component
IPP26CN10NG-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, TO-220AB. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
IPP26CN10NG-VB
VBsemi Elec · MOSFETs · TO-220AB
IPP26CN10NG-VB from VBsemi Elec, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the gate-source voltage is rated at ±20 V. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated at 100 V and the datasheet specifies a continuous drain current of 70 A (package limited). |
| 3 | S | passive | Source terminal; the source-drain diode is rated at a continuous current of 70 A and a pulsed current of 115 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-220AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 100 | V | 1 | |||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 70 | A | TC = 25 °C (TJ = 175 °C) | 1 | ||
| Continuous Drain Current | ID | 35 | A | TC = 125 °C | 1 | ||
| Pulsed Drain Current | IDM | 145 | A | 1 | |||
| Single Pulse Avalanche Energy | EAS | 60 | mJ | 1 | |||
| Maximum Power Dissipation | PD | 355 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 3.35 | W | TA = 25 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Junction-to-Ambient Thermal Resistance | RthJA | 40 | °C/W | PCB Mount | 1 | ||
| Junction-to-Case Thermal Resistance | RthJC | 0.4 | °C/W | Junction-to-Case (Drain) | 1 | ||
| Drain-Source Breakdown Voltage | V(BR)DSS | 100 | V | VDS = 0 V, ID = 250 µA | 2 | ||
| Gate-Body Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 100 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 50 | µA | VDS = 100 V, VGS = 0 V, TJ = 125 °C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 250 | µA | VDS = 100 V, VGS = 0 V, TJ = 175 °C | 2 | ||
| On-State Drain Current | ID(on) | 120 | A | VDS ≥ 5 V, VGS = 10 V | 2 | ||
| Drain-Source On-State Resistance | rDS(on) | 0.023 | Ω | VGS = 10 V, ID = 30 A, TJ = 125 °C | 2 | ||
| Drain-Source On-State Resistance | rDS(on) | 0.037 | Ω | VGS = 10 V, ID = 30 A, TJ = 175 °C | 2 | ||
| Forward Transconductance | gfs | 25 | S | VDS = 15 V, ID = 30 A | 2 | ||
| Gate Resistance | Rg | 0.5 | 1.3 | 3.1 | Ω | 2 | |
| Turn-On Delay Time | td(on) | 24 | 35 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Rise Time | tr | 220 | 330 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 45 | 70 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Fall Time | tf | 200 | 300 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 | |
| Continuous Current | IS | 70 | A | TC = 25 °C | 2 | ||
| Pulsed Current | ISM | 115 | A | 2 | |||
| Forward Voltage | VSD | 1 | 1.5 | V | IF = 58 A, VGS = 0 V | 2 | |
| Reverse Recovery Time | trr | 130 | 200 | ns | IF = 30 A, di/dt = 100 A/µs | 2 | |
| Peak Reverse Recovery Current | IRM(REC) | 8 | 12 | A | 2 | ||
| Reverse Recovery Charge | Qrr | 0.52 | 1.2 | µC | 2 |
CAD (KiCad official)
- Symbol:
IPP26CN10NG-VB - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files:
ipp26cn10ng-vb-etched.step/ipp26cn10ng-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipp26cn10ng-vb.step/ipp26cn10ng-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (7 pp, sha256
9254435b29716a0c, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IPP26CN10NG-VB
**VBsemi Elec** · MOSFETs · TO-220AB
IPP26CN10NG-VB from VBsemi Elec, in a TO-220AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal; the gate-source voltage is rated at ±20 V. |
| 2 | D | passive | Drain terminal; drain-source voltage is rated at 100 V and the datasheet specifies a continuous drain current of 70 A (package limited). |
| 3 | S | passive | Source terminal; the source-drain diode is rated at a continuous current of 70 A and a pulsed current of 115 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-220AB |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 100 | V | | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | 70 | A | TC = 25 °C (TJ = 175 °C) | 1 |
| Continuous Drain Current | ID | | | 35 | A | TC = 125 °C | 1 |
| Pulsed Drain Current | IDM | | | 145 | A | | 1 |
| Single Pulse Avalanche Energy | EAS | | | 60 | mJ | | 1 |
| Maximum Power Dissipation | PD | | | 355 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 3.35 | W | TA = 25 °C | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 175 | °C | | 1 |
| Junction-to-Ambient Thermal Resistance | RthJA | | | 40 | °C/W | PCB Mount | 1 |
| Junction-to-Case Thermal Resistance | RthJC | | | 0.4 | °C/W | Junction-to-Case (Drain) | 1 |
| Drain-Source Breakdown Voltage | V(BR)DSS | 100 | | | V | VDS = 0 V, ID = 250 µA | 2 |
| Gate-Body Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 100 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 50 | µA | VDS = 100 V, VGS = 0 V, TJ = 125 °C | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 250 | µA | VDS = 100 V, VGS = 0 V, TJ = 175 °C | 2 |
| On-State Drain Current | ID(on) | 120 | | | A | VDS ≥ 5 V, VGS = 10 V | 2 |
| Drain-Source On-State Resistance | rDS(on) | | | 0.023 | Ω | VGS = 10 V, ID = 30 A, TJ = 125 °C | 2 |
| Drain-Source On-State Resistance | rDS(on) | | | 0.037 | Ω | VGS = 10 V, ID = 30 A, TJ = 175 °C | 2 |
| Forward Transconductance | gfs | 25 | | | S | VDS = 15 V, ID = 30 A | 2 |
| Gate Resistance | Rg | 0.5 | 1.3 | 3.1 | Ω | | 2 |
| Turn-On Delay Time | td(on) | | 24 | 35 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 |
| Rise Time | tr | | 220 | 330 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 45 | 70 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 |
| Fall Time | tf | | 200 | 300 | ns | VDD = 100 V, RL = 1.5 Ω, ID ≅ 58 A, VGEN = 10 V, Rg = 2.5 Ω | 2 |
| Continuous Current | IS | | | 70 | A | TC = 25 °C | 2 |
| Pulsed Current | ISM | | | 115 | A | | 2 |
| Forward Voltage | VSD | | 1 | 1.5 | V | IF = 58 A, VGS = 0 V | 2 |
| Reverse Recovery Time | trr | | 130 | 200 | ns | IF = 30 A, di/dt = 100 A/µs | 2 |
| Peak Reverse Recovery Current | IRM(REC) | | 8 | 12 | A | | 2 |
| Reverse Recovery Charge | Qrr | | 0.52 | 1.2 | µC | | 2 |
## CAD (KiCad official)
- Symbol: `IPP26CN10NG-VB`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220AB (KiCad packages3D, STEP)
- 3D model files: `ipp26cn10ng-vb-etched.step` / `ipp26cn10ng-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ipp26cn10ng-vb.step` / `ipp26cn10ng-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/ipp26cn10ng-vb-datasheet.pdf) (7 pp, sha256 `9254435b29716a0c`, retrieved 2026-11-02, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ipp26cn10ng-vb-datasheet.pdf)