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HX24LC08BDRG

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HANSCHIP semiconductor EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HX24LC08BDRG

HANSCHIP semiconductor · EEPROM · SOIC-8

HX24LC08BDRG from HANSCHIP semiconductor, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Address input; not used (no connect, may be tied to ground) on the 8K HX24LC08B.
2 A1 input Address input; not used (no connect, may be tied to ground) on the 8K HX24LC08B.
3 A2 input Device address input, the only hard-wire address pin used by the 8K HX24LC08B, so two devices may share a bus.
4 GND power_in Ground.
5 SDA bidirectional Serial data, bidirectional open-drain pin that may be wire-ORed with other open-drain or open-collector devices.
6 SCL input Serial clock input that clocks data into the device on the positive edge and out on the negative edge.
7 WP input Write protect: at GND allows normal read/write, at VCC protects the full 8K array.
8 VCC power_in Power supply, 1.7V to 5.5V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOIC-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC Supply Voltage -0.3 6.5 V 9
Storage Temperature -65 150 ℃ 9
Lead Temperature (Soldering) 245 ℃ 10 seconds 9
Operating Ambient Temperature -40 85 ℃ 9
Supply Voltage Vcc 1.7 5.5 V 9
Supply Current Vcc=5.0V Icc1 0.4 1 mA Read @100KHz 9
Supply Current Vcc=5.0V Icc2 2 3 mA Write @100KHz 9
Standby Current ISB 2 uA Vin=Vcc or GND 9
Input Leakage Current ILI 3 uA Vin=Vcc or GND 9
Output Leakage Current ILO 0.05 3 uA Vout=Vcc or GND 9
Input Low Level VIL -0.6 V 9
Output Low Level Vcc=5.0V VOL3 0.4 V IOL=3.0mA 9
Output Low Level Vcc=3.0V VOL2 0.4 V IOL=2.1mA 9
Output Low Level Vcc=1.8V VOL1 0.2 V IOL=0.15mA 9
Input/Output Capacitance (SDA) CI/O 8 pF VI/O = 0V 9
Input Capacitance (A0, A1, A2, SCL) CIN 6 pF VIN = 0V 9
Clock Frequency, SCL (1.8-volt) fSCL 400 KHz 10
Clock Frequency, SCL (5.0-volt) fSCL 1000 KHz 10
Clock Pulse Width Low (1.8-volt) tLOW 1.2 us 10
Clock Pulse Width Low (5.0-volt) tLOW 0.6 us 10
Clock Pulse Width High (1.8-volt) tHIGH 0.6 us 10
Clock Pulse Width High (5.0-volt) tHIGH 0.4 us 10
Noise Suppression Time (1.8-volt) tI 50 us 10
Noise Suppression Time (5.0-volt) tI 40 us 10
Clock Low to Data Out Valid (1.8-volt) tAA 0.05 0.9 us 10
Clock Low to Data Out Valid (5.0-volt) tAA 0.05 0.55 us 10
Time the bus must be free before a new transmission can start (1.8-volt) tBUF 1.2 us 10
Time the bus must be free before a new transmission can start (5.0-volt) tBUF 0.5 us 10
Start Hold Time (1.8-volt) tHD.STA 0.6 us 10
Start Hold Time (5.0-volt) tHD.STA 0.25 us 10
Start Setup Time (1.8-volt) tSU.STA 0.6 us 10
Start Setup Time (5.0-volt) tSU.STA 0.25 us 10
Data In Hold Time (1.8-volt) tHD.DAT 0 us 10
Data In Hold Time (5.0-volt) tHD.DAT 0 us 10
Data In Setup Time (1.8-volt) tSU.DAT 100 ns 10
Data In Setup Time (5.0-volt) tSU.DAT 100 ns 10
Inputs Rise Time (1.8-volt) tR 0.3 us 10
Inputs Rise Time (5.0-volt) tR 0.3 us 10
Inputs Fall Time (1.8-volt) tF 300 ns 10
Inputs Fall Time (5.0-volt) tF 100 ns 10
Stop Setup Time (1.8-volt) tSU.STO 0.6 us 10
Stop Setup Time (5.0-volt) tSU.STO 0.25 us 10
Data Out Hold Time (1.8-volt) tDH 50 ns 10
Data Out Hold Time (5.0-volt) tDH 50 ns 10
Write Cycle Time (1.8-volt) tWR 5 ms 10
Write Cycle Time (5.0-volt) tWR 5 ms 10

CAD (KiCad official)

  • Symbol: HX24LC08BDRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: hx24lc08bdrg-etched.step / hx24lc08bdrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24lc08bdrg.step / hx24lc08bdrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (15 pp, sha256 570f2bebce19de80, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF