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Ray Publish 0.1.0 3f0bdca 19d ago

ISO7820DWR

Texas Instruments · Digital Isolators · SOIC-16-300mil

ISO7820DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND1 power_in Ground connection for VCC1; voltages on the input side are referenced to this local ground (GND1).
2 NC unconnected Not connected (未连接) on the DW package.
3 VCC1 power_in Power supply for side 1 (input side), specified from 2.25 V to 5.5 V.
4 INA input Input, channel A; logic high requires at least 0.7 × VCCI and logic low at most 0.3 × VCCI.
5 INB input Input, channel B; logic high requires at least 0.7 × VCCI and logic low at most 0.3 × VCCI.
6 NC unconnected Not connected (未连接) on the DW package.
7 GND1 power_in Ground connection for VCC1; voltages on the input side are referenced to this local ground (GND1).
8 NC unconnected Not connected (未连接) on the DW package.
9 GND2 power_in Ground connection for VCC2; output-side voltages are referenced to this local ground (GND2).
10 NC unconnected Not connected (未连接) on the DW package.
11 NC unconnected Not connected (未连接) on the DW package.
12 OUTB output Output, channel B; recommended output current is 4 mA sink / -4 mA source at VCCO = 5 V, 2 mA / -2 mA at 3.3 V, and 1 mA / -1 mA at 2.5 V.
13 OUTA output Output, channel A; recommended output current is 4 mA sink / -4 mA source at VCCO = 5 V, 2 mA / -2 mA at 3.3 V, and 1 mA / -1 mA at 2.5 V.
14 VCC2 power_in Power supply for side 2 (output side), specified from 2.25 V to 5.5 V.
15 NC unconnected Not connected (未连接) on the DW package.
16 GND2 power_in Ground connection for VCC2; output-side voltages are referenced to this local ground (GND2).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16-300mil
Category Signal Isolation Devices
Pins 16

CAD (KiCad official)

  • Symbol: ISO7820DWR
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16-300mil (KiCad packages3D, STEP)
  • 3D model files: iso7820dwr-etched.step / iso7820dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7820dwr.step / iso7820dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (38 pp, sha256 6e44e42902962d6d, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF