component
IRFZ44NS-HXY
Public Made by Adomby adom
HXY MOSFET MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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IRFZ44NS-HXY
HXY MOSFET · MOSFETs · TO-263
IRFZ44NS-HXY from HXY MOSFET, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits gate-source voltage to ±20 V (VGS), and the device is rated for operation with gate voltages as low as 4.5 V. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated at 55 V (VDS) and continuous drain current at 49 A (35 A at TC = 100°C). |
| 3 | S | passive | Source terminal; continuous source current is rated at 49 A, with a pulsed source current of 160 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 55 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Drain Current-Continuous | ID | 49 | A | 1 | |||
| Drain Current-Continuous | ID (100°C) | 35 | A | TC=100°C | 1 | ||
| Pulsed Drain Current | IDM | 160 | A | 1 | |||
| Maximum Power Dissipation | PD | 94 | W | 1 | |||
| Repetitive Avalanche Energy | EAR | 9.4 | mJ | 1 | |||
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | 175 | °C | 1 | ||
| Thermal Resistance, Junction-to-Case (Note 2) | RθJC | 1.5 | °C/W | 1 | |||
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 55 | V | VGS = 0V, ID = 250µA | 2 | ||
| Static Drain-to-Source On-Resistance | RDS(on) | 10 | 13 | mΩ | VGS = 10V, ID = 25A | 2 | |
| Gate Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250µA | 2 | |
| Forward Transconductance | gfs | 19 | S | VDS = 25V, ID = 25A | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 25 | µA | VDS = 55V, VGS = 0V | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 250 | µA | VDS = 44V, VGS = 0V, TJ = 150°C | 2 | ||
| Gate-to-Source Forward Leakage | IGSS | 100 | nA | VGS = 20V | 2 | ||
| Gate-to-Source Reverse Leakage | IGSS | -100 | nA | VGS = -20V | 2 | ||
| Total Gate Charge | Qg | 63 | nC | ID = 25A | 2 | ||
| Gate-to-Source Charge | Qgs | 14 | nC | VDS = 44V | 2 | ||
| Gate-to-Drain (Miller) Charge | Qgd | 23 | nC | VGS = 10V, See Fig. 6 and 13 | 2 | ||
| Continuous Source Current (Body Diode) | IS | 49 | A | 2 | |||
| Pulsed Source Current (Body Diode) | ISM | 160 | A | 2 | |||
| Diode Forward Voltage | VSD | 1.3 | V | TJ = 25°C, IS = 25A, VGS = 0V | 2 | ||
| Reverse Recovery Time | trr | 63 | 95 | ns | TJ = 25°C, IF = 25A | 2 | |
| Reverse Recovery Charge | Qrr | 170 | 260 | nC | di/dt = 100A/µs | 2 |
CAD (KiCad official)
- Symbol:
IRFZ44NS-HXY - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files:
irfz44ns-hxy-etched.step/irfz44ns-hxy-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irfz44ns-hxy.step/irfz44ns-hxy.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HXY MOSFET datasheet (9 pp, sha256
ba53b0bbaaa523cb, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IRFZ44NS-HXY
**HXY MOSFET** · MOSFETs · TO-263
IRFZ44NS-HXY from HXY MOSFET, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the datasheet limits gate-source voltage to ±20 V (VGS), and the device is rated for operation with gate voltages as low as 4.5 V. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated at 55 V (VDS) and continuous drain current at 49 A (35 A at TC = 100°C). |
| 3 | S | passive | Source terminal; continuous source current is rated at 49 A, with a pulsed source current of 160 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | TO-263 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 55 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Drain Current-Continuous | ID | | | 49 | A | | 1 |
| Drain Current-Continuous | ID (100°C) | | | 35 | A | TC=100°C | 1 |
| Pulsed Drain Current | IDM | | | 160 | A | | 1 |
| Maximum Power Dissipation | PD | | | 94 | W | | 1 |
| Repetitive Avalanche Energy | EAR | | | 9.4 | mJ | | 1 |
| Operating Junction and Storage Temperature Range | TJ,TSTG | -55 | | 175 | °C | | 1 |
| Thermal Resistance, Junction-to-Case (Note 2) | RθJC | | | 1.5 | °C/W | | 1 |
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 55 | | | V | VGS = 0V, ID = 250µA | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) | | 10 | 13 | mΩ | VGS = 10V, ID = 25A | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250µA | 2 |
| Forward Transconductance | gfs | 19 | | | S | VDS = 25V, ID = 25A | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 25 | µA | VDS = 55V, VGS = 0V | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 250 | µA | VDS = 44V, VGS = 0V, TJ = 150°C | 2 |
| Gate-to-Source Forward Leakage | IGSS | | | 100 | nA | VGS = 20V | 2 |
| Gate-to-Source Reverse Leakage | IGSS | | | -100 | nA | VGS = -20V | 2 |
| Total Gate Charge | Qg | | | 63 | nC | ID = 25A | 2 |
| Gate-to-Source Charge | Qgs | | | 14 | nC | VDS = 44V | 2 |
| Gate-to-Drain (Miller) Charge | Qgd | | | 23 | nC | VGS = 10V, See Fig. 6 and 13 | 2 |
| Continuous Source Current (Body Diode) | IS | | | 49 | A | | 2 |
| Pulsed Source Current (Body Diode) | ISM | | | 160 | A | | 2 |
| Diode Forward Voltage | VSD | | | 1.3 | V | TJ = 25°C, IS = 25A, VGS = 0V | 2 |
| Reverse Recovery Time | trr | | 63 | 95 | ns | TJ = 25°C, IF = 25A | 2 |
| Reverse Recovery Charge | Qrr | | 170 | 260 | nC | di/dt = 100A/µs | 2 |
## CAD (KiCad official)
- Symbol: `IRFZ44NS-HXY`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263 (KiCad packages3D, STEP)
- 3D model files: `irfz44ns-hxy-etched.step` / `irfz44ns-hxy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irfz44ns-hxy.step` / `irfz44ns-hxy.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8756956153253240832) (9 pp, sha256 `ba53b0bbaaa523cb`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/irfz44ns-hxy-datasheet.pdf)