# ISL21090BFB850Z-TK

**RENESAS** · Voltage References · SOIC-8

ISL21090BFB850Z-TK from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |
| 2 | VIN | power_in | Input voltage connection; the 5.0V option specifies a VIN range of 7V to 36V, with VIN to GND rated -0.5V to +40V. |
| 3 | COMP | passive | Compensation and noise reduction capacitor; a 0.01µF capacitor must be added to COMP for stabilization on the 1.25V option. |
| 4 | GND | power_in | Ground connection for the device, referenced by all voltage ratings given to GND. |
| 5 | TRIM | input | Voltage reference trim input, which is the negative feedback divider point of the output op amp and is used to adjust VOUT above or below the factory value. |
| 6 | VOUT | power_out | Voltage reference output; the 5.0V option delivers 5.0V with sourcing up to 20mA, and VOUT to GND (10s) is rated -0.5V to VOUT + 0.5V. |
| 7 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |
| 8 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VOUT Accuracy @ TA = +25°C | VOA | -0.025 |  | 0.025 | % | VOUT = 5.0V | 4 |
| Input Voltage Range | VIN | 7 |  | 36 | V | VOUT = 5.0V | 4 |
| Supply Current | IIN |  | 0.93 | 1.33 | mA |  | 4 |
| Line Regulation | ΔVOUT/ΔVIN |  | 8 | 18 | ppm/V | VIN = 7V to 36V, VOUT = 5.0V | 4 |
| Load Regulation (sourcing) | ΔVOUT/ΔIOUT |  | 2.5 | 17 | ppm/mA | Sourcing: 0mA ≤ IOUT ≤ 20mA | 4 |
| Load Regulation (sinking) | ΔVOUT/ΔIOUT |  | 2.5 | 17 | ppm/mA | Sinking: -10mA ≤ IOUT ≤ 0mA | 4 |
| Dropout Voltage | VD |  | 1.1 | 1.7 | V | VOUT = 5.0V @ 10mA | 4 |
| Output Voltage Temperature Coefficient | TC |  | 7 |  | ppm/°C | ISL21090 B grade | 4 |
| Output Voltage | VOUT |  | 5 |  | V | VIN = 10V | 4 |
| Short Circuit Current to GND | ISC+ |  | 61 |  | mA | TA = +25°C, VOUT tied to GND | 4 |
| Short Circuit Current to VIN | ISC- |  | -75 |  | mA | TA = +25°C, VOUT tied to VIN | 4 |
| Turn-on Settling Time | tR |  | 150 |  | µs | 90% of final value, CL = 1.0µF, CC = open | 4 |
| Ripple Rejection |  |  | 90 |  | dB | f = 120Hz | 4 |
| Output Voltage Noise | enp-p |  | 4.2 |  | µVP-P | 0.1Hz ≤ f ≤ 10Hz, VOUT = 5.0V | 4 |
| Broadband Voltage Noise | Vn |  | 3.2 |  | µVRMS | 10Hz ≤ f ≤ 1kHz, VOUT = 5.0V | 4 |
| Noise Voltage Density | en |  | 100 |  | nV/√Hz | f = 1kHz, VOUT = 5.0V | 4 |
| Long Term Stability | ΔVOUT/Δt |  | 20 |  | ppm | TA = +25°C | 4 |
| VIN to GND | VIN | -0.5 |  | 40 | V |  | 3 |
| Input Voltage Slew Rate |  |  |  | 0.1 | V/µs |  | 3 |
| ESD Human Body Model |  |  |  | 3 | kV | JESD22-A114F | 3 |
| ESD Machine Model |  |  |  | 200 | V | JESD22-A115-C | 3 |
| ESD Charged Device Model |  |  |  | 2 | kV | JESD22-C110D | 3 |
| Maximum Junction Temperature | TJMAX |  |  | 150 | °C |  | 3 |
| Storage Temperature Range |  | -65 |  | 150 | °C |  | 3 |
| Operating Temperature Range (Industrial) |  | -40 |  | 125 | °C |  | 3 |
| Thermal Resistance Junction to Ambient | θJA |  | 110 |  | °C/W | 8 Ld SOIC, typical | 3 |
| Thermal Resistance Junction to Case | θJC |  | 60 |  | °C/W | 8 Ld SOIC, typical | 3 |

## CAD (KiCad official)

- Symbol: `ISL21090BFB850Z-TK`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `isl21090bfb850z-tk-etched.step` / `isl21090bfb850z-tk-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `isl21090bfb850z-tk.step` / `isl21090bfb850z-tk.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [RENESAS datasheet](docs/isl21090bfb850z-tk-datasheet.pdf) (20 pp, sha256 `128213d89f1e6839`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/isl21090bfb850z-tk-datasheet.pdf)