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Contents

README

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IXGP48N60A3

Littelfuse/IXYS · IGBTs · TO-220

IXGP48N60A3 from Littelfuse/IXYS, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; the datasheet rates VGES at ±20V continuous and VGEM at ±30V transient, with VGE(th) of 3.0 to 5.5V.
2 C passive Collector terminal, also connected to the mounting tab; rated VCES 600V with IC25 of 120A at TC = 25°C.
3 E passive Emitter terminal, the reference for gate drive and collector-emitter voltage.

Key specifications

Parameter Value
Manufacturer Littelfuse/IXYS
Package TO-220
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-emitter breakdown voltage BVCES 600 V IC = 250μA, VGE = 0V 1
Gate-emitter threshold voltage VGE(th) 3 5.5 V IC = 250μA, VCE = VGE 1
Collector cut-off current ICES 25 μA VCE = VCES, VGE = 0V 1
Collector cut-off current ICES 250 μA TJ = 125°C 1
Gate-emitter leakage current IGES -100 100 nA VCE = 0V, VGE = ±20V 1
Collector-emitter saturation voltage VCE(sat) 1.18 1.35 V IC = 32A, VGE = 15V, Note 1 1
Forward transconductance gfs 30 48 S IC = 32A, VCE = 10V, Note 1 2
Collector-emitter voltage VCES 600 V TJ = 25°C to 150°C 1
Collector-gate voltage VCGR 600 V TJ = 25°C to 150°C, RGE = 1MΩ 1
Gate-emitter voltage, continuous VGES -20 20 V Continuous 1
Gate-emitter voltage, transient VGEM -30 30 V Transient 1
Collector current, continuous IC25 120 A TC = 25°C 1
Collector current, continuous IC110 48 A TC = 110°C 1
Collector current, pulsed ICM 300 A TC = 25°C, 1ms 1
Reverse-bias safe operating area current SSOA (RBSOA) 96 A VGE = 15V, TVJ = 125°C, RG = 5Ω, Clamped Inductive Load, VCE ≤ VCES 1
Total power dissipation PC 300 W TC = 25°C 1
Operating junction temperature TJ -55 150 °C 1
Maximum junction temperature TJM 150 °C 1
Storage temperature Tstg -55 150 °C 1
Maximum lead temperature for soldering TL 300 °C 1
Solder temperature TSOLD 260 °C 1.6 mm (0.062in.) from case for 10s 1
Thermal resistance, junction to case RthJC 0.42 °C/W 2
Thermal resistance, case to heatsink RthCK 0.5 °C/W TO-220 2
Input capacitance Cies 3190 pF 2
Output capacitance Coes 175 pF VCE = 25V, VGE = 0V, f = 1MHz 2
Reverse transfer capacitance Cres 43 pF 2
Total gate charge Qg 110 nC 2
Gate-emitter charge Qge 21 nC IC = 32A, VGE = 15V, VCE = 0.5 • VCES 2
Gate-collector charge Qgc 42 nC 2
Turn-on delay time td(on) 25 ns Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Current rise time tri 30 ns Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-on switching energy loss Eon 0.95 mJ Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-off delay time td(off) 334 ns Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Current fall time tfi 224 ns Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-off switching energy loss Eoff 2.9 mJ Inductive load, TJ = 25°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-on delay time td(on) 24 ns Inductive load, TJ = 125°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-on switching energy loss Eon 1.97 mJ Inductive load, TJ = 125°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-off delay time td(off) 545 ns Inductive load, TJ = 125°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Current fall time tfi 380 ns Inductive load, TJ = 125°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2
Turn-off switching energy loss Eoff 5.6 mJ Inductive load, TJ = 125°C; IC = 32A, VGE = 15V; VCE = 480V, RG = 5Ω; Note 2 2

CAD (KiCad official)

  • Symbol: IXGP48N60A3
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: ixgp48n60a3-etched.step / ixgp48n60a3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixgp48n60a3.step / ixgp48n60a3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse/IXYS datasheet (7 pp, sha256 541843affa46d0e8, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF