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ISP452HUMA1
Public Made by Adomby adom
Infineon Technologies Power Distribution Switches, SOT-223-4. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISP452HUMA1
Infineon Technologies · Power Distribution Switches · SOT-223-4
ISP452HUMA1 from Infineon Technologies, in a SOT-223-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Protected high-side power output; leakage current is 2 µA typ and 5 µA max at Vin low and Tj = -40...+25 °C (7 µA at Tj = 150 °C), and the current limit is 0.7 to 2.4 A. |
| 2 | GND | power_in | Logic ground; operating current IGND is 1 mA typ and 1.6 mA max at Vin = 5 V. |
| 3 | IN | input | Input that activates the power switch on a logical high signal; allowable input voltage range is -3.0 V to Vbb, with input current limited to ±5 mA. |
| 4 | Vbb | power_in | Positive power supply voltage; operating voltage range is 5.0 V to 34 V, with a 40 V maximum supply voltage rating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOT-223-4 |
| Category | Power Management (PMIC) |
| Pins | 4 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | Vbb | 40 | V | 3 | |||
| Maximum input voltage | VIN | -5 | V | Upper limit printed as Vbb | 3 | ||
| Maximum input current | IIN | -5 | 5 | mA | At VIN > Vbb | 3 | |
| Inductive load switch-off energy dissipation, single pulse | EAS | 0.5 | J | IL = 0.5 A, Tj,start = 150°C (not tested, specified by design) | 3 | ||
| Load dump protection | VLoad dump | 60 | V | RI=2 Ω, td=400ms, IN= low or high, UA= 13.5 V, RL= 24 Ω (not tested, specified by design) | 3 | ||
| Load dump protection | VLoad dump | 80 | V | RI=2 Ω, td=400ms, IN= low or high, UA= 13.5 V, RL= 80 Ω (not tested, specified by design) | 3 | ||
| Electrostatic discharge capability (PIN 3) | VESD | -1 | 1 | kV | PIN 3 (HBM) | 3 | |
| Electrostatic discharge capability (PIN 1,2,4) | VESD | -2 | 2 | kV | PIN 1,2,4 (HBM) | 3 | |
| Junction temperature | Tj | 150 | °C | 3 | |||
| Operating temperature range | Ta | -30 | 85 | °C | 3 | ||
| Storage temperature range | Tstg | -40 | 105 | °C | 3 | ||
| Max. power dissipation (DC) | Ptot | 1.8 | W | TA = 25 °C | 3 | ||
| Thermal resistance chip - soldering point | RthJS | 7 | K/W | chip - soldering point | 3 | ||
| Thermal resistance chip - ambient | RthJA | 70 | K/W | Device on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection | 3 | ||
| On-state resistance (pin 4 to 1) | RON | 0.16 | 0.2 | Ω | IL = 0.5 A, Vin = high, Tj = 25°C | 4 | |
| On-state resistance (pin 4 to 1) | RON | 0.4 | Ω | IL = 0.5 A, Vin = high, Tj = 150°C | 4 | ||
| Nominal load current (pin 4 to 1) | IL(ISO) | 0.7 | A | ISO Standard: VON = Vbb - VOUT = 0.5 V, TS = 85 °C | 4 | ||
| Turn-on time to 90% VOUT | ton | 60 | 100 | µs | RL = 24 Ω | 4 | |
| Turn-off time to 10% VOUT | toff | 60 | 150 | µs | RL = 24 Ω | 4 | |
| Slew rate on | dV/dton | 2 | 4 | V/µs | 10 to 30% VOUT, RL = 24 Ω | 4 | |
| Slew rate off | -dV/dtoff | 2 | 4 | V/µs | 70 to 40% VOUT, RL = 24 Ω | 4 | |
| Allowable input voltage range (pin 3 to 2) | VIN | -3 | V | Pin 3 to 2; upper limit printed as Vbb | 4 | ||
| Input turn-on threshold voltage | VIN(T+) | 3.5 | V | Tj = -40...+150°C | 4 | ||
| Input turn-off threshold voltage | VIN(T-) | 1.5 | V | Tj = -40...+150°C | 4 | ||
| Input threshold hysteresis | ∆VIN(T) | 0.5 | V | 4 | |||
| Off state input current (pin 3) | IIN(off) | 10 | 60 | µA | VIN(off) = 1.2 V, Tj = -40...+150°C | 4 | |
| On state input current (pin 3) | IIN(on) | 10 | 100 | µA | VIN(on) = 3.0 V to Vbb, Tj = -40...+150°C | 4 | |
| Input resistance | RIN | 1.5 | 2.8 | 3.5 | kΩ | 4 | |
| Operating voltage | Vbb(on) | 5 | 34 | V | Tj = -40...+150°C | 5 | |
| Undervoltage shutdown | Vbb(under) | 3.5 | 5 | V | Tj = -40...+150°C | 5 | |
| Undervoltage restart | Vbb(u rst) | 6.5 | V | Tj = -40...+25°C | 5 | ||
| Undervoltage restart | Vbb(u rst) | 7 | V | Tj = +150°C | 5 | ||
| Undervoltage restart of charge pump | Vbb(ucp) | 5.6 | 7 | V | see diagram page 9 | 5 | |
| Undervoltage hysteresis | ∆Vbb(under) | 0.3 | V | ∆Vbb(under) = Vbb(u rst) - Vbb(under) | 5 | ||
| Overvoltage shutdown | Vbb(over) | 34 | 42 | V | Tj = -40...+150°C | 5 | |
| Overvoltage restart | Vbb(o rst) | 33 | V | Tj = -40...+150°C | 5 | ||
| Overvoltage hysteresis | ∆Vbb(over) | 0.7 | V | Tj = -40...+150°C | 5 | ||
| Standby current (pin 4) | Ibb(off) | 10 | 25 | µA | Vin = low, Tj = -40...+150°C | 5 | |
| Operating current (pin 2) | IGND | 1 | 1.6 | mA | Vin = 5 V | 5 | |
| Leakage current (pin 1) | IL(off) | 2 | 5 | µA | Vin = low, Tj = -40...+25°C | 5 | |
| Leakage current (pin 1) | IL(off) | 7 | µA | Vin = low, Tj = 150°C | 5 | ||
| Current limit (pin 4 to 1) | IL(SC) | 0.7 | 1.5 | 2 | A | Tj = 25°C, Vbb = 20V | 6 |
| Current limit (pin 4 to 1) | IL(SC) | 0.7 | 2.4 | A | Tj = -40...+150°C, Vbb = 20V | 6 | |
| Overvoltage protection | Vbb(AZ) | 41 | V | Ibb = 4mA, Tj = -40...+150°C | 6 | ||
| Output clamp (ind. load switch off) | VON(CL) | 41 | 47 | V | VOUT=Vbb-VON(CL), Ibb = 4mA | 6 | |
| Thermal overload trip temperature | Tjt | 150 | °C | 6 | |||
| Thermal hysteresis | ∆Tjt | 10 | K | 6 | |||
| Inductive load switch-off energy dissipation | EAS | 0.5 | J | Tj, start = 150 °C, single pulse, IL = 0.5 A, Vbb = 12 V (not tested, specified by design) | 6 | ||
| Reverse battery (pin 4 to 2) | -Vbb | 30 | V | Requires 150 Ω resistor in GND connection (not tested, specified by design) | 6 |
CAD (KiCad official)
- Symbol:
ISP452HUMA1 - Footprint:
Package_TO_SOT_SMD:SOT-223 - 3D model: SOT-223-4 (KiCad packages3D, STEP)
- 3D model files:
isp452huma1-etched.step/isp452huma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);isp452huma1.step/isp452huma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (10 pp, sha256
7340e8b1352f272f, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).