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HX24C02DRG

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by adom

HANSCHIP semiconductor EEPROM, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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HX24C02DRG

HANSCHIP semiconductor · EEPROM · SOP-8

HX24C02DRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input bit 0. Hard-wired to VCC or GND to set the chip's I2C slave address. Up to eight HX24C02 devices may share one bus by strapping A0-A2 uniquely.
2 A1 input Device address input bit 1. Hard-wired to VCC or GND to set the chip's I2C slave address.
3 A2 input Device address input bit 2. Hard-wired to VCC or GND to set the chip's I2C slave address.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial data line for the two-wire I2C interface. Open-drain output; requires an external pull-up resistor to VCC. Bi-directional for reads and writes to the EEPROM array.
6 SCL input Serial clock input for the two-wire I2C interface. Positive edge clocks data into the EEPROM; negative edge clocks data out. Max 1 MHz at VCC = 5V; 400 kHz at 1.8V/2.5V/2.7V.
7 WP input Write Protect input. Tied to GND for normal read/write operation. Tied to VCC to hardware-protect the entire 2K array against write operations.
8 VCC power_in Positive supply voltage input. Operating range 1.7 V to 5.5 V. Recommend a 0.1 uF decoupling capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HX24C02DRG
  • HX24C02DRGPG
  • HX24C02DRGDGKRG
  • HX24C02DRGDBVRG
  • HX24C02DRGDDFRG

CAD (KiCad official)

  • Symbol: HX24C02DRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx24c02drg-etched.step / hx24c02drg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24c02drg.step / hx24c02drg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (17 pp, sha256 8b39cc16ac1b07de, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF