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IPD90R1K2C3
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Infineon Technologies MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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IPD90R1K2C3
Infineon Technologies · MOSFETs · TO-252
IPD90R1K2C3 from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate pin; gate-source voltage is rated ±20 V static and ±30 V AC (f>1 Hz), with threshold VGS(th) of 2.5 to 3.5 V. |
| 2 | D | passive | Drain pin, also connected to the tab; drain-source voltage is 900 V at TJ=25 °C and continuous drain current is 5.1 A at TC=25 °C. |
| 3 | S | passive | Source pin; carries the full drain current, with continuous diode forward current of 2.8 A at TC=25 °C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | V(BR)DSS | 900 | V | V_GS=0 V, I_D=250 µA | 2 | ||
| Gate threshold voltage | V_GS(th) | 2.5 | 3 | 3.5 | V | V_DS=V_GS, I_D=0.31 mA | 2 |
| Zero gate voltage drain current | I_DSS | 1 | µA | V_DS=900 V, V_GS=0 V, T_j=25 °C | 2 | ||
| Gate-source leakage current | I_GSS | 100 | nA | V_GS=20 V, V_DS=0 V | 2 | ||
| Drain-source on-state resistance | R_DS(on) | 0.94 | 1.2 | Ω | V_GS=10 V, I_D=2.8 A, T_j=25 °C | 2 | |
| Diode forward voltage | V_SD | 0.8 | 1.2 | V | V_GS=0 V, I_F=2.8 A, T_j=25 °C | 3 | |
| Continuous drain current | I_D | 5.1 | A | T_C=25 °C | 1 | ||
| Continuous drain current | I_D | 3.2 | A | T_C=100 °C | 1 | ||
| Pulsed drain current | I_D,pulse | 10 | A | T_C=25 °C | 1 | ||
| Avalanche energy, single pulse | E_AS | 68 | mJ | I_D=0.92 A, V_DD=50 V | 1 | ||
| Avalanche energy, repetitive | E_AR | 0.31 | mJ | I_D=0.92 A, V_DD=50 V | 1 | ||
| Avalanche current, repetitive | I_AR | 0.92 | A | 1 | |||
| MOSFET dv/dt ruggedness | dv/dt | 50 | V/ns | V_DS=0...400 V | 1 | ||
| Gate source voltage, static | V_GS | -20 | 20 | V | static | 1 | |
| Gate source voltage, AC (f>1 Hz) | V_GS | -30 | 30 | V | AC (f>1 Hz) | 1 | |
| Power dissipation | P_tot | 83 | W | T_C=25 °C | 1 | ||
| Operating and storage temperature | T_J, T_stg | -55 | 150 | °C | 1 | ||
| Continuous diode forward current | I_S | 2.8 | A | T_C=25 °C | 2 | ||
| Diode pulse current | I_S,pulse | 11 | A | 2 | |||
| Reverse diode dv/dt | dv/dt | 4 | V/ns | 2 | |||
| Thermal resistance, junction - case | R_thJC | 1.5 | K/W | 2 | |||
| Thermal resistance, junction - ambient, leaded | R_thJA | 62 | K/W | 2 | |||
| Soldering temperature, wavesoldering, leads only | T_sold | 260 | °C | 1.6 mm (0.063 in.) from case for 10 s | 2 |
CAD (KiCad official)
- Symbol:
IPD90R1K2C3 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ipd90r1k2c3-etched.step/ipd90r1k2c3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipd90r1k2c3.step/ipd90r1k2c3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (10 pp, sha256
1c6893dea0aaa1c7, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IPD90R1K2C3
**Infineon Technologies** · MOSFETs · TO-252
IPD90R1K2C3 from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate pin; gate-source voltage is rated ±20 V static and ±30 V AC (f>1 Hz), with threshold VGS(th) of 2.5 to 3.5 V. |
| 2 | D | passive | Drain pin, also connected to the tab; drain-source voltage is 900 V at TJ=25 °C and continuous drain current is 5.1 A at TC=25 °C. |
| 3 | S | passive | Source pin; carries the full drain current, with continuous diode forward current of 2.8 A at TC=25 °C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | V(BR)DSS | 900 | | | V | V_GS=0 V, I_D=250 µA | 2 |
| Gate threshold voltage | V_GS(th) | 2.5 | 3 | 3.5 | V | V_DS=V_GS, I_D=0.31 mA | 2 |
| Zero gate voltage drain current | I_DSS | | | 1 | µA | V_DS=900 V, V_GS=0 V, T_j=25 °C | 2 |
| Gate-source leakage current | I_GSS | | | 100 | nA | V_GS=20 V, V_DS=0 V | 2 |
| Drain-source on-state resistance | R_DS(on) | | 0.94 | 1.2 | Ω | V_GS=10 V, I_D=2.8 A, T_j=25 °C | 2 |
| Diode forward voltage | V_SD | | 0.8 | 1.2 | V | V_GS=0 V, I_F=2.8 A, T_j=25 °C | 3 |
| Continuous drain current | I_D | | | 5.1 | A | T_C=25 °C | 1 |
| Continuous drain current | I_D | | | 3.2 | A | T_C=100 °C | 1 |
| Pulsed drain current | I_D,pulse | | | 10 | A | T_C=25 °C | 1 |
| Avalanche energy, single pulse | E_AS | | | 68 | mJ | I_D=0.92 A, V_DD=50 V | 1 |
| Avalanche energy, repetitive | E_AR | | | 0.31 | mJ | I_D=0.92 A, V_DD=50 V | 1 |
| Avalanche current, repetitive | I_AR | | | 0.92 | A | | 1 |
| MOSFET dv/dt ruggedness | dv/dt | | | 50 | V/ns | V_DS=0...400 V | 1 |
| Gate source voltage, static | V_GS | -20 | | 20 | V | static | 1 |
| Gate source voltage, AC (f>1 Hz) | V_GS | -30 | | 30 | V | AC (f>1 Hz) | 1 |
| Power dissipation | P_tot | | | 83 | W | T_C=25 °C | 1 |
| Operating and storage temperature | T_J, T_stg | -55 | | 150 | °C | | 1 |
| Continuous diode forward current | I_S | | | 2.8 | A | T_C=25 °C | 2 |
| Diode pulse current | I_S,pulse | | | 11 | A | | 2 |
| Reverse diode dv/dt | dv/dt | | | 4 | V/ns | | 2 |
| Thermal resistance, junction - case | R_thJC | | | 1.5 | K/W | | 2 |
| Thermal resistance, junction - ambient, leaded | R_thJA | | | 62 | K/W | | 2 |
| Soldering temperature, wavesoldering, leads only | T_sold | | | 260 | °C | 1.6 mm (0.063 in.) from case for 10 s | 2 |
## CAD (KiCad official)
- Symbol: `IPD90R1K2C3`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `ipd90r1k2c3-etched.step` / `ipd90r1k2c3-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ipd90r1k2c3.step` / `ipd90r1k2c3.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Infineon Technologies datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588885322352091136) (10 pp, sha256 `1c6893dea0aaa1c7`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ipd90r1k2c3-datasheet.pdf)