component
IKN01N60RC2ATMA1
Public Made by Adomby adom
Infineon Technologies IGBT Transistors / Modules, SOT-223-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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IKN01N60RC2ATMA1
Infineon Technologies · IGBT Transistors / Modules · SOT-223-3
IKN01N60RC2ATMA1 from Infineon Technologies, in a SOT-223-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the IGBT, rated at ±20 V continuous gate-emitter voltage (±30 V transient for tp ≤ 10 µs), with a threshold VGEth of 4.3 to 5.7 V at IC = 10 µA. |
| 2 | C | passive | Collector (also the exposed tab, which sits where the omitted centre lead would be), rated VCE = 600 V and IC = 2.2 A at Tc = 25 °C, with the integrated reverse-conducting diode cathode connected to it. |
| 3 | E | passive | Emitter of the IGBT, which is also the anode of the integrated diode, and the power return for the 1 A collector current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOT-223-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-emitter voltage | VCE | 600 | V | Tvj ≥ 25 °C | 3 | ||
| DC collector current | IC | 2.2 | A | Tc = 25 °C | 3 | ||
| DC collector current | IC | 1.3 | A | Tc = 100 °C | 3 | ||
| Pulsed collector current | ICpulse | 3 | A | tp limited by Tvjmax | 3 | ||
| Turn-off safe operating area | 3 | A | VCE ≤ 600 V, tp = 1 µs, Tvj ≤ 150 °C | 3 | |||
| Gate-emitter voltage | VGE | -20 | 20 | V | 3 | ||
| Transient gate-emitter voltage | VGE | -30 | 30 | V | tp ≤ 10 µs, D < 0.01 | 3 | |
| Short-circuit withstand time | tSC | 3 | µs | VCC ≤ 400 V, VGE = 15 V, Allowed number of short circuits < 1000, Time between short circuits ≥ 1.0 s, Tvj = 150 °C | 3 | ||
| Power dissipation | Ptot | 5.1 | W | Tc = 25 °C | 3 | ||
| Power dissipation | Ptot | 2 | W | Tc = 100 °C | 3 | ||
| Repetitive peak reverse voltage | VRRM | 600 | V | Tvj ≥ 25 °C | 5 | ||
| Diode forward current | IF | 2 | A | Tc = 25 °C | 5 | ||
| Diode forward current | IF | 1 | A | Tc = 100 °C | 5 | ||
| Diode pulsed current | IFpulse | 3 | A | tp limited by Tvjmax | 5 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Soldering temperature | Tsold | 260 | °C | wave soldering / reflow soldering (MSL1 according to JEDEC J-STA-020) | 3 | ||
| Operating junction temperature (IGBT) | Tvj | -40 | 150 | °C | 5 | ||
| Operating junction temperature (diode) | Tvj | -40 | 150 | °C | 6 | ||
| Thermal resistance junction-ambient, min. footprint | Rth(j-a) | 160 | K/W | min. footprint | 3 | ||
| Thermal resistance junction-ambient, 6 cm2 Cu | Rth(j-a) | 75 | K/W | 6 cm2 Cu on PCB | 3 | ||
| IGBT thermal resistance junction-case | Rth(j-c) | 24.4 | K/W | single cooling pulse | 3 | ||
| Diode thermal resistance junction-case | Rth(j-c) | 43.5 | K/W | single cooling pulse | 3 | ||
| Collector-emitter saturation voltage | VCEsat | 2 | 2.3 | V | IC = 1 A, VGE = 15 V, Tvj = 25 °C | 4 | |
| Collector-emitter saturation voltage | VCEsat | 2.3 | V | IC = 1 A, VGE = 15 V, Tvj = 150 °C | 4 | ||
| Gate-emitter threshold voltage | VGEth | 4.3 | 5 | 5.7 | V | IC = 10 µA, VCE = VGE | 4 |
| Zero gate-voltage collector current | ICES | 25 | µA | VCE = 600 V, VGE=0 V, Tvj = 25 °C | 4 | ||
| Zero gate-voltage collector current | ICES | 2500 | µA | VCE = 600 V, VGE=0 V, Tvj = 150 °C | 4 | ||
| Gate-emitter leakage current | IGES | 100 | nA | VCE = 0 V, VGE = 20 V | 4 | ||
| Diode forward voltage | VF | 1.85 | 2.2 | V | IF = 1 A, Tvj = 25 °C | 5 | |
| Diode forward voltage | VF | 1.9 | V | IF = 1 A, Tvj = 150 °C | 5 | ||
| Transconductance | gfs | 0.5 | S | IC = 1 A, VCE = 20 V | 4 | ||
| Input capacitance | Cies | 55 | pF | VCE = 25 V, VGE=0 V, f = 1000 kHz | 4 | ||
| Output capacitance | Coes | 4 | pF | VCE = 25 V, VGE=0 V, f = 1000 kHz | 4 | ||
| Reverse transfer capacitance | Cres | 2.5 | pF | VCE = 25 V, VGE=0 V, f = 1000 kHz | 4 | ||
| Gate charge | QG | 9 | nC | IC = 1 A, VCC = 480 V, VGE = 15 V | 4 | ||
| Turn-on energy | Eon | 25.1 | µJ | Tvj = 25 °C, IC = 1 A | 4 | ||
| Turn-off energy | Eoff | 13.5 | µJ | Tvj = 25 °C, IC = 1 A | 4 | ||
| Total switching energy | Ets | 38.7 | µJ | Tvj = 25 °C, IC = 1 A | 4 | ||
| Diode reverse recovery time | trr | 59.5 | ns | VR = 400 V, Tvj = 25 °C, IF = 1 A, -diF/dt = 272 A/µs | 5 | ||
| Diode reverse recovery charge | Qrr | 0.06 | µC | VR = 400 V, Tvj = 25 °C, IF = 1 A, -diF/dt = 272 A/µs | 5 | ||
| Diode peak reverse recovery current | Irrm | 1.9 | A | VR = 400 V, Tvj = 25 °C, IF = 1 A, -diF/dt = 272 A/µs | 5 |
CAD (KiCad official)
- Symbol:
IKN01N60RC2ATMA1 - Footprint:
Package_TO_SOT_SMD:SOT-223-3_TabPin2 - 3D model: SOT-223-3 (KiCad packages3D, STEP)
- 3D model files:
ikn01n60rc2atma1-etched.step/ikn01n60rc2atma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ikn01n60rc2atma1.step/ikn01n60rc2atma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (17 pp, sha256
4576273d9513a5e4, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).