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Generated by kicad-footprint-generator · KiCad file format 20260206

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ISO7820DWR

Texas Instruments · Digital Isolators · SOIC-16-300mil

ISO7820DWR from Texas Instruments, in a SOIC-16-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	GND1	power_in	Ground connection for VCC1; voltages on the input side are referenced to this local ground (GND1).
2	NC	unconnected	Not connected (未连接) on the DW package.
3	VCC1	power_in	Power supply for side 1 (input side), specified from 2.25 V to 5.5 V.
4	INA	input	Input, channel A; logic high requires at least 0.7 × VCCI and logic low at most 0.3 × VCCI.
5	INB	input	Input, channel B; logic high requires at least 0.7 × VCCI and logic low at most 0.3 × VCCI.
6	NC	unconnected	Not connected (未连接) on the DW package.
7	GND1	power_in	Ground connection for VCC1; voltages on the input side are referenced to this local ground (GND1).
8	NC	unconnected	Not connected (未连接) on the DW package.
9	GND2	power_in	Ground connection for VCC2; output-side voltages are referenced to this local ground (GND2).
10	NC	unconnected	Not connected (未连接) on the DW package.
11	NC	unconnected	Not connected (未连接) on the DW package.
12	OUTB	output	Output, channel B; recommended output current is 4 mA sink / -4 mA source at VCCO = 5 V, 2 mA / -2 mA at 3.3 V, and 1 mA / -1 mA at 2.5 V.
13	OUTA	output	Output, channel A; recommended output current is 4 mA sink / -4 mA source at VCCO = 5 V, 2 mA / -2 mA at 3.3 V, and 1 mA / -1 mA at 2.5 V.
14	VCC2	power_in	Power supply for side 2 (output side), specified from 2.25 V to 5.5 V.
15	NC	unconnected	Not connected (未连接) on the DW package.
16	GND2	power_in	Ground connection for VCC2; output-side voltages are referenced to this local ground (GND2).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SOIC-16-300mil
Category	Signal Isolation Devices
Pins	16

CAD (KiCad official)

Symbol: ISO7820DWR
Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
3D model: SOIC-16-300mil (KiCad packages3D, STEP)
3D model files: iso7820dwr-etched.step / iso7820dwr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso7820dwr.step / iso7820dwr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (38 pp, sha256 6e44e42902962d6d, retrieved 2026-10-11, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF