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IXFP22N65X2M

IXYS · MOSFETs · TO-220

IXFP22N65X2M from IXYS, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal; continuous VGSS is limited to 30 V and transient VGSM to 40 V per the maximum ratings.
2 Drain passive Drain terminal; VDSS is 650 V and ID25 is 22 A at TC = 25°C, limited by TJM.
3 Source passive Source terminal; repetitive pulse source-drain current ISM is 88 A, limited by TJM.

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-220
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage BVDSS 650 V VGS = 0V, ID = 250µA 1
Gate threshold voltage VGS(th) 3.5 5 V VDS = VGS, ID = 1.5mA 1
Gate-source leakage current IGSS 100 nA VGS = 30V, VDS = 0V 1
Zero gate voltage drain current IDSS 10 A VDS = VDSS, VGS = 0V 1
Zero gate voltage drain current at TJ=125C IDSS 1.5 mA TJ = 125C 1
Static drain-source on resistance RDS(on) 145 mΩ VGS = 10V, ID = 11A, Note 1 1
Forward transconductance gfs 8 22 S VDS = 10V, ID = 11A, Note 1 2
Continuous source current IS 22 A VGS = 0V 2
Pulsed source current ISM 88 A Repetitive, Pulse Width Limited by TJM 2
Diode forward voltage VSD 1.4 V IF = IS, VGS = 0V, Note 1 2
Thermal resistance junction to case RthJC 3.37 C/W 2
Thermal resistance case to sink RthCS 0.5 C/W 2
Drain-source voltage VDSS 650 V TJ = 25C to 150C 1
Drain-gate voltage VDGR 650 V TJ = 25C to 150C, RGS = 1M 1
Continuous gate-source voltage VGSS 30 V Continuous 1
Transient gate-source voltage VGSM 40 V Transient 1
Continuous drain current ID25 22 A TC = 25C, Limited by TJM 1
Pulsed drain current IDM 44 A TC = 25C, Pulse Width Limited by TJM 1
Avalanche current IA 5 A TC = 25C 1
Single pulse avalanche energy EAS 1 J TC = 25C 1
Peak diode recovery dv/dt dv/dt 50 V/ns IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C 1
Total power dissipation PD 37 W TC = 25C 1
Operating junction temperature TJ -55 150 C 1
Maximum junction temperature TJM 150 C 1
Storage temperature Tstg -55 150 C 1
Maximum lead temperature for soldering TL 300 °C Maximum Lead Temperature for Soldering 1
Maximum lead temperature for soldering (case) TSOLD 260 °C 1.6 mm (0.062in.) from Case for 10s 1
Isolation voltage VISOL 2500 V~ 50/60 Hz, 1 Minute 1
Reverse recovery time trr 145 ns 2
Reverse recovery charge QRM 890 nC 2
Reverse recovery current IRM 12 A 2
Gate input resistance RGi 1 Ω 2
Input capacitance Ciss 2190 pF 2
Output capacitance Coss 1450 pF VGS = 0V, VDS = 25V, f = 1MHz 2
Reverse transfer capacitance Crss 1.3 pF 2
Effective output capacitance, energy related Co(er) 92 pF 2
Effective output capacitance, time related Co(tr) 330 pF 2
Turn-on delay time td(on) 30 ns 2
Rise time tr 37 ns 2
Turn-off delay time td(off) 42 ns 2
Fall time tf 18 ns 2
Total gate charge Qg(on) 37 nC 2
Gate-source charge Qgs 12 nC VGS = 10V, VDS = 0.5 • VDSS, ID = 11A 2
Gate-drain charge Qgd 14 nC VGS = 10V, VDS = 0.5 • VDSS, ID = 11A 2

CAD (KiCad official)

  • Symbol: IXFP22N65X2M
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: ixfp22n65x2m-etched.step / ixfp22n65x2m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixfp22n65x2m.step / ixfp22n65x2m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (6 pp, sha256 a89b356805c04cd2, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF