component
ISL21090BFB850Z-TK
Public Made by Adomby adom
RENESAS Voltage References, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownISL21090BFB850Z-TK
RENESAS · Voltage References · SOIC-8
ISL21090BFB850Z-TK from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |
| 2 | VIN | power_in | Input voltage connection; the 5.0V option specifies a VIN range of 7V to 36V, with VIN to GND rated -0.5V to +40V. |
| 3 | COMP | passive | Compensation and noise reduction capacitor; a 0.01µF capacitor must be added to COMP for stabilization on the 1.25V option. |
| 4 | GND | power_in | Ground connection for the device, referenced by all voltage ratings given to GND. |
| 5 | TRIM | input | Voltage reference trim input, which is the negative feedback divider point of the output op amp and is used to adjust VOUT above or below the factory value. |
| 6 | VOUT | power_out | Voltage reference output; the 5.0V option delivers 5.0V with sourcing up to 20mA, and VOUT to GND (10s) is rated -0.5V to VOUT + 0.5V. |
| 7 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |
| 8 | DNC | unconnected | Do Not Connect pin; the absolute maximum ratings state that no connections are permitted to DNC pins. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Power Management ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VOUT Accuracy @ TA = +25°C | VOA | -0.025 | 0.025 | % | VOUT = 5.0V | 4 | |
| Input Voltage Range | VIN | 7 | 36 | V | VOUT = 5.0V | 4 | |
| Supply Current | IIN | 0.93 | 1.33 | mA | 4 | ||
| Line Regulation | ΔVOUT/ΔVIN | 8 | 18 | ppm/V | VIN = 7V to 36V, VOUT = 5.0V | 4 | |
| Load Regulation (sourcing) | ΔVOUT/ΔIOUT | 2.5 | 17 | ppm/mA | Sourcing: 0mA ≤ IOUT ≤ 20mA | 4 | |
| Load Regulation (sinking) | ΔVOUT/ΔIOUT | 2.5 | 17 | ppm/mA | Sinking: -10mA ≤ IOUT ≤ 0mA | 4 | |
| Dropout Voltage | VD | 1.1 | 1.7 | V | VOUT = 5.0V @ 10mA | 4 | |
| Output Voltage Temperature Coefficient | TC | 7 | ppm/°C | ISL21090 B grade | 4 | ||
| Output Voltage | VOUT | 5 | V | VIN = 10V | 4 | ||
| Short Circuit Current to GND | ISC+ | 61 | mA | TA = +25°C, VOUT tied to GND | 4 | ||
| Short Circuit Current to VIN | ISC- | -75 | mA | TA = +25°C, VOUT tied to VIN | 4 | ||
| Turn-on Settling Time | tR | 150 | µs | 90% of final value, CL = 1.0µF, CC = open | 4 | ||
| Ripple Rejection | 90 | dB | f = 120Hz | 4 | |||
| Output Voltage Noise | enp-p | 4.2 | µVP-P | 0.1Hz ≤ f ≤ 10Hz, VOUT = 5.0V | 4 | ||
| Broadband Voltage Noise | Vn | 3.2 | µVRMS | 10Hz ≤ f ≤ 1kHz, VOUT = 5.0V | 4 | ||
| Noise Voltage Density | en | 100 | nV/√Hz | f = 1kHz, VOUT = 5.0V | 4 | ||
| Long Term Stability | ΔVOUT/Δt | 20 | ppm | TA = +25°C | 4 | ||
| VIN to GND | VIN | -0.5 | 40 | V | 3 | ||
| Input Voltage Slew Rate | 0.1 | V/µs | 3 | ||||
| ESD Human Body Model | 3 | kV | JESD22-A114F | 3 | |||
| ESD Machine Model | 200 | V | JESD22-A115-C | 3 | |||
| ESD Charged Device Model | 2 | kV | JESD22-C110D | 3 | |||
| Maximum Junction Temperature | TJMAX | 150 | °C | 3 | |||
| Storage Temperature Range | -65 | 150 | °C | 3 | |||
| Operating Temperature Range (Industrial) | -40 | 125 | °C | 3 | |||
| Thermal Resistance Junction to Ambient | θJA | 110 | °C/W | 8 Ld SOIC, typical | 3 | ||
| Thermal Resistance Junction to Case | θJC | 60 | °C/W | 8 Ld SOIC, typical | 3 |
CAD (KiCad official)
- Symbol:
ISL21090BFB850Z-TK - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
isl21090bfb850z-tk-etched.step/isl21090bfb850z-tk-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);isl21090bfb850z-tk.step/isl21090bfb850z-tk.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (20 pp, sha256
128213d89f1e6839, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).