Tsmin to Tsmax) tS 60 120 Secs Lead(Pb) free solder preheat and soak 4
Average ramp-up rate (Tsmax to Tp) 3 °C/Secs Lead(Pb) free solder reflow profile 4
Liquidous temperature (TL) TL 217 °C Lead(Pb) free solder reflow profile 4
Time at liquidous (tL) tL 60 150 Secs Lead(Pb) free solder reflow profile 4
Peak package body temperature (TP) TP 260 °C Lead(Pb) free solder infrared reflow 4
Time within 5°C of classification temperature (tP) tP 30 Secs Lead(Pb) free solder reflow profile 4
Average ramp-down rate (TP to Tsmax) 6 °C/Secs Lead(Pb) free solder reflow profile 4
Time (25°C to peak temperature) 8 Minutes Lead(Pb) free solder reflow profile 4
Wave solder reservoir temperature 260 °C Wave solder 4
Wave solder time in reservoir 10 Secs Wave solder 4

CAD (KiCad official)

  • Symbol: JFC1206-2250FS
  • Footprint: Fuse:Fuse_1206_3216Metric
  • 3D model: 1206 (KiCad packages3D, STEP)
  • 3D model files: jfc1206-2250fs-etched.step / jfc1206-2250fs-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jfc1206-2250fs.step / jfc1206-2250fs.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shenzhen JDT Fuse datasheet (5 pp, sha256 2d78c30f78df5149, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF