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HX24LC02BDRG

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HANSCHIP semiconductor EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HX24LC02BDRG

HANSCHIP semiconductor · EEPROM · SOP-8

HX24LC02BDRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 E0 input Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating.
2 E1 input Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating.
3 E2 input Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating.
4 GND power_in Ground reference for the power supply, to be connected to system ground.
5 SDA bidirectional Serial data, an open-drain bidirectional pin that transfers data to and from the device.
6 SCL input Serial clock input that controls data flow, with input data latched on the rising edge of SCL and output data clocked out on the falling edge.
7 WP input Write protection input that makes the whole memory array read-only when connected to the power supply, enables writes when connected to GND, and is internally pulled down to GND if left floating.
8 VCC power_in Device power supply, specified for 1.7V to 5.5V, and operation at invalid VCC voltages may produce spurious results.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Memory
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature with power applied -55 130 °C 20
Storage temperature TSTG -65 150 °C 20
Supply voltage VCC -0.5 6 V 20
Voltage on input pins VIN -0.5 6 V 20
Electrostatic pulse (human body model) VESD 5000 V Human body model 20
Lead temperature (soldering, 10 seconds) TL 245 °C Soldering, 10 seconds 20
Operating ambient temperature range TA -40 105 °C 20
Supply voltage range VCC 1.7 5.5 V 20
Supply Voltage VCC 1.7 5.5 V 20
Supply Current (Read) ICC1 0.1 mA VCC= 1.7V, Read at 1MHz 20
Supply Current (Read) ICC1 0.4 mA VCC= 5.5V, Read at 400 kHz 20
Supply Current (Read) ICC1 0.5 mA VCC= 5.5V, Read at 1MHz 20
Supply Current (Write) ICC2 0.2 mA VCC= 1.7V, Write at 400 kHz 20
Supply Current (Write) ICC2 0.5 mA VCC= 5.5V, Write at 400 kHz 20
Standby Current ISB 0.5 μA VCC = 1.7V, VIN = VCC or GND 20
Standby Current ISB 1 μA VCC = 5.5V, VIN = VCC or GND 20
Input Leakage Current ILI 1 μA VIN = VCC or GND 20
Output Leakage Current ILO 1 μA VOUT = VCC or GND 20
Input Low-Level Voltage (SDA, SCL) VIL -0.5 V 20
Low-Level Output Voltage VOL1 0.4 V VCC> 2V, IOL= 3mA 20
Low-Level Output Voltage VOL2 0.2 V VCC≤2V, IOL= 2mA 20
Input/output Capacitance (SDA) CI/O 8 pF VI/O = 0V 22
Input Capacitance (other Pins) CIN 6 pF VIN = 0V 22
Data Retention DR 200 year TA = +25°C 22
Clock Frequency, SCL fSCL 400 kHz Fast Mode, VCC = 1.7V to 5.5V 21
Clock Frequency, SCL fSCL 1000 kHz High Speed Mode, VCC = 1.7V to 5.5V 21
Clock Pulse Width Low tLOW 1300 ns Fast Mode, VCC = 1.7V to 5.5V 21
Clock Pulse Width Low tLOW 600 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Clock Pulse Width High tHIGH 600 ns Fast Mode, VCC = 1.7V to 5.5V 21
Clock Pulse Width High tHIGH 260 ns High Speed Mode, VCC = 1.7V to 5.5V 21
SDA Rise Time tR 300 ns Fast Mode, VCC = 1.7V to 5.5V 21
SDA(Out) Fall Time tF 300 ns Fast Mode, VCC = 1.7V to 5.5V 21
SDA(Out) Fall Time tF 100 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Start Hold Time tHD.STA 600 ns Fast Mode, VCC = 1.7V to 5.5V 21
Start Hold Time tHD.STA 250 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Start Setup Time tSU.STA 600 ns Fast Mode, VCC = 1.7V to 5.5V 21
Start Setup Time tSU.STA 250 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Stop Setup Time tSU.STO 600 ns Fast Mode, VCC = 1.7V to 5.5V 21
Stop Setup Time tSU.STO 250 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Bus Free Time between Stop and Next Start tBUF 1300 ns Fast Mode, VCC = 1.7V to 5.5V 21
Bus Free Time between Stop and Next Start tBUF 500 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Data In Hold Time tHD.DI 0 ns Fast Mode, VCC = 1.7V to 5.5V 21
Data In Setup Time tSU.DAT 100 ns Fast Mode, VCC = 1.7V to 5.5V 21
Data In Setup Time tSU.DAT 50 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Data Out Hold Time tHD.DAT 50 ns Fast Mode, VCC = 1.7V to 5.5V 21
SCL Low to Data Out Valid tAA 100 900 ns Fast Mode, VCC = 1.7V to 5.5V 21
SCL Low to Data Out Valid tAA 50 500 ns High Speed Mode, VCC = 1.7V to 5.5V 21
WP Pin Setup Time tSU.WP 1200 ns Fast Mode, VCC = 1.7V to 5.5V 21
WP Pin Setup Time tSU.WP 600 ns High Speed Mode, VCC = 1.7V to 5.5V 21
WP Pin Hold Time tHD.WP 1200 ns Fast Mode, VCC = 1.7V to 5.5V 21
WP Pin Hold Time tHD.WP 600 ns High Speed Mode, VCC = 1.7V to 5.5V 21
Write Cycle Time tWR 5 ms Fast Mode, VCC = 1.7V to 5.5V 21
Noise Suppression Time tI 50 ns Fast Mode, VCC = 1.7V to 5.5V 21

CAD (KiCad official)

  • Symbol: HX24LC02BDRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx24lc02bdrg-etched.step / hx24lc02bdrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24lc02bdrg.step / hx24lc02bdrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (27 pp, sha256 6e09e45aa54b1549, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF