IXYS IXTP15N50L2 LinearL2 N-channel MOSFET

{
  "units": "mm",
  "source": "IXYS DS100054B (12/11), page 2, TO-220 Outline",
  "limits": {
    "A": [
      4.32,
      4.83
    ],
    "b": [
      0.64,
      1.02
    ],
    "b1": [
      1.15,
      1.65
    ],
    "c": [
      0.35,
      0.56
    ],
    "D": [
      14.73,
      16.0
    ],
    "E": [
      9.91,
      10.66
    ],
    "e": [
      2.54,
      2.54
    ],
    "F": [
      1.14,
      1.4
    ],
    "H1": [
      5.85,
      6.85
    ],
    "J1": [
      2.29,
      2.79
    ],
    "k": [
      0,
      0.38
    ],
    "L": [
      12.7,
      13.97
    ],
    "L1": [
      2.79,
      5.84
    ],
    "P": [
      3.53,
      4.08
    ],
    "Q": [
      2.54,
      3.18
    ]
  },
  "nominalMidpoints": {
    "A": 4.575,
    "b": 0.8300000000000001,
    "b1": 1.4,
    "c": 0.455,
    "D": 15.365,
    "E": 10.285,
    "e": 2.54,
    "F": 1.27,
    "H1": 6.35,
    "J1": 2.54,
    "k": 0.19,
    "L": 13.335,
    "L1": 4.3149999999999995,
    "P": 3.8049999999999997,
    "Q": 2.8600000000000003
  },
  "coordinateFrame": "Z upward along straight package; body bottom Z=0; molded front faces -Y so G/D/S read left-to-right from front; full untrimmed leads below Z=0; pin centres X=0,2.54,5.08 Y=0",
  "limitations": [
    "Original independent nominal envelope, not manufacturer CAD",
    "Unspecified mold taper, edge radii and mold split omitted",
    "Lead shoulders are simplified rectangular envelopes",
    "No lead bend or board seating height is prescribed by this model",
    "No manufacturer markings or internal die represented",
    "Horizontal formed-lead footprint requires a separate pose and forming verification"
  ]
}