component
IRFIBE20GPBF
Public Made by Adomby adom
Vishay Intertech MOSFETs, TO-220-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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IRFIBE20GPBF
Vishay Intertech · MOSFETs · TO-220-3
IRFIBE20GPBF from Vishay Intertech, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, rated for VGS of ±20 V maximum with a threshold of 2.0 to 4.0 V at ID = 250 μA. |
| 2 | D | passive | Drain of the N-channel MOSFET, rated for VDS of 800 V maximum and continuous ID of 1.4 A at TC = 25 °C. |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous body-diode current IS of 1.4 A and pulsed 5.6 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | TO-220-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | 800 | V | TC = 25 °C | 1 | ||
| Gate-source voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous drain current | ID | 1.4 | A | VGS at 10 V, TC = 25 °C | 1 | ||
| Continuous drain current | ID | 0.86 | A | VGS at 10 V, TC = 100 °C | 1 | ||
| Pulsed drain current | IDM | 5.6 | A | 1 | |||
| Linear derating factor | 0.24 | W/°C | 1 | ||||
| Single pulse avalanche energy | EAS | 180 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 172 mH, RG = 25 Ω, IAS = 1.4 A | 1 | ||
| Repetitive avalanche current | IAR | 1.4 | A | 1 | |||
| Repetitive avalanche energy | EAR | 3 | mJ | 1 | |||
| Maximum power dissipation | PD | 30 | W | TC = 25 °C | 1 | ||
| Peak diode recovery dV/dt | dV/dt | 2 | V/ns | ISD ≤ 1.8 A, dI/dt ≤ 80 A/μs, VDD ≤ 600, TJ ≤ 150 °C | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering recommendations (peak temperature) | 300 | °C | For 10 s, 1.6 mm from case | 1 | |||
| Mounting torque | 0.6 | Nm | M3 screw | 1 | |||
| Maximum junction-to-ambient | RthJA | 65 | °C/W | 2 | |||
| Maximum junction-to-case (drain) | RthJC | 4.1 | °C/W | 2 | |||
| Drain-source breakdown voltage | VDS | 800 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-source threshold voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-source leakage | IGSS | -100 | 100 | nA | VGS = ± 20 V | 2 | |
| Zero gate voltage drain current | IDSS | 100 | μA | VDS = 800 V, VGS = 0 V | 2 | ||
| Zero gate voltage drain current | IDSS | 500 | μA | VDS = 640 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Drain-source on-state resistance | RDS(on) | 6.5 | Ω | VGS = 10 V, ID = 0.84 A | 2 | ||
| Forward transconductance | gfs | 1 | S | VDS = 10 V, ID = 0.84 A | 2 | ||
| Total gate charge | Qg | 38 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 | ||
| Gate-source charge | Qgs | 5 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 | ||
| Gate-drain charge | Qgd | 21 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 | ||
| Continuous source-drain diode current | IS | 1.4 | A | MOSFET symbol showing integral reverse p-n junction diode | 2 | ||
| Pulsed diode forward current | ISM | 5.6 | A | 2 | |||
| Body diode voltage | VSD | 1.4 | V | TJ = 25 °C, IS = 1.4 A, VGS = 0 V | 2 | ||
| Body diode reverse recovery time | trr | 380 | 570 | ns | TJ = 25 °C, IF = 1.8 A, dI/dt = 100 A/μs | 2 | |
| Body diode reverse recovery charge | Qrr | 0.94 | 1.4 | μC | TJ = 25 °C, IF = 1.8 A, dI/dt = 100 A/μs | 2 | |
| VDS temperature coefficient | ΔVDS/TJ | 0.98 | V/°C | Reference to 25 °C, ID = 1 mA | 2 | ||
| Input capacitance | Ciss | 530 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Output capacitance | Coss | 150 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Reverse transfer capacitance | Crss | 90 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Drain to sink capacitance | C | 12 | pF | f = 1.0 MHz | 2 | ||
| Turn-on delay time | td(on) | 8.2 | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 | ||
| Rise time | tr | 17 | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 | ||
| Turn-off delay time | td(off) | 58 | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 | ||
| Fall time | tf | 27 | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 | ||
| Internal drain inductance | LD | 4.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 | ||
| Internal source inductance | LS | 7.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
CAD (KiCad official)
- Symbol:
IRFIBE20GPBF - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files:
irfibe20gpbf-etched.step/irfibe20gpbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irfibe20gpbf.step/irfibe20gpbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (10 pp, sha256
b7f94736c45c4c53, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IRFIBE20GPBF
**Vishay Intertech** · MOSFETs · TO-220-3
IRFIBE20GPBF from Vishay Intertech, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the N-channel MOSFET, rated for VGS of ±20 V maximum with a threshold of 2.0 to 4.0 V at ID = 250 μA. |
| 2 | D | passive | Drain of the N-channel MOSFET, rated for VDS of 800 V maximum and continuous ID of 1.4 A at TC = 25 °C. |
| 3 | S | passive | Source of the N-channel MOSFET, with continuous body-diode current IS of 1.4 A and pulsed 5.6 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | TO-220-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source voltage | VDS | | | 800 | V | TC = 25 °C | 1 |
| Gate-source voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous drain current | ID | | | 1.4 | A | VGS at 10 V, TC = 25 °C | 1 |
| Continuous drain current | ID | | | 0.86 | A | VGS at 10 V, TC = 100 °C | 1 |
| Pulsed drain current | IDM | | | 5.6 | A | | 1 |
| Linear derating factor | | | | 0.24 | W/°C | | 1 |
| Single pulse avalanche energy | EAS | | | 180 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 172 mH, RG = 25 Ω, IAS = 1.4 A | 1 |
| Repetitive avalanche current | IAR | | | 1.4 | A | | 1 |
| Repetitive avalanche energy | EAR | | | 3 | mJ | | 1 |
| Maximum power dissipation | PD | | | 30 | W | TC = 25 °C | 1 |
| Peak diode recovery dV/dt | dV/dt | | | 2 | V/ns | ISD ≤ 1.8 A, dI/dt ≤ 80 A/μs, VDD ≤ 600, TJ ≤ 150 °C | 1 |
| Operating junction and storage temperature range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Soldering recommendations (peak temperature) | | | | 300 | °C | For 10 s, 1.6 mm from case | 1 |
| Mounting torque | | | | 0.6 | Nm | M3 screw | 1 |
| Maximum junction-to-ambient | RthJA | | | 65 | °C/W | | 2 |
| Maximum junction-to-case (drain) | RthJC | | | 4.1 | °C/W | | 2 |
| Drain-source breakdown voltage | VDS | 800 | | | V | VGS = 0 V, ID = 250 μA | 2 |
| Gate-source threshold voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250 μA | 2 |
| Gate-source leakage | IGSS | -100 | | 100 | nA | VGS = ± 20 V | 2 |
| Zero gate voltage drain current | IDSS | | | 100 | μA | VDS = 800 V, VGS = 0 V | 2 |
| Zero gate voltage drain current | IDSS | | | 500 | μA | VDS = 640 V, VGS = 0 V, TJ = 125 °C | 2 |
| Drain-source on-state resistance | RDS(on) | | | 6.5 | Ω | VGS = 10 V, ID = 0.84 A | 2 |
| Forward transconductance | gfs | 1 | | | S | VDS = 10 V, ID = 0.84 A | 2 |
| Total gate charge | Qg | | | 38 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 |
| Gate-source charge | Qgs | | | 5 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 |
| Gate-drain charge | Qgd | | | 21 | nC | VGS = 10 V, ID = 1.8 A, VDS = 400 V | 2 |
| Continuous source-drain diode current | IS | | | 1.4 | A | MOSFET symbol showing integral reverse p-n junction diode | 2 |
| Pulsed diode forward current | ISM | | | 5.6 | A | | 2 |
| Body diode voltage | VSD | | | 1.4 | V | TJ = 25 °C, IS = 1.4 A, VGS = 0 V | 2 |
| Body diode reverse recovery time | trr | | 380 | 570 | ns | TJ = 25 °C, IF = 1.8 A, dI/dt = 100 A/μs | 2 |
| Body diode reverse recovery charge | Qrr | | 0.94 | 1.4 | μC | TJ = 25 °C, IF = 1.8 A, dI/dt = 100 A/μs | 2 |
| VDS temperature coefficient | ΔVDS/TJ | | 0.98 | | V/°C | Reference to 25 °C, ID = 1 mA | 2 |
| Input capacitance | Ciss | | 530 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Output capacitance | Coss | | 150 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Reverse transfer capacitance | Crss | | 90 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Drain to sink capacitance | C | | 12 | | pF | f = 1.0 MHz | 2 |
| Turn-on delay time | td(on) | | 8.2 | | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 |
| Rise time | tr | | 17 | | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 |
| Turn-off delay time | td(off) | | 58 | | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 |
| Fall time | tf | | 27 | | ns | VDD = 400 V, ID = 1.8 A, RG = 18 Ω, RD = 230 Ω | 2 |
| Internal drain inductance | LD | | 4.5 | | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
| Internal source inductance | LS | | 7.5 | | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
## CAD (KiCad official)
- Symbol: `IRFIBE20GPBF`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files: `irfibe20gpbf-etched.step` / `irfibe20gpbf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irfibe20gpbf.step` / `irfibe20gpbf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/irfibe20gpbf-datasheet.pdf) (10 pp, sha256 `b7f94736c45c4c53`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/irfibe20gpbf-datasheet.pdf)