# JEB05DFA

**Jiangsu JieJie Microelectronics** · ESD Protection Devices · DFN1006-2L

JEB05DFA from Jiangsu JieJie Microelectronics, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Pin 1 | passive | One of the two terminals of the bi-directional TVS diode that protects a single I/O line, rated for a reverse working voltage of 5.0 V and a clamping voltage of 12 V max at IPP = 7 A (8/20 µs); the text does not state which terminal is the I/O line and which is the reference. |
| 2 | 2 | passive | The other of the two terminals of the bi-directional TVS diode that protects a single I/O line, rated for a reverse working voltage of 5.0 V and a clamping voltage of 12 V max at IPP = 7 A (8/20 µs); the text does not state which terminal is the I/O line and which is the reference. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu JieJie Microelectronics |
| Package | DFN1006-2L |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse breakdown voltage | VBR | 5.6 | 7 | 8.5 | V | IT=1mA | 2 |
| Peak pulse power dissipation on 8/20μs waveform | PPP |  |  | 60 | W | 8/20μs waveform | 1 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Air) | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -30 |  | 30 | kV | ESD per IEC 61000-4-2 (Contact) | 1 |
| Lead soldering temperature | TL |  |  | 260 | ℃ | 10 sec. | 1 |
| Operating junction temperature range | TJ | -55 |  | 125 | ℃ |  | 1 |
| Storage temperature range | TSTG | -55 |  | 150 | ℃ |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | polyester |  | The cover tape is a multilayer film(heat activated adhesive in nature)primarily composed of polyester film, adhesive | 5 |

## CAD (KiCad official)

- Symbol: `JEB05DFA`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files: `jeb05dfa-etched.step` / `jeb05dfa-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jeb05dfa.step` / `jeb05dfa.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Jiangsu JieJie Microelectronics datasheet](docs/jeb05dfa-datasheet.pdf) (6 pp, sha256 `01c0c76fbdd4e7cf`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/jeb05dfa-datasheet.pdf)