# IRFR3806TR

**UMW** · MOSFETs · TO-252

IRFR3806TR from UMW, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | GATE terminal of the N-channel MOSFET; the datasheet gives a gate-to-source voltage rating of ±20 V. |
| 2 | D | passive | DRAIN terminal, which is also the tab of the TO-252 package; the datasheet gives a 60 V drain-to-source rating and 43 A continuous drain current at TC=25°C (VGS=10V). |
| 3 | S | passive | SOURCE terminal of the MOSFET; the integral body diode is connected between source and drain. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | UMW |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 60 |  |  | V | ID=250µA, VGS=0V | 3 |
| Static Drain-to-Source On-Resistance | RDS(ON) |  | 12.6 | 15.8 | mΩ | VGS=10V, ID=25A ④ | 3 |
| Drain-to-Source Leakage Current (TJ=125°C) | IDSS |  |  | 250 | µA | VDS=48V, VGS=0V, TJ=125°C | 3 |
| Gate-to-Source Forward Leakage | IGSS |  |  | 100 | nA | VGS=20V | 3 |
| Gate-to-Source Reverse Leakage | IGSS |  |  | -100 | nA | VGS=-20V | 3 |
| Continuous Drain Current | ID |  |  | 43 | A | TC=25°C | 1 |
| Continuous Drain Current | ID |  |  | 31 | A | TC=100°C | 1 |
| Pulsed Drain Current | IDM |  |  | 170 | A |  | 1 |
| Maximum Power Dissipation | PD |  |  | 71 | W |  | 1 |
| Linear Derating Factor |  |  |  | 0.47 | W/°C |  | 1 |
| Gate-to-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Peak Diode Recovery | dv/dt |  |  | 24 | V/ns |  | 1 |
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 |  | 175 | °C |  | 1 |
| Soldering Temperature |  |  |  | 300 | °C | 10 s, 1.6mm from case | 1 |
| Junction-to-Case | RθJC |  |  | 2.12 | °C/W |  | 2 |
| Junction-to-Ambient | RθJA |  |  | 62 | °C/W |  | 2 |
| Case-to-Sink | RθCS |  | 0.5 |  | °C/W | Flat, greased surface | 2 |

## CAD (KiCad official)

- Symbol: `IRFR3806TR`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `irfr3806tr-etched.step` / `irfr3806tr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irfr3806tr.step` / `irfr3806tr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [UMW datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8755879393639960576) (12 pp, sha256 `55d9c477bbf64541`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/irfr3806tr-datasheet.pdf)