component
HX24LC02BDRG
Public Made by Adomby adom
HANSCHIP semiconductor EEPROM, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX24LC02BDRG
HANSCHIP semiconductor · EEPROM · SOP-8
HX24LC02BDRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | E0 | input | Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating. |
| 2 | E1 | input | Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating. |
| 3 | E2 | input | Device address input that connects directly to VCC or GND to set the device address (up to eight devices on one bus), and is internally pulled down to GND if left floating. |
| 4 | GND | power_in | Ground reference for the power supply, to be connected to system ground. |
| 5 | SDA | bidirectional | Serial data, an open-drain bidirectional pin that transfers data to and from the device. |
| 6 | SCL | input | Serial clock input that controls data flow, with input data latched on the rising edge of SCL and output data clocked out on the falling edge. |
| 7 | WP | input | Write protection input that makes the whole memory array read-only when connected to the power supply, enables writes when connected to GND, and is internally pulled down to GND if left floating. |
| 8 | VCC | power_in | Device power supply, specified for 1.7V to 5.5V, and operation at invalid VCC voltages may produce spurious results. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Ambient temperature with power applied | -55 | 130 | °C | 20 | |||
| Storage temperature | TSTG | -65 | 150 | °C | 20 | ||
| Supply voltage | VCC | -0.5 | 6 | V | 20 | ||
| Voltage on input pins | VIN | -0.5 | 6 | V | 20 | ||
| Electrostatic pulse (human body model) | VESD | 5000 | V | Human body model | 20 | ||
| Lead temperature (soldering, 10 seconds) | TL | 245 | °C | Soldering, 10 seconds | 20 | ||
| Operating ambient temperature range | TA | -40 | 105 | °C | 20 | ||
| Supply voltage range | VCC | 1.7 | 5.5 | V | 20 | ||
| Supply Voltage | VCC | 1.7 | 5.5 | V | 20 | ||
| Supply Current (Read) | ICC1 | 0.1 | mA | VCC= 1.7V, Read at 1MHz | 20 | ||
| Supply Current (Read) | ICC1 | 0.4 | mA | VCC= 5.5V, Read at 400 kHz | 20 | ||
| Supply Current (Read) | ICC1 | 0.5 | mA | VCC= 5.5V, Read at 1MHz | 20 | ||
| Supply Current (Write) | ICC2 | 0.2 | mA | VCC= 1.7V, Write at 400 kHz | 20 | ||
| Supply Current (Write) | ICC2 | 0.5 | mA | VCC= 5.5V, Write at 400 kHz | 20 | ||
| Standby Current | ISB | 0.5 | μA | VCC = 1.7V, VIN = VCC or GND | 20 | ||
| Standby Current | ISB | 1 | μA | VCC = 5.5V, VIN = VCC or GND | 20 | ||
| Input Leakage Current | ILI | 1 | μA | VIN = VCC or GND | 20 | ||
| Output Leakage Current | ILO | 1 | μA | VOUT = VCC or GND | 20 | ||
| Input Low-Level Voltage (SDA, SCL) | VIL | -0.5 | V | 20 | |||
| Low-Level Output Voltage | VOL1 | 0.4 | V | VCC> 2V, IOL= 3mA | 20 | ||
| Low-Level Output Voltage | VOL2 | 0.2 | V | VCC≤2V, IOL= 2mA | 20 | ||
| Input/output Capacitance (SDA) | CI/O | 8 | pF | VI/O = 0V | 22 | ||
| Input Capacitance (other Pins) | CIN | 6 | pF | VIN = 0V | 22 | ||
| Data Retention | DR | 200 | year | TA = +25°C | 22 | ||
| Clock Frequency, SCL | fSCL | 400 | kHz | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Frequency, SCL | fSCL | 1000 | kHz | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width Low | tLOW | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width Low | tLOW | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width High | tHIGH | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Clock Pulse Width High | tHIGH | 260 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA Rise Time | tR | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA(Out) Fall Time | tF | 300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SDA(Out) Fall Time | tF | 100 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Hold Time | tHD.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Hold Time | tHD.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Setup Time | tSU.STA | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Start Setup Time | tSU.STA | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Stop Setup Time | tSU.STO | 600 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Stop Setup Time | tSU.STO | 250 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Bus Free Time between Stop and Next Start | tBUF | 1300 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Bus Free Time between Stop and Next Start | tBUF | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Hold Time | tHD.DI | 0 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Setup Time | tSU.DAT | 100 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data In Setup Time | tSU.DAT | 50 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Data Out Hold Time | tHD.DAT | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| SCL Low to Data Out Valid | tAA | 100 | 900 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | |
| SCL Low to Data Out Valid | tAA | 50 | 500 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | |
| WP Pin Setup Time | tSU.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Setup Time | tSU.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Hold Time | tHD.WP | 1200 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| WP Pin Hold Time | tHD.WP | 600 | ns | High Speed Mode, VCC = 1.7V to 5.5V | 21 | ||
| Write Cycle Time | tWR | 5 | ms | Fast Mode, VCC = 1.7V to 5.5V | 21 | ||
| Noise Suppression Time | tI | 50 | ns | Fast Mode, VCC = 1.7V to 5.5V | 21 |
CAD (KiCad official)
- Symbol:
HX24LC02BDRG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx24lc02bdrg-etched.step/hx24lc02bdrg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx24lc02bdrg.step/hx24lc02bdrg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (27 pp, sha256
6e09e45aa54b1549, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).