IP6525T_N

{
 "schema": "adom.pads/1",
 "slug": "ip6525t-n",
 "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm",
 "generated_from": {
  "footprint": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e",
  "pins": "page.json:component.pins",
  "overrides": null
 },
 "pin1": {
  "pad": "1",
  "at": [
   -2.475,
   -1.905
  ],
  "corner": "top-left",
  "source": "silk-marker",
  "derived_from": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm@sha256:5848244c5e72002e"
 },
 "pad_count": 9,
 "symbol_pins": [
  "1",
  "2",
  "3",
  "4",
  "5",
  "6",
  "7",
  "8",
  "9"
 ],
 "paste_apertures": 4,
 "issues": [],
 "pads": [
  {
   "pad": "1",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "1",
   "name": "GND",
   "type": "power_in",
   "description": "Power ground. Return path for the internal power stage; must be tied to the exposed pad (EPAD) plane for proper thermal and electrical performance.",
   "is_pin1": true,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "2",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "2",
   "name": "SW",
   "type": "output",
   "description": "DCDC switching node. Connects to the external buck inductor. Absolute-max SW voltage range is -0.3 V to 40 V.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "3",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "3",
   "name": "BST",
   "type": "passive",
   "description": "Bootstrap pin for the high-side gate driver. Connect a bootstrap capacitor between BST and SW (placed close to the IC) to provide the drive voltage for the upper power MOSFET gate.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "4",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    -2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "4",
   "name": "HLED/EN",
   "type": "bidirectional",
   "description": "Dual-function pin. Default configuration is HLED (fast-charge status LED indicator drive); optionally can be configured as an external Enable (EN) input via factory customization.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "5",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "5",
   "name": "DM",
   "type": "bidirectional",
   "description": "USB D- (data minus) line used for fast-charge protocol handshaking (DCP/QC2.0/QC3.0/FCP/AFC). Absolute-max voltage range -0.3 V to 30 V.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "6",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "6",
   "name": "DP",
   "type": "bidirectional",
   "description": "USB D+ (data plus) line used for fast-charge protocol handshaking (DCP/QC2.0/QC3.0/FCP/AFC). Absolute-max voltage range -0.3 V to 30 V.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "7",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -0.635
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "7",
   "name": "VIN",
   "type": "power_in",
   "description": "Input supply pin, 9.6 V to 32 V (absolute-max 40 V). Place a decoupling ceramic capacitor (100 nF recommended) close to the IC.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "8",
   "kind": "smd",
   "shape": "roundrect",
   "at": [
    2.475,
    -1.905
   ],
   "rot": 0.0,
   "size": [
    1.95,
    0.6
   ],
   "layers": [
    "F.Cu",
    "F.Mask",
    "F.Paste"
   ],
   "thermal": false,
   "pin": "8",
   "name": "VOUT",
   "type": "input",
   "description": "Output voltage feedback / sense pin. Used by the internal loop to regulate the buck output (3 V-12 V typical) and provide line-drop compensation (~100 mV @ 1 A).",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  },
  {
   "pad": "9",
   "kind": "smd",
   "shape": "rect",
   "at": [
    0.0,
    0.0
   ],
   "rot": 0.0,
   "size": [
    2.41,
    3.3
   ],
   "layers": [],
   "thermal": true,
   "pin": "9",
   "name": "EPAD",
   "type": "power_in",
   "description": "Exposed thermal pad on the bottom of the ESOP-8 package. Serves as power ground and heatsink; must be soldered to a solid GND copper pour for thermal dissipation.",
   "is_pin1": false,
   "source": {
    "geometry": "SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm.kicad_mod",
    "meaning": "page.json:component.pins",
    "correspondence": "kicad: symbol pin number == pad name"
   }
  }
 ]
}