component
IPD038N06NF2SATMA1
Public Made by Adomby adom
Infineon Technologies MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IPD038N06NF2SATMA1
Infineon Technologies · MOSFETs · TO-252
IPD038N06NF2SATMA1 from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET, with a gate-source voltage rating of -20 V to 20 V. |
| 2 | Drain | passive | Drain terminal, connected to the mounting tab of the PG-TO252-3 package. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current | I_D | 120 | A | V_GS=10 V, T=25 °C | 3 | ||
| Continuous drain current | I_D | 86 | A | V_GS=10 V, T=100 °C | 3 | ||
| Continuous drain current | I_D | 20 | A | V_GS=10 V, T=25 °C, R_thJA=50 °C/W | 3 | ||
| Pulsed drain current | I_D,pulse | 480 | A | T=25 °C | 3 | ||
| Avalanche energy, single pulse | E_AS | 94 | mJ | I_D=60 A, R_GS=25 Ω | 3 | ||
| Gate source voltage | V_GS | -20 | 20 | V | 3 | ||
| Power dissipation | P_tot | 107 | W | T=25 °C | 3 | ||
| Power dissipation | P_tot | 3 | W | T=25 °C, R_thJA=50 °C/W | 3 | ||
| Operating and storage temperature | T_j, T_stg | -55 | 175 | °C | 3 | ||
| Thermal resistance, junction-case | R_thJC | 1.4 | °C/W | 4 | |||
| Thermal resistance, junction-ambient, 6 cm² cooling area | R_thJA | 50 | °C/W | 4 | |||
| Thermal resistance, junction-ambient, minimal footprint | R_thJA | 75 | °C/W | 4 | |||
| Drain-source breakdown voltage | V(BR)DSS | 60 | V | V_GS=0 V, I_D=1 mA | 5 | ||
| Gate threshold voltage | V_GS(th) | 2.1 | 2.8 | 3.3 | V | V_DS=V_GS, I_D=52 μA | 5 |
| Zero gate voltage drain current | I_DSS | 0.5 | 10 | μA | V_DS=60 V, V_GS=0 V, T=25 °C | 5 | |
| Zero gate voltage drain current | I_DSS | 1 | 100 | μA | V_DS=60 V, V_GS=0 V, T=125 °C | 5 | |
| Gate-source leakage current | I_GSS | 10 | 100 | nA | V_GS=20 V, V_DS=0 V | 5 | |
| Drain-source on-state resistance | R_DS(on) | 3.4 | 4.5 | mΩ | V_GS=10 V, I_D=60 A | 5 | |
| Drain-source on-state resistance | R_DS(on) | 3.85 | 6.3 | mΩ | V_GS=6 V, I_D=30 A | 5 | |
| Transconductance | g_fs | 55 | S | /V_DS/≥2/I_D/R_DS(on)max, I_D=60 A | 5 | ||
| Gate charge total | Q_g | 45 | 68 | nC | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 5 | |
| Diode continuous forward current | I_S | 89 | A | T=25 °C | 6 | ||
| Diode pulse current | I_S,pulse | 480 | A | T=25 °C | 6 | ||
| Diode forward voltage | V_SD | 0.93 | 1.1 | V | V_GS=0 V, I_F=60 A, T=25 °C | 6 | |
| Gate resistance | R_G | 3.2 | Ω | 5 | |||
| Input capacitance | C_iss | 3000 | pF | V_GS=0 V, V_DS=30 V, f=1 MHz | 5 | ||
| Output capacitance | C_oss | 670 | pF | V_GS=0 V, V_DS=30 V, f=1 MHz | 5 | ||
| Reverse transfer capacitance | C_rss | 43 | pF | V_GS=0 V, V_DS=30 V, f=1 MHz | 5 | ||
| Turn-on delay time | t_d(on) | 26 | ns | V_DD=30 V, V_GS=10 V, I_D=60 A, R_G,ext=1.6 Ω | 5 | ||
| Rise time | t_r | 23 | ns | V_DD=30 V, V_GS=10 V, I_D=60 A, R_G,ext=1.6 Ω | 5 | ||
| Turn-off delay time | t_d(off) | 45 | ns | V_DD=30 V, V_GS=10 V, I_D=60 A, R_G,ext=1.6 Ω | 5 | ||
| Fall time | t_f | 13 | ns | V_DD=30 V, V_GS=10 V, I_D=60 A, R_G,ext=1.6 Ω | 5 | ||
| Gate to source charge | Q_gs | 14 | nC | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 5 | ||
| Gate charge at threshold | Q_g(th) | 8.5 | nC | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 5 | ||
| Gate to drain charge | Q_gd | 8.8 | nC | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 5 | ||
| Switching charge | Q_sw | 15 | nC | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 5 | ||
| Gate plateau voltage | V_plateau | 4.7 | V | V_DD=30 V, I_D=60 A, V_GS=0 to 10 V | 6 | ||
| Gate charge total, sync. FET | Q_g(sync) | 41 | nC | V_DS=0.1 V, V_GS=0 to 10 V | 6 | ||
| Output charge | Q_oss | 46 | nC | V_DD=30 V, V_GS=0 V | 6 | ||
| Reverse recovery time | t_rr | 39 | ns | V_R=30 V, I_F=60 A, di_F/dt=100 A/μs | 6 | ||
| Reverse recovery charge | Q_rr | 39 | nC | V_R=30 V, I_F=60 A, di_F/dt=100 A/μs | 6 | ||
| Reverse recovery time | t_rr | 25 | ns | V_R=30 V, I_F=60 A, di_F/dt=500 A/μs | 6 | ||
| Reverse recovery charge | Q_rr | 97 | nC | V_R=30 V, I_F=60 A, di_F/dt=500 A/μs | 6 |
CAD (KiCad official)
- Symbol:
IPD038N06NF2SATMA1 - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ipd038n06nf2satma1-etched.step/ipd038n06nf2satma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipd038n06nf2satma1.step/ipd038n06nf2satma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (13 pp, sha256
f024e5e959fd8d32, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).