component
IHW20N140R5LXKSA1
Public Made by Adomby adom
Infineon Technologies IGBT Transistors / Modules, TO-247-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IHW20N140R5LXKSA1
Infineon Technologies · IGBT Transistors / Modules · TO-247-3
IHW20N140R5LXKSA1 from Infineon Technologies, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; drive with VGE = 0/15 V, maximum ±20 V continuous (±25 V transient for tp ≤ 10 µs), gate threshold 4 to 6.2 V at IC = 0.28 mA. |
| 2 | C | passive | Collector (also the body-diode cathode); VCE rated 1400 V, DC collector current 40 A at Tc = 25 °C and 38 A at Tc = 100 °C. |
| 3 | E | passive | Emitter (also the body-diode anode); power return, internal emitter inductance 13 nH measured 5 mm from the case. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-247-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-emitter voltage | VCE | 1400 | V | Tvj ≥ 25 °C | 3 | ||
| DC collector current | IC | 40 | A | limited by bondwire, Tc = 25 °C | 3 | ||
| DC collector current | IC | 38 | A | limited by bondwire, Tc = 100 °C | 3 | ||
| Pulsed collector current | ICpulse | 60 | A | tp limited by Tvjmax | 3 | ||
| Non repetitive peak collector current | ICSM | 200 | A | capacitor charging saturation current, Tvj < 175 °C, tp < 3 µs | 3 | ||
| Turn-off safe operating area | VCE | 60 | A | VCE ≤ 1400 V, Tvj ≤ 175 °C, dV/dt < 1 kV/µs | 3 | ||
| Gate-emitter voltage | VGE | -20 | 20 | V | 3 | ||
| Transient gate-emitter voltage | VGE | -25 | 25 | V | tp ≤ 10 µs, D < 0.01 | 3 | |
| Power dissipation | Ptot | 211 | W | Tc = 25 °C | 3 | ||
| Power dissipation | Ptot | 106 | W | Tc = 100 °C | 3 | ||
| Diode forward current | IF | 40 | A | limited by bondwire, Tc = 25 °C | 5 | ||
| Diode pulsed current | IFpulse | 60 | A | tp limited by Tvjmax | 5 | ||
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Soldering temperature | Tsold | 260 | °C | wave soldering 1.6 mm (0.063 in.) from case for 10 s | 3 | ||
| Mounting torque | M | 0.6 | Nm | M3 screw, maximum of mounting processes | 3 | ||
| Operating junction temperature | Tvj | -40 | 175 | °C | 4 | ||
| Collector-emitter breakdown voltage | VBRCES | 1400 | V | IC = 0.5 mA, VGE = 0 V | 4 | ||
| Collector-emitter saturation voltage | VCEsat | 1.7 | 1.9 | V | IC = 20 A, VGE = 15 V, Tvj = 25 °C | 4 | |
| Collector-emitter saturation voltage | VCEsat | 1.9 | V | IC = 20 A, VGE = 15 V, Tvj = 125 °C | 4 | ||
| Collector-emitter saturation voltage | VCEsat | 2 | V | IC = 20 A, VGE = 15 V, Tvj = 175 °C | 4 | ||
| Collector-emitter saturation voltage | VCEsat | 1.55 | 1.75 | V | IC = 15 A, VGE = 15 V, Tvj = 25 °C | 4 | |
| Collector-emitter saturation voltage | VCEsat | 1.7 | V | IC = 15 A, VGE = 15 V, Tvj = 125 °C | 4 | ||
| Collector-emitter saturation voltage | VCEsat | 1.75 | V | IC = 15 A, VGE = 15 V, Tvj = 175 °C | 4 | ||
| Gate-emitter threshold voltage | VGEth | 4 | 5.6 | 6.2 | V | IC = 0.28 mA, VCE = VGE | 4 |
| Zero gate-voltage collector current | ICES | 100 | µA | VCE = 1400 V, VGE = 0 V, Tvj = 25 °C | 4 | ||
| Zero gate-voltage collector current | ICES | 460 | µA | VCE = 1400 V, VGE = 0 V, Tvj = 175 °C | 4 | ||
| Gate-emitter leakage current | IGES | 100 | nA | VCE = 0 V, VGE = 20 V | 4 | ||
| Diode forward voltage | VF | 1.6 | 1.9 | V | IF = 20 A, Tvj = 25 °C | 5 | |
| Diode forward voltage | VF | 1.8 | V | IF = 20 A, Tvj = 125 °C | 5 | ||
| Diode forward voltage | VF | 1.85 | V | IF = 20 A, Tvj = 175 °C | 5 | ||
| Diode forward voltage | VF | 1.5 | 1.8 | V | IF = 15 A, Tvj = 25 °C | 5 | |
| Diode forward voltage | VF | 1.6 | V | IF = 15 A, Tvj = 125 °C | 5 | ||
| Diode forward voltage | VF | 1.65 | V | IF = 15 A, Tvj = 175 °C | 5 | ||
| Thermal resistance, junction-ambient | Rth(j-a) | 40 | K/W | junction-ambient | 3 | ||
| IGBT thermal resistance, junction-case | Rth(j-c) | 0.71 | K/W | IGBT, junction-case | 3 | ||
| Diode thermal resistance, junction-case | Rth(j-c) | 0.71 | K/W | diode, junction-case | 3 | ||
| Internal emitter inductance | LE | 13 | nH | measured 5 mm (0.197 in.) from case | 3 | ||
| Transconductance | gfs | 17.8 | S | IC = 20 A, VCE = 20 V | 4 | ||
| Input capacitance | Cies | 870 | pF | VCE = 25 V, VGE = 0 V, f = 100 kHz | 4 | ||
| Output capacitance | Coes | 28 | pF | VCE = 25 V, VGE = 0 V, f = 100 kHz | 4 | ||
| Reverse transfer capacitance | Cres | 22 | pF | VCE = 25 V, VGE = 0 V, f = 100 kHz | 4 | ||
| Gate charge | QG | 125 | nC | VCC = 1120 V, IC = 20 A, VGE = 15 V | 4 | ||
| Turn-off delay time | td(off) | 150 | ns | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 25 °C, IC = 20 A | 4 | ||
| Turn-off delay time | td(off) | 160 | ns | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 175 °C, IC = 20 A | 4 | ||
| Fall time (inductive load) | tf | 1090 | ns | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 25 °C, IC = 20 A | 4 | ||
| Fall time (inductive load) | tf | 1890 | ns | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 175 °C, IC = 20 A | 4 | ||
| Soft turn-off energy | Eoff | 0.07 | mJ | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 25 °C, IC = 20 A | 4 | ||
| Soft turn-off energy | Eoff | 0.17 | mJ | VGE = 0/15 V, RG(off) = 10 Ω, Cr = 270 nF, L = 77 µH, R = 2.2 Ω, Tvj = 175 °C, IC = 20 A | 4 |
CAD (KiCad official)
- Symbol:
IHW20N140R5LXKSA1 - Footprint:
Package_TO_SOT_THT:TO-247-3_Vertical - 3D model: TO-247-3 (KiCad packages3D, STEP)
- 3D model files:
ihw20n140r5lxksa1-etched.step/ihw20n140r5lxksa1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ihw20n140r5lxksa1.step/ihw20n140r5lxksa1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (14 pp, sha256
79b89bed133cf959, retrieved 2026-10-15, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).