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Contents

README

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ISL43485IBZ

RENESAS · Pre-ordered Chips · SOIC-8

ISL43485IBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high if A > B by at least 0.2V, low if A < B by 0.2V or more, and high if A and B are unconnected (floating).
2 RE input Receiver output enable: RO is enabled when RE is low and is high impedance when RE is high.
3 DE input Driver output enable: the driver outputs Y and Z are enabled by bringing DE high and are high impedance when DE is low.
4 DI input Driver input: a low on DI forces output Y low and output Z high, and a high on DI forces output Y high and output Z low.
5 GND power_in Ground connection.
6 A/Y bidirectional Noninverting receiver input and noninverting driver output; it is an input when DE = 0 and an output when DE = 1.
7 B/Z bidirectional Inverting receiver input and inverting driver output; it is an input when DE = 0 and an output when DE = 1.
8 VCC power_in System power supply input, specified for 3V to 3.6V.

Key specifications

Parameter Value
Manufacturer RENESAS
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC to Ground 7 V 3
Input voltages DI, DE, RE -0.5 7 V 3
Input/output voltages A/Y, B/Z -8 12.5 V 3
Operating temperature range -40 85 °C 3
Maximum junction temperature (plastic package) 150 °C 3
Maximum storage temperature range -65 150 °C 3
Maximum lead temperature (soldering 10s, lead tips only) 300 °C Soldering 10s (lead tips only) 3
Driver differential VOUT (with load), RL = 100Ω (RS-422) VOD2 2 2.7 V RL = 100Ω (RS-422) (Figure 1A) 3
Driver differential VOUT (with load), RL = 54Ω (RS-485) VOD2 1.5 2.3 V RL = 54Ω (RS-485) (Figure 1A) 3
Driver differential VOUT (with load), RL = 60Ω, common-mode load VOD2 1.5 2.6 V RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B) 3
Change in magnitude of driver differential VOUT for complementary output states VOD 0.01 0.2 V RL = 54Ω or 100Ω (Figure 1A) 3
Driver common-mode VOUT VOC 1.8 3 V RL = 54Ω or 100Ω (Figure 1A) 3
Change in magnitude of driver common-mode VOUT for complementary output states VOC 0.01 0.2 V RL = 54Ω or 100Ω (Figure 1A) 3
Logic input high voltage VIH 2 V DE, DI, RE 3
Logic input low voltage VIL 0.8 V DE, DI, RE 3
Logic input current (DE, DI) IIN1 -2 2 µA DE, DI 3
Logic input current (RE) IIN1 -25 25 µA RE 3
Input current (A/Y, B/Z) IIN2 0.6 1 mA DE = 0V, VCC = 0V or 3.6V, VIN = 12V 3
Input current (A/Y, B/Z) IIN2 -0.3 -0.8 mA VIN = -7V 3
Receiver differential threshold voltage VTH -0.2 0.2 V -7V ≤ VCM ≤ 12V 3
Receiver output low voltage VOL 0.4 V IO = -4mA, VID = 200mV 3
Three-state (high impedance) receiver output current IOZR -1 1 µA 0.4V ≤ VO ≤ 2.4V 4
Receiver input resistance RIN 12 19 kΩ -7V ≤ VCM ≤ 12V 4
No-load supply current ICC 0.75 1.2 mA DI = 0V or VCC; DE = VCC, RE = 0V or VCC 4
No-load supply current ICC 0.65 1 mA DE = 0V, RE = 0V 4
Shutdown supply current ISHDN 15 100 nA DE = 0V, RE = VCC, DI = 0V or VCC 4
Driver short-circuit current, VO = high or low IOSD1 250 mA DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 7) 4
Receiver short-circuit current IOSR 8 60 mA 0V ≤ VO ≤ VCC 4
Maximum data rate (driver) fMAX 30 50 Mbps (Figure 2A) 4
Driver differential output delay tDD 3 10 25 ns RDIFF = 60Ω, CL = 15pF (Figure 2A) 4
Driver differential rise or fall time tR, tF 3 6 12 ns RDIFF = 60Ω, CL = 15pF (Figure 2A) 4
Driver input to output delay tPLH, tPHL 6 10 22 ns RL = 27Ω, CL = 15pF (Figure 2C) 4
Driver output skew tSKEW 1 5 ns RL = 27Ω, CL = 15pF (Figure 2C) 4
Driver enable to output high tZH 45 90 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 3), (Note 8) 4
Driver enable to output low tZL 45 90 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 3), (Note 8) 4
Driver disable from output high tHZ 60 90 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 3) 4
Driver disable from output low tLZ 70 100 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 3) 4
Driver enable from shutdown to output high tZH(SHDN) 115 150 ns RL = 110Ω, CL = 50pF, SW = GND (Figure 3), (Notes 10, 11) 4
Driver enable from shutdown to output low tZL(SHDN) 115 150 ns RL = 110Ω, CL = 50pF, SW = VCC (Figure 3), (Notes 10, 11) 4
Maximum data rate (receiver) fMAX 27 35 Mbps VID ≥ 1.5V with tr/tf = 10ns, RO tH & tL ≥ 60% tUI (Figure 4) 4
Receiver input to output delay tPLH, tPHL 25 45 80 ns (Figure 4) 4
Receiver skew /tPLH - tPHL/ tSKD 2 12 ns (Figure 4) 4
Receiver enable to output high tZH 11 25 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 5), (Note 9) 4
Receiver enable to output low tZL 11 25 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5), (Note 9) 4
Receiver disable from output high tHZ 7 20 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 5) 4
Receiver disable from output low tLZ 7 20 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5) 5
Time to shutdown tSHDN 80 190 300 ns (Note 10) 5
Receiver enable from shutdown to output high tZH(SHDN) 240 400 ns RL = 1kΩ, CL = 15pF, SW = GND (Figure 5), (Notes 10, 12) 5
Receiver enable from shutdown to output low tZL(SHDN) 240 400 ns RL = 1kΩ, CL = 15pF, SW = VCC (Figure 5), (Notes 10, 12) 5
Thermal resistance, junction to ambient (8 Ld SOIC) JA 170 °C/W 8 Ld SOIC package, typical (Note 4) 3

CAD (KiCad official)

  • Symbol: ISL43485IBZ
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: isl43485ibz-etched.step / isl43485ibz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl43485ibz.step / isl43485ibz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: RENESAS datasheet (13 pp, sha256 865b85e99da3f01d, retrieved 2026-10-29, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF