# IRFB3307PBF

**Infineon Technologies** · MOSFETs · TO-220AB

IRFB3307PBF from Infineon Technologies, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS rated ±20V max and threshold VGS(th) of 2.0V to 4.0V. |
| 2 | D | passive | Drain; connected to the tab, rated VDSS 75V with continuous drain current of 120A at TC = 25°C (package limited to 75A). |
| 3 | S | passive | Source; power return of the N-channel HEXFET, with body diode continuous source current IS of 130A max. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-220AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | V(BR)DSS | 75 |  |  | V | VGS = 0V, ID = 250μA | 2 |
| Static Drain-to-Source On-Resistance | RDS(on) |  | 5 | 6.3 | mΩ | VGS = 10V, ID = 75A | 2 |
| Gate Threshold Voltage | VGS(th) | 2 |  | 4 | V | VDS = VGS, ID = 150μA | 2 |
| Drain-to-Source Leakage Current | IDSS |  |  | 20 | μA | VDS = 75V, VGS = 0V | 2 |
| Drain-to-Source Leakage Current (125°C) | IDSS |  |  | 250 | μA | VDS = 75V, VGS = 0V, TJ = 125°C | 2 |
| Gate-to-Source Forward Leakage | IGSS |  |  | 200 | nA | VGS = 20V | 2 |
| Gate-to-Source Reverse Leakage | IGSS |  |  | -200 | nA | VGS = -20V | 2 |
| Forward Transconductance | gfs | 98 |  |  | S | VDS = 50V, ID = 75A | 2 |
| Total Gate Charge | Qg |  | 120 | 180 | nC | ID = 75A | 2 |
| Continuous Source Current (Body Diode) | IS |  |  | 130 | A |  | 2 |
| Pulsed Source Current (Body Diode) | ISM |  |  | 510 | A |  | 2 |
| Diode Forward Voltage | VSD |  |  | 1.3 | V | TJ = 25°C, IS = 75A, VGS = 0V | 2 |
| Reverse Recovery Time (25°C) | trr |  | 38 | 57 | ns | TJ = 25°C, VR = 64V, IF = 75A | 2 |
| Reverse Recovery Time (125°C) | trr |  | 46 | 69 | ns | TJ = 125°C, VR = 64V, IF = 75A | 2 |
| Reverse Recovery Charge (25°C) | Qrr |  | 65 | 98 | nC | TJ = 25°C, di/dt = 100A/μs | 2 |
| Reverse Recovery Charge (125°C) | Qrr |  | 86 | 130 | nC | TJ = 125°C, di/dt = 100A/μs | 2 |
| Continuous Drain Current | ID |  |  | 120 | A | TC = 25°C, VGS @ 10V | 1 |
| Continuous Drain Current | ID |  |  | 84 | A | TC = 100°C, VGS @ 10V | 1 |
| Pulsed Drain Current | IDM |  |  | 510 | A |  | 1 |
| Maximum Power Dissipation | PD |  |  | 270 | W | TC = 25°C | 1 |
| Linear Derating Factor |  |  |  | 1.3 | W/°C |  | 1 |
| Gate-to-Source Voltage | VGS | -20 |  | 20 | V |  | 1 |
| Operating Junction and Storage Temperature Range | TJ, TSTG | -55 |  | 175 | °C |  | 1 |
| Soldering Temperature |  |  |  | 300 | °C | for 10 seconds (1.6mm from case) | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 200 | mJ | Thermally limited | 1 |
| Junction-to-Case Thermal Resistance | RθJC |  |  | 0.61 | °C/W |  | 1 |
| Junction-to-Ambient Thermal Resistance, TO-220 | RθJA |  |  | 62 | °C/W |  | 1 |
| Case-to-Sink Thermal Resistance | RθCS |  | 0.5 |  | °C/W | Flat Greased Surface, TO-220 | 1 |
| Breakdown Voltage Temp. Coefficient | ΔV(BR)DSS/ΔTJ |  | 0.069 |  | V/°C | Reference to 25°C, ID = 1mA | 2 |
| Gate Input Resistance | RG |  | 1.5 |  | Ω | f = 1MHz, open drain | 2 |
| Input Capacitance | Ciss |  | 5150 |  | pF | VGS = 0V, VDS = 50V, f = 1.0MHz | 2 |
| Output Capacitance | Coss |  | 460 |  | pF |  | 2 |
| Reverse Transfer Capacitance | Crss |  | 250 |  | pF |  | 2 |

## CAD (KiCad official)

- Symbol: `IRFB3307PBF`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `irfb3307pbf-etched.step` / `irfb3307pbf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irfb3307pbf.step` / `irfb3307pbf.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Infineon Technologies datasheet](https://www.infineon.com/dgdl/irfs3307pbf.pdf?fileId=5546d462533600a40153563689292169) (12 pp, sha256 `c9540655a117515e`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/irfb3307pbf-datasheet.pdf)