component
IRF720PBF
Public Made by Adomby adom
Vishay Intertech Pre-ordered Chips, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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IRF720PBF
Vishay Intertech · Pre-ordered Chips · TO-220AB
IRF720PBF from Vishay Intertech, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS limited to ±20 V and a threshold VGS(th) of 2.0 to 4.0 V. |
| 2 | D | passive | Drain; connected to the mounting tab, rated for VDS up to 400 V and continuous ID of 3.3 A at TC = 25 °C. |
| 3 | S | passive | Source; the body diode runs from source to drain, with continuous diode current IS up to 3.3 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | TO-220AB |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | VDS | 400 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-source threshold voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-source leakage | IGSS | -100 | 100 | nA | VGS = ± 20 | 2 | |
| Zero gate voltage drain current | IDSS | 25 | μA | VDS = 400 V, VGS = 0 V | 2 | ||
| Zero gate voltage drain current | IDSS | 250 | μA | VDS = 320 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Drain-source on-state resistance | RDS(on) | 1.8 | Ω | VGS = 10 V, ID = 2.0 A | 2 | ||
| Forward transconductance | gfs | 1.7 | S | VDS = 50 V, ID = 2.0 A | 2 | ||
| Total gate charge | Qg | 20 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 | ||
| Gate-source charge | Qgs | 3.3 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 | ||
| Gate-drain charge | Qgd | 11 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 | ||
| Gate input resistance | Rg | 1.2 | 7.3 | Ω | f = 1 MHz, open drain | 2 | |
| Continuous source-drain diode current | IS | 3.3 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 | ||
| Pulsed diode forward current | ISM | 13 | A | 2 | |||
| Body diode voltage | VSD | 1.6 | V | TJ = 25 °C, IS = 3.3 A, VGS = 0 V | 2 | ||
| Body diode reverse recovery time | trr | 270 | 600 | ns | TJ = 25 °C, IF = 3.3 A, dI/dt = 100 A/μs | 2 | |
| Body diode reverse recovery charge | Qrr | 1.4 | 3 | μC | TJ = 25 °C, IF = 3.3 A, dI/dt = 100 A/μs | 2 | |
| Drain-source voltage | VDS | 400 | V | TC = 25 °C | 1 | ||
| Gate-source voltage | VGS | -20 | 20 | V | TC = 25 °C | 1 | |
| Continuous drain current | ID | 3.3 | A | VGS at 10 V, TC = 25 °C | 1 | ||
| Continuous drain current | ID | 2.1 | A | VGS at 10 V, TC = 100 °C | 1 | ||
| Pulsed drain current | IDM | 13 | A | TC = 25 °C | 1 | ||
| Linear derating factor | 0.4 | W/°C | TC = 25 °C | 1 | |||
| Single pulse avalanche energy | EAS | 190 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 30 mH, Rg = 25 Ω, IAS = 3.3 A | 1 | ||
| Repetitive avalanche current | IAR | 3.3 | A | TC = 25 °C | 1 | ||
| Repetitive avalanche energy | EAR | 5 | mJ | TC = 25 °C | 1 | ||
| Maximum power dissipation | PD | 50 | W | TC = 25 °C | 1 | ||
| Peak diode recovery dV/dt | dV/dt | 4 | V/ns | ISD ≤ 3.3 A, dI/dt ≤ 65 A/μs, VDD ≤ VDS, TJ ≤ 150 °C | 1 | ||
| Operating junction and storage temperature range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Soldering recommendations (peak temperature) | 300 | °C | For 10 s, 1.6 mm from case | 1 | |||
| Maximum junction-to-ambient | RthJA | 62 | °C/W | 2 | |||
| Maximum junction-to-case (drain) | RthJC | 2.5 | °C/W | 2 | |||
| Case-to-sink, flat, greased surface | RthCS | 0.5 | °C/W | 2 | |||
| VDS temperature coefficient | ΔVDS/TJ | 0.51 | V/°C | Reference to 25 °C, ID = 1 mA | 2 | ||
| Input capacitance | Ciss | 410 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Output capacitance | Coss | 120 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Reverse transfer capacitance | Crss | 47 | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 | ||
| Turn-on delay time | td(on) | 10 | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 | ||
| Rise time | tr | 14 | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 | ||
| Turn-off delay time | td(off) | 30 | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 | ||
| Fall time | tf | 13 | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 | ||
| Internal drain inductance | LD | 4.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 | ||
| Internal source inductance | LS | 7.5 | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
CAD (KiCad official)
- Symbol:
IRF720PBF - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
irf720pbf-etched.step/irf720pbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irf720pbf.step/irf720pbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Vishay Intertech datasheet (7 pp, sha256
171a1ad49d23a00a, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IRF720PBF
**Vishay Intertech** · Pre-ordered Chips · TO-220AB
IRF720PBF from Vishay Intertech, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGS limited to ±20 V and a threshold VGS(th) of 2.0 to 4.0 V. |
| 2 | D | passive | Drain; connected to the mounting tab, rated for VDS up to 400 V and continuous ID of 3.3 A at TC = 25 °C. |
| 3 | S | passive | Source; the body diode runs from source to drain, with continuous diode current IS up to 3.3 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Vishay Intertech |
| Package | TO-220AB |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | VDS | 400 | | | V | VGS = 0 V, ID = 250 μA | 2 |
| Gate-source threshold voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250 μA | 2 |
| Gate-source leakage | IGSS | -100 | | 100 | nA | VGS = ± 20 | 2 |
| Zero gate voltage drain current | IDSS | | | 25 | μA | VDS = 400 V, VGS = 0 V | 2 |
| Zero gate voltage drain current | IDSS | | | 250 | μA | VDS = 320 V, VGS = 0 V, TJ = 125 °C | 2 |
| Drain-source on-state resistance | RDS(on) | | | 1.8 | Ω | VGS = 10 V, ID = 2.0 A | 2 |
| Forward transconductance | gfs | 1.7 | | | S | VDS = 50 V, ID = 2.0 A | 2 |
| Total gate charge | Qg | | | 20 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 |
| Gate-source charge | Qgs | | | 3.3 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 |
| Gate-drain charge | Qgd | | | 11 | nC | VGS = 10 V, ID = 3.3 A, VDS = 320 V | 2 |
| Gate input resistance | Rg | 1.2 | | 7.3 | Ω | f = 1 MHz, open drain | 2 |
| Continuous source-drain diode current | IS | | | 3.3 | A | MOSFET symbol showing the integral reverse p-n junction diode | 2 |
| Pulsed diode forward current | ISM | | | 13 | A | | 2 |
| Body diode voltage | VSD | | | 1.6 | V | TJ = 25 °C, IS = 3.3 A, VGS = 0 V | 2 |
| Body diode reverse recovery time | trr | | 270 | 600 | ns | TJ = 25 °C, IF = 3.3 A, dI/dt = 100 A/μs | 2 |
| Body diode reverse recovery charge | Qrr | | 1.4 | 3 | μC | TJ = 25 °C, IF = 3.3 A, dI/dt = 100 A/μs | 2 |
| Drain-source voltage | VDS | | | 400 | V | TC = 25 °C | 1 |
| Gate-source voltage | VGS | -20 | | 20 | V | TC = 25 °C | 1 |
| Continuous drain current | ID | | | 3.3 | A | VGS at 10 V, TC = 25 °C | 1 |
| Continuous drain current | ID | | | 2.1 | A | VGS at 10 V, TC = 100 °C | 1 |
| Pulsed drain current | IDM | | | 13 | A | TC = 25 °C | 1 |
| Linear derating factor | | | | 0.4 | W/°C | TC = 25 °C | 1 |
| Single pulse avalanche energy | EAS | | | 190 | mJ | VDD = 50 V, starting TJ = 25 °C, L = 30 mH, Rg = 25 Ω, IAS = 3.3 A | 1 |
| Repetitive avalanche current | IAR | | | 3.3 | A | TC = 25 °C | 1 |
| Repetitive avalanche energy | EAR | | | 5 | mJ | TC = 25 °C | 1 |
| Maximum power dissipation | PD | | | 50 | W | TC = 25 °C | 1 |
| Peak diode recovery dV/dt | dV/dt | | | 4 | V/ns | ISD ≤ 3.3 A, dI/dt ≤ 65 A/μs, VDD ≤ VDS, TJ ≤ 150 °C | 1 |
| Operating junction and storage temperature range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Soldering recommendations (peak temperature) | | | | 300 | °C | For 10 s, 1.6 mm from case | 1 |
| Maximum junction-to-ambient | RthJA | | | 62 | °C/W | | 2 |
| Maximum junction-to-case (drain) | RthJC | | | 2.5 | °C/W | | 2 |
| Case-to-sink, flat, greased surface | RthCS | | 0.5 | | °C/W | | 2 |
| VDS temperature coefficient | ΔVDS/TJ | | 0.51 | | V/°C | Reference to 25 °C, ID = 1 mA | 2 |
| Input capacitance | Ciss | | 410 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Output capacitance | Coss | | 120 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Reverse transfer capacitance | Crss | | 47 | | pF | VGS = 0 V, VDS = 25 V, f = 1.0 MHz | 2 |
| Turn-on delay time | td(on) | | 10 | | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 |
| Rise time | tr | | 14 | | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 |
| Turn-off delay time | td(off) | | 30 | | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 |
| Fall time | tf | | 13 | | ns | VDD = 200 V, ID = 3.3 A, Rg = 18 Ω, RD = 56 Ω | 2 |
| Internal drain inductance | LD | | 4.5 | | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
| Internal source inductance | LS | | 7.5 | | nH | Between lead, 6 mm (0.25") from package and center of die contact | 2 |
## CAD (KiCad official)
- Symbol: `IRF720PBF`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `irf720pbf-etched.step` / `irf720pbf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irf720pbf.step` / `irf720pbf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Vishay Intertech datasheet](docs/irf720pbf-datasheet.pdf) (7 pp, sha256 `171a1ad49d23a00a`, retrieved 2026-10-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/irf720pbf-datasheet.pdf)