# ISO1050

**Texas Instruments** · CAN Transceiver · SOIC-8

The ISO1050 is a galvanically isolated high-speed CAN transceiver that combines a CAN physical-layer driver/receiver with a silicon-dioxide isolation barrier. The barrier separates the controller side from the bus side, breaking ground loops and protecting the logic from bus faults and high common-mode voltages, common in industrial and automotive networks.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Digital-side supply voltage (3 V to 5.5 V). Powers the logic-side interface (RXD/TXD). |
| 2 | RXD | output | CAN receive data output: LOW for dominant bus state, HIGH for recessive bus state. Referenced to VCC1/GND1. |
| 3 | TXD | input | CAN transmit data input: LOW drives a dominant bus state, HIGH allows recessive. Contains an internal pull-up; the driver has a dominant time-out (TXD). |
| 4 | GND1 | power_in | Digital-side ground connection. Reference for VCC1 and the logic-side signals. |
| 5 | GND2 | power_in | Transceiver-side (bus-side) ground connection. Isolated from GND1 by the silicon-dioxide barrier. |
| 6 | CANL | bidirectional | Low-level CAN bus line. Driven low in dominant state, high-Z (biased near VCC2/2) in recessive. Common-mode range -12 V to 12 V, protected to -27 V to 40 V. |
| 7 | CANH | bidirectional | High-level CAN bus line. Driven high in dominant state, high-Z (biased near VCC2/2) in recessive. Common-mode range -12 V to 12 V, protected to -27 V to 40 V. |
| 8 | VCC2 | power_in | Transceiver-side supply voltage (5 V nominal, 4.5 V to 5.5 V). Powers the CAN bus driver/receiver. |

## Key specifications

| Parameter | Value |
|---|---|
| Type | Isolated high-speed CAN transceiver |
| Isolation | Galvanic (SiO2 barrier), 2500 Vrms |
| Data rate | Up to 1 Mbps |
| Supply voltage | 3.3 V or 5 V (both sides) |
| Bus pins | CANH / CANL |
| Standards | ISO 11898-2 |
| Operating temperature | -55 C to 105 C |

## Ordering variants

Same part, different packaging or reel option.

- `ISO1050DW`
- `ISO1050DWR`
- `ISO1050DUB`
- `ISO1050DUBR`

## CAD (KiCad official)

- Symbol: `iso1050.kicad_sym`
- Footprint: `iso1050.kicad_mod`
- 3D model: SOIC-8 body from KiCad `Package_SO/SOIC-8_3.9x4.9mm_P1.27mm`.
- 3D model files: `iso1050-etched.step` / `iso1050-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `iso1050.step` / `iso1050.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/iso1050.pdf) (42 pp, sha256 `e91f89be4f979392`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/iso1050-datasheet.pdf)