# ISL3159EFBZ

**RENESAS** · Pre-ordered Chips · SOIC-8

ISL3159EFBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver output: RO is high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high when A and B are floating, shorted, or connected to a terminated bus that is undriven. |
| 2 | RE | input | Receiver output enable: RO is enabled when RE is low and is high impedance when RE is high; connect RE directly to GND if the Rx enable function is not required. |
| 3 | DE | input | Driver output enable: outputs Y and Z are enabled when DE is high and are high impedance when DE is low; if the Tx enable function is not required, connect DE to VCC through a 1kΩ or greater resistor. |
| 4 | DI | input | Driver input: a low on DI forces output Y low and Z high, and a high on DI forces Y high and Z low. |
| 5 | GND | power_in | Ground connection. |
| 6 | A/Y | bidirectional | ±15kV IEC61000 ESD protected RS-485/422 level pin: noninverting receiver input (A) when DE = 0 and noninverting driver output (Y) when DE = 1. |
| 7 | B/Z | bidirectional | ±15kV IEC61000 ESD protected RS-485/422 level pin: inverting receiver input (B) when DE = 0 and inverting driver output (Z) when DE = 1. |
| 8 | VCC | power_in | System power supply input, 4.5V to 5.5V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Driver Differential VOUT, RL = 100 Ω (RS-422) | VOD | 2.6 | 3.4 |  | V | RL = 100Ω (RS-422) (Figure 3A) | 4 |
| Driver Differential VOUT, RL = 54 Ω (RS-485), F suffix | VOD | 2.1 | 2.8 |  | V | RL = 54Ω (RS-485) (Figure 3A); F Suffix, Note 18: VCC = 5V ±5% | 4 |
| Driver Differential VOUT, RL = 60 Ω, common-mode load | VOD | 1.9 | 2.7 |  | V | RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, Note 18) | 4 |
| Change in Magnitude of Driver Differential VOUT for Complementary Output States | VOD |  | 0.01 | 0.2 | V | RL = 54Ω or 100Ω (Figure 3A) | 4 |
| Driver Common-Mode VOUT | VOC |  | 2 | 3 | V | RL = 54Ω or 100Ω (Figure 3A, Note 18) | 4 |
| Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States | VOC |  | 0.01 | 0.2 | V | RL = 54Ω or 100Ω (Figure 3A) | 4 |
| Logic Input High Voltage | VIH | 2 |  |  | V | DI, DE, RE | 4 |
| Logic Input Low Voltage | VIL |  |  | 0.8 | V | DI, DE, RE | 4 |
| Logic Input Current | IIN1 | -2 |  | 2 | µA | DI = DE = RE = 0V or VCC | 4 |
| Input Current (A/Y, B/Z), VIN = 12V | IIN2 |  |  | 220 | µA | DE = 0V, VCC = 0V or 5.5V, VIN = 12V | 4 |
| Input Current (A/Y, B/Z), VIN = -7V | IIN2 | -160 |  |  | µA | DE = 0V, VCC = 0V or 5.5V, VIN = -7V | 4 |
| Driver Short-Circuit Current, VO = High or Low | IOSD1 | -250 |  | 250 | mA | DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 11) | 4 |
| Receiver Differential Threshold Voltage | VTH | -200 |  | -50 | mV | -7V ≤ VCM ≤ 12V | 4 |
| Receiver Output Low Voltage | VOL |  |  | 0.4 | V | IO = +10mA, VID = -200mV | 5 |
| Receiver Output Low Current | IOL | 25 | 40 |  | mA | VOL = 1V, VID = -200mV | 5 |
| Three-state (high impedance) Receiver Output Current | IOZR | -1 | 0.015 | 1 | µA | 0.4V ≤ VO ≤ 2.4V | 5 |
| Receiver Input Resistance | RIN | 54 | 80 |  | kΩ | -7V ≤ VCM ≤ 12V | 5 |
| Receiver Short-Circuit Current | IOSR | -20 |  | 110 | mA | 0V ≤ VO ≤ VCC | 5 |
| No-Load Supply Current | ICC |  | 2.6 | 4 | mA | DI = DE = 0V or VCC (Note 10) | 5 |
| Shutdown Supply Current | ISHDN |  | 0.05 | 1 | µA | DE = 0V, RE = VCC, DI = 0V or VCC | 5 |
| Maximum Data Rate (driver) | fMAX | 40 |  |  | Mbps | VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 6) | 5 |
| Driver Differential Output Delay | tDD |  | 8 | 12 | ns | RD = 54Ω, CD = 50pF (Figure 4) | 5 |
| Driver Differential Output Skew | tSKEW |  | 0.5 | 1.5 | ns | RD = 54Ω, CD = 50pF (Figure 4) | 5 |
| Prop Delay Part-to-Part Skew (driver) | tSKP-P |  |  | 4 | ns | RD = 54Ω, CD = 50pF (Figure 4, Note 17) | 5 |
| Driver Differential Rise or Fall Time | tR, tF | 2 | 5 | 8 | ns | RD = 54Ω, CD = 50pF (Figure 4) | 5 |
| Driver Enable to Output High | tZH |  | 13 | 20 | ns | RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Note 12) | 5 |
| Driver Enable to Output Low | tZL |  | 11 | 20 | ns | RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Note 12) | 5 |
| Driver Disable from Output High | tHZ |  | 14 | 20 | ns | RL = 110Ω, CL = 50pF, SW = GND (Figure 5) | 5 |
| Driver Disable from Output Low | tLZ |  | 12 | 20 | ns | RL = 110Ω, CL = 50pF, SW = VCC (Figure 5) | 5 |
| Time to Shutdown (driver) | tSHDN | 60 |  | 600 | ns | Note 14 | 5 |
| Driver Enable from Shutdown to Output High | tZH(SHDN) |  |  | 1000 | ns | RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Notes 14, 15) | 5 |
| Driver Enable from Shutdown to Output Low | tZL(SHDN) |  |  | 1000 | ns | RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Notes 14, 15) | 5 |
| Maximum Data Rate (receiver) | fMAX | 40 |  |  | Mbps | VID = ±1.5V | 5 |
| Receiver Input to Output Delay | tPLH, tPHL |  | 9 | 13 | ns | Figure 7 | 5 |
| Receiver Skew | tSKD |  | 0 | 1.5 | ns | /tPLH - tPHL/ (Figure 7) | 5 |
| Prop Delay Part-to-Part Skew (receiver) | tSKP-P |  |  | 4 | ns | Figure 7, Note 17 | 5 |
| Receiver Enable to Output High | tZH |  |  | 12 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Note 13) | 6 |
| Receiver Enable to Output Low | tZL |  |  | 12 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Note 13) | 6 |
| Receiver Disable from Output High | tHZ |  |  | 12 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 8) | 6 |
| Receiver Disable from Output Low | tLZ |  |  | 12 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8) | 6 |
| Time to Shutdown (receiver) | tSHDN | 60 |  | 600 | ns | Note 14 | 6 |
| Receiver Enable from Shutdown to Output High | tZH(SHDN) |  |  | 1000 | ns | RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Notes 14, 16) | 6 |
| Receiver Enable from Shutdown to Output Low | tZL(SHDN) |  |  | 1000 | ns | RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Notes 14, 16) | 6 |
| Supply voltage VCC (recommended operating) | VCC | 4.5 |  | 5.5 | V | VCC = 4.5V to 5.5V (5V ±10%) | 3 |
| Operating temperature range, ISL3159EF | TA | -40 |  | 125 | °C | ISL3159EF | 4 |
| VCC to GND (absolute maximum) | VCC |  |  | 7 | V |  | 4 |
| Input voltages DI, DE, RE (absolute maximum) | VIN | -0.3 |  | 7 | V |  | 4 |
| Input/Output voltages A/Y, B/Z (absolute maximum) | VI/O | -9 |  | 13 | V |  | 4 |
| RO output voltage (absolute maximum) | VO | -0.3 |  |  | V | Upper limit printed as VCC + 0.3V | 4 |
| Maximum Junction Temperature (plastic package) | TJ |  |  | 150 | °C |  | 4 |
| Maximum Storage Temperature Range | TSTG | -65 |  | 150 | °C |  | 4 |
| Thermal resistance junction-to-ambient, 8 Ld SOIC | θJA |  | 105 |  | °C/W | Typical; Notes 5, 7 | 4 |
| Thermal resistance junction-to-case, 8 Ld SOIC | θJC |  | 60 |  | °C/W | Typical; Notes 5, 7 | 4 |

## CAD (KiCad official)

- Symbol: `ISL3159EFBZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl3159efbz-etched.step` / `isl3159efbz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl3159efbz.step` / `isl3159efbz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](docs/isl3159efbz-datasheet.pdf) (17 pp, sha256 `65ea123efd3f86fe`, retrieved 2026-10-30, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isl3159efbz-datasheet.pdf)