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ISO1050 Isolated CAN Transceiver

Public Made by Adom

by adom

Galvanically isolated high-speed CAN transceiver with a built-in isolation barrier.

cantransceiverisolatedgalvanic-isolationinterfacetisoic-8
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Datasheet

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Contents

README

markdown

ISO1050

Texas Instruments · CAN Transceiver · SOIC-8

The ISO1050 is a galvanically isolated high-speed CAN transceiver that combines a CAN physical-layer driver/receiver with a silicon-dioxide isolation barrier. The barrier separates the controller side from the bus side, breaking ground loops and protecting the logic from bus faults and high common-mode voltages, common in industrial and automotive networks.

Pinout

Pin Name Type Function
1 VCC1 power_in Digital-side supply voltage (3 V to 5.5 V). Powers the logic-side interface (RXD/TXD).
2 RXD output CAN receive data output: LOW for dominant bus state, HIGH for recessive bus state. Referenced to VCC1/GND1.
3 TXD input CAN transmit data input: LOW drives a dominant bus state, HIGH allows recessive. Contains an internal pull-up; the driver has a dominant time-out (TXD).
4 GND1 power_in Digital-side ground connection. Reference for VCC1 and the logic-side signals.
5 GND2 power_in Transceiver-side (bus-side) ground connection. Isolated from GND1 by the silicon-dioxide barrier.
6 CANL bidirectional Low-level CAN bus line. Driven low in dominant state, high-Z (biased near VCC2/2) in recessive. Common-mode range -12 V to 12 V, protected to -27 V to 40 V.
7 CANH bidirectional High-level CAN bus line. Driven high in dominant state, high-Z (biased near VCC2/2) in recessive. Common-mode range -12 V to 12 V, protected to -27 V to 40 V.
8 VCC2 power_in Transceiver-side supply voltage (5 V nominal, 4.5 V to 5.5 V). Powers the CAN bus driver/receiver.

Key specifications

Parameter Value
Type Isolated high-speed CAN transceiver
Isolation Galvanic (SiO2 barrier), 2500 Vrms
Data rate Up to 1 Mbps
Supply voltage 3.3 V or 5 V (both sides)
Bus pins CANH / CANL
Standards ISO 11898-2
Operating temperature -55 C to 105 C

Ordering variants

Same part, different packaging or reel option.

  • ISO1050DW
  • ISO1050DWR
  • ISO1050DUB
  • ISO1050DUBR

CAD (KiCad official)

  • Symbol: iso1050.kicad_sym
  • Footprint: iso1050.kicad_mod
  • 3D model: SOIC-8 body from KiCad Package_SO/SOIC-8_3.9x4.9mm_P1.27mm.
  • 3D model files: iso1050-etched.step / iso1050-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iso1050.step / iso1050.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 e91f89be4f979392, retrieved 2026-08-17, tier: manufacturer)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF