ISL3159EFBZ from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	RO	output	Receiver output: RO is high if A-B ≥ -50mV, low if A-B ≤ -200mV, and high when A and B are floating, shorted, or connected to a terminated bus that is undriven.
2	RE	input	Receiver output enable: RO is enabled when RE is low and is high impedance when RE is high; connect RE directly to GND if the Rx enable function is not required.
3	DE	input	Driver output enable: outputs Y and Z are enabled when DE is high and are high impedance when DE is low; if the Tx enable function is not required, connect DE to VCC through a 1kΩ or greater resistor.
4	DI	input	Driver input: a low on DI forces output Y low and Z high, and a high on DI forces Y high and Z low.
5	GND	power_in	Ground connection.
6	A/Y	bidirectional	±15kV IEC61000 ESD protected RS-485/422 level pin: noninverting receiver input (A) when DE = 0 and noninverting driver output (Y) when DE = 1.
7	B/Z	bidirectional	±15kV IEC61000 ESD protected RS-485/422 level pin: inverting receiver input (B) when DE = 0 and inverting driver output (Z) when DE = 1.
8	VCC	power_in	System power supply input, 4.5V to 5.5V.

Key specifications

Parameter	Value
Manufacturer	RENESAS
Package	SOIC-8
Category	Interface ICs
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Driver Differential VOUT, RL = 100 Ω (RS-422)	VOD	2.6	3.4		V	RL = 100Ω (RS-422) (Figure 3A)	4
Driver Differential VOUT, RL = 54 Ω (RS-485), F suffix	VOD	2.1	2.8		V	RL = 54Ω (RS-485) (Figure 3A); F Suffix, Note 18: VCC = 5V ±5%	4
Driver Differential VOUT, RL = 60 Ω, common-mode load	VOD	1.9	2.7		V	RL = 60Ω, -7V ≤ VCM ≤ 12V (Figure 3B, Note 18)	4
Change in Magnitude of Driver Differential VOUT for Complementary Output States	VOD		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 3A)	4
Driver Common-Mode VOUT	VOC		2	3	V	RL = 54Ω or 100Ω (Figure 3A, Note 18)	4
Change in Magnitude of Driver Common-Mode VOUT for Complementary Output States	VOC		0.01	0.2	V	RL = 54Ω or 100Ω (Figure 3A)	4
Logic Input High Voltage	VIH	2			V	DI, DE, RE	4
Logic Input Low Voltage	VIL			0.8	V	DI, DE, RE	4
Logic Input Current	IIN1	-2		2	µA	DI = DE = RE = 0V or VCC	4
Input Current (A/Y, B/Z), VIN = 12V	IIN2			220	µA	DE = 0V, VCC = 0V or 5.5V, VIN = 12V	4
Input Current (A/Y, B/Z), VIN = -7V	IIN2	-160			µA	DE = 0V, VCC = 0V or 5.5V, VIN = -7V	4
Driver Short-Circuit Current, VO = High or Low	IOSD1	-250		250	mA	DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 11)	4
Receiver Differential Threshold Voltage	VTH	-200		-50	mV	-7V ≤ VCM ≤ 12V	4
Receiver Output Low Voltage	VOL			0.4	V	IO = +10mA, VID = -200mV	5
Receiver Output Low Current	IOL	25	40		mA	VOL = 1V, VID = -200mV	5
Three-state (high impedance) Receiver Output Current	IOZR	-1	0.015	1	µA	0.4V ≤ VO ≤ 2.4V	5
Receiver Input Resistance	RIN	54	80		kΩ	-7V ≤ VCM ≤ 12V	5
Receiver Short-Circuit Current	IOSR	-20		110	mA	0V ≤ VO ≤ VCC	5
No-Load Supply Current	ICC		2.6	4	mA	DI = DE = 0V or VCC (Note 10)	5
Shutdown Supply Current	ISHDN		0.05	1	µA	DE = 0V, RE = VCC, DI = 0V or VCC	5
Maximum Data Rate (driver)	fMAX	40			Mbps	VOD ≥ ±1.5V, RD = 54Ω, CL = 100pF (Figure 6)	5
Driver Differential Output Delay	tDD		8	12	ns	RD = 54Ω, CD = 50pF (Figure 4)	5
Driver Differential Output Skew	tSKEW		0.5	1.5	ns	RD = 54Ω, CD = 50pF (Figure 4)	5
Prop Delay Part-to-Part Skew (driver)	tSKP-P			4	ns	RD = 54Ω, CD = 50pF (Figure 4, Note 17)	5
Driver Differential Rise or Fall Time	tR, tF	2	5	8	ns	RD = 54Ω, CD = 50pF (Figure 4)	5
Driver Enable to Output High	tZH		13	20	ns	RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Note 12)	5
Driver Enable to Output Low	tZL		11	20	ns	RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Note 12)	5
Driver Disable from Output High	tHZ		14	20	ns	RL = 110Ω, CL = 50pF, SW = GND (Figure 5)	5
Driver Disable from Output Low	tLZ		12	20	ns	RL = 110Ω, CL = 50pF, SW = VCC (Figure 5)	5
Time to Shutdown (driver)	tSHDN	60		600	ns	Note 14	5
Driver Enable from Shutdown to Output High	tZH(SHDN)			1000	ns	RL = 110Ω, CL = 50pF, SW = GND (Figure 5, Notes 14, 15)	5
Driver Enable from Shutdown to Output Low	tZL(SHDN)			1000	ns	RL = 110Ω, CL = 50pF, SW = VCC (Figure 5, Notes 14, 15)	5
Maximum Data Rate (receiver)	fMAX	40			Mbps	VID = ±1.5V	5
Receiver Input to Output Delay	tPLH, tPHL		9	13	ns	Figure 7	5
Receiver Skew	tSKD		0	1.5	ns	/tPLH - tPHL/ (Figure 7)	5
Prop Delay Part-to-Part Skew (receiver)	tSKP-P			4	ns	Figure 7, Note 17	5
Receiver Enable to Output High	tZH			12	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Note 13)	6
Receiver Enable to Output Low	tZL			12	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Note 13)	6
Receiver Disable from Output High	tHZ			12	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 8)	6
Receiver Disable from Output Low	tLZ			12	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8)	6
Time to Shutdown (receiver)	tSHDN	60		600	ns	Note 14	6
Receiver Enable from Shutdown to Output High	tZH(SHDN)			1000	ns	RL = 1kΩ, CL = 15pF, SW = GND (Figure 8, Notes 14, 16)	6
Receiver Enable from Shutdown to Output Low	tZL(SHDN)			1000	ns	RL = 1kΩ, CL = 15pF, SW = VCC (Figure 8, Notes 14, 16)	6
Supply voltage VCC (recommended operating)	VCC	4.5		5.5	V	VCC = 4.5V to 5.5V (5V ±10%)	3
Operating temperature range, ISL3159EF	TA	-40		125	°C	ISL3159EF	4
VCC to GND (absolute maximum)	VCC			7	V		4
Input voltages DI, DE, RE (absolute maximum)	VIN	-0.3		7	V		4
Input/Output voltages A/Y, B/Z (absolute maximum)	VI/O	-9		13	V		4
RO output voltage (absolute maximum)	VO	-0.3			V	Upper limit printed as VCC + 0.3V	4
Maximum Junction Temperature (plastic package)	TJ			150	°C		4
Maximum Storage Temperature Range	TSTG	-65		150	°C		4
Thermal resistance junction-to-ambient, 8 Ld SOIC	θJA		105		°C/W	Typical; Notes 5, 7	4
Thermal resistance junction-to-case, 8 Ld SOIC	θJC		60		°C/W	Typical; Notes 5, 7	4

CAD (KiCad official)

Symbol: ISL3159EFBZ
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SOIC-8 (KiCad packages3D, STEP)
3D model files: isl3159efbz-etched.step / isl3159efbz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); isl3159efbz.step / isl3159efbz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: RENESAS datasheet (17 pp, sha256 65ea123efd3f86fe, retrieved 2026-10-30, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

ISL3159EFBZ

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3D Model

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