component
HYG350P13NA1B
Public Made by Adomby adom
HUAYI MOSFETs, TO-263-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HYG350P13NA1B
HUAYI · MOSFETs · TO-263-2
HYG350P13NA1B from HUAYI, in a TO-263-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, threshold -1.0 to -3.0 V (VDS=VGS, IDS=-250µA). |
| 2 | D | passive | Drain (exposed tab, middle lead removed in TO-263-2L); drain-source voltage -125 V, continuous drain current -39 A at Tc=25°C. |
| 3 | S | passive | Source; continuous body-diode source current -39 A at Tc=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-263-2 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -125 | V | Tc=25°C | 2 | ||
| Gate-Source Voltage | VGSS | -20 | 20 | V | Tc=25°C | 2 | |
| Maximum Junction Temperature | TJ | 175 | °C | 2 | |||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 2 | ||
| Source Current-Continuous (Body Diode) | IS | -39 | A | Tc=25°C, Mounted on Large Heat Sink | 2 | ||
| Pulsed Drain Current | IDM | -150 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -39 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -27 | A | Tc=100°C | 2 | ||
| Maximum Power Dissipation | PD | 120 | W | Tc=25°C | 2 | ||
| Maximum Power Dissipation | PD | 60 | W | Tc=100°C | 2 | ||
| Thermal Resistance, Junction-to-Case | RJC | 1.25 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RJA | 62 | °C/W | Surface mounted on FR-4 board | 2 | ||
| Single Pulsed-Avalanche Energy | EAS | 388.7 | mJ | L=0.3mH | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | -125 | V | VGS=0V,IDS=250μA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -1 | μA | VDS=-125V,VGS=0V | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -50 | μA | VDS=-125V,VGS=0V, TJ=100°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | -1 | -2.4 | -3 | V | VDS=VGS, IDS=-250μA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 35 | 43 | mΩ | VGS=-10V,IDS=-20A | 2 | |
| Diode Forward Voltage | VSD | -0.84 | -1.3 | V | ISD=-20A,VGS=0V | 2 | |
| Reverse Recovery Time | trr | 35.6 | ns | ISD=-20A, dISD/dt=100A/μs | 2 | ||
| Reverse Recovery Charge | Qrr | 58.2 | nC | ISD=-20A, dISD/dt=100A/μs | 2 | ||
| Gate Resistance | RG | 3 | Ω | VGS=0V,VDS=0V,F=1MHz | 3 | ||
| Input Capacitance | Ciss | 4118 | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 | ||
| Output Capacitance | Coss | 285 | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 194.8 | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 | ||
| Turn-on Delay Time | td(ON) | 35.2 | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 | ||
| Turn-on Rise Time | Tr | 101.2 | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 | ||
| Turn-off Delay Time | td(OFF) | 35 | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 | ||
| Turn-off Fall Time | Tf | 92.3 | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 | ||
| Total Gate Charge | Qg(10V) | 79.4 | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 | ||
| Gate-Source Charge | Qgs | 13 | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 | ||
| Gate-Drain Charge | Qgd | 30.3 | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 |
CAD (KiCad official)
- Symbol:
HYG350P13NA1B - Footprint:
Package_TO_SOT_SMD:TO-263-2 - 3D model: TO-263-2 (KiCad packages3D, STEP)
- 3D model files:
hyg350p13na1b-etched.step/hyg350p13na1b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hyg350p13na1b.step/hyg350p13na1b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUAYI datasheet (9 pp, sha256
d38e66ad8d944c02, retrieved 2026-10-30, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HYG350P13NA1B
**HUAYI** · MOSFETs · TO-263-2
HYG350P13NA1B from HUAYI, in a TO-263-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, threshold -1.0 to -3.0 V (VDS=VGS, IDS=-250µA). |
| 2 | D | passive | Drain (exposed tab, middle lead removed in TO-263-2L); drain-source voltage -125 V, continuous drain current -39 A at Tc=25°C. |
| 3 | S | passive | Source; continuous body-diode source current -39 A at Tc=25°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-263-2 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | -125 | V | Tc=25°C | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | Tc=25°C | 2 |
| Maximum Junction Temperature | TJ | | | 175 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 175 | °C | | 2 |
| Source Current-Continuous (Body Diode) | IS | | | -39 | A | Tc=25°C, Mounted on Large Heat Sink | 2 |
| Pulsed Drain Current | IDM | | | -150 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | -39 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | -27 | A | Tc=100°C | 2 |
| Maximum Power Dissipation | PD | | | 120 | W | Tc=25°C | 2 |
| Maximum Power Dissipation | PD | | | 60 | W | Tc=100°C | 2 |
| Thermal Resistance, Junction-to-Case | RJC | | | 1.25 | °C/W | | 2 |
| Thermal Resistance, Junction-to-Ambient | RJA | | | 62 | °C/W | Surface mounted on FR-4 board | 2 |
| Single Pulsed-Avalanche Energy | EAS | | | 388.7 | mJ | L=0.3mH | 2 |
| Drain-Source Breakdown Voltage | BVDSS | -125 | | | V | VGS=0V,IDS=250μA | 2 |
| Drain-to-Source Leakage Current | IDSS | | | -1 | μA | VDS=-125V,VGS=0V | 2 |
| Drain-to-Source Leakage Current | IDSS | | | -50 | μA | VDS=-125V,VGS=0V, TJ=100°C | 2 |
| Gate Threshold Voltage | VGS(th) | -1 | -2.4 | -3 | V | VDS=VGS, IDS=-250μA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Drain-Source On-State Resistance | RDS(ON) | | 35 | 43 | mΩ | VGS=-10V,IDS=-20A | 2 |
| Diode Forward Voltage | VSD | | -0.84 | -1.3 | V | ISD=-20A,VGS=0V | 2 |
| Reverse Recovery Time | trr | | 35.6 | | ns | ISD=-20A, dISD/dt=100A/μs | 2 |
| Reverse Recovery Charge | Qrr | | 58.2 | | nC | ISD=-20A, dISD/dt=100A/μs | 2 |
| Gate Resistance | RG | | 3 | | Ω | VGS=0V,VDS=0V,F=1MHz | 3 |
| Input Capacitance | Ciss | | 4118 | | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 |
| Output Capacitance | Coss | | 285 | | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 |
| Reverse Transfer Capacitance | Crss | | 194.8 | | pF | VGS=0V, VDS= -25V, Frequency=1.0MHz | 3 |
| Turn-on Delay Time | td(ON) | | 35.2 | | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 |
| Turn-on Rise Time | Tr | | 101.2 | | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 |
| Turn-off Delay Time | td(OFF) | | 35 | | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 |
| Turn-off Fall Time | Tf | | 92.3 | | ns | VDD=-62V,RG=4Ω,IDS=-20A,VGS=-10V | 3 |
| Total Gate Charge | Qg(10V) | | 79.4 | | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 |
| Gate-Source Charge | Qgs | | 13 | | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 |
| Gate-Drain Charge | Qgd | | 30.3 | | nC | VDS =-100V, VGS=-10V, ID=-20A | 3 |
## CAD (KiCad official)
- Symbol: `HYG350P13NA1B`
- Footprint: `Package_TO_SOT_SMD:TO-263-2`
- 3D model: TO-263-2 (KiCad packages3D, STEP)
- 3D model files: `hyg350p13na1b-etched.step` / `hyg350p13na1b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hyg350p13na1b.step` / `hyg350p13na1b.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUAYI datasheet](docs/hyg350p13na1b-datasheet.pdf) (9 pp, sha256 `d38e66ad8d944c02`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hyg350p13na1b-datasheet.pdf)