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JEB05DFA

Jiangsu JieJie Microelectronics · ESD Protection Devices · DFN1006-2L

JEB05DFA from Jiangsu JieJie Microelectronics, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin 1 passive One of the two terminals of the bi-directional TVS diode that protects a single I/O line, rated for a reverse working voltage of 5.0 V and a clamping voltage of 12 V max at IPP = 7 A (8/20 µs); the text does not state which terminal is the I/O line and which is the reference.
2 2 passive The other of the two terminals of the bi-directional TVS diode that protects a single I/O line, rated for a reverse working voltage of 5.0 V and a clamping voltage of 12 V max at IPP = 7 A (8/20 µs); the text does not state which terminal is the I/O line and which is the reference.

Key specifications

Parameter Value
Manufacturer Jiangsu JieJie Microelectronics
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse breakdown voltage VBR 5.6 7 8.5 V IT=1mA 2
Peak pulse power dissipation on 8/20μs waveform PPP 60 W 8/20μs waveform 1
ESD per IEC 61000-4-2 (Air) VESD -30 30 kV ESD per IEC 61000-4-2 (Air) 1
ESD per IEC 61000-4-2 (Contact) VESD -30 30 kV ESD per IEC 61000-4-2 (Contact) 1
Lead soldering temperature TL 260 ℃ 10 sec. 1
Operating junction temperature range TJ -55 125 ℃ 1
Storage temperature range TSTG -55 150 ℃ 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing polyester The cover tape is a multilayer film(heat activated adhesive in nature)primarily composed of polyester film, adhesive 5

CAD (KiCad official)

  • Symbol: JEB05DFA
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: jeb05dfa-etched.step / jeb05dfa-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jeb05dfa.step / jeb05dfa.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu JieJie Microelectronics datasheet (6 pp, sha256 01c0c76fbdd4e7cf, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF