# HX1118D-3350RG

**HANSCHIP semiconductor** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · ESOP-8

HX1118D-3350RG from HANSCHIP semiconductor, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND/ADJ1 | power_in | Ground for regulator 1, which doubles as the ADJ pin for the adjustable output version; the datasheet gives no separate electrical limit for this pin. |
| 2 | VIN1 | power_in | Regulator 1 input voltage, with a recommended operating value of 12 V and an absolute maximum of 15 V. |
| 3 | GND/ADJ2 | power_in | Ground for regulator 2, which doubles as the ADJ pin for the adjustable output version; the datasheet gives no separate electrical limit for this pin. |
| 4 | VIN2 | power_in | Regulator 2 input voltage, with a recommended operating value of 12 V and an absolute maximum of 15 V. |
| 5 | VOUT2 | power_out | Regulator 2 output voltage; pins 5 and 6 are both listed as VOUT2 and are the same output. |
| 6 | VOUT2 | power_out | Regulator 2 output voltage; pins 5 and 6 are both listed as VOUT2 and are the same output. |
| 7 | VOUT1 | power_out | Regulator 1 output voltage; pins 7 and 8 are both listed as VOUT1 and are the same output. |
| 8 | VOUT1 | power_out | Regulator 1 output voltage; pins 7 and 8 are both listed as VOUT1 and are the same output. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | ESOP-8 |
| Category | Power Management (PMIC) |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 输出电压 VOUT (HX1118-3.3 channel, 25°C row) | VOUT | 3.25 | 3.3 | 3.349 | V | IOUT=10mA,VIN=5V,TJ=25℃, 0≤IOUT≤1A,4.75V≤VIN≤10V | 6 |
| 输出电压 VOUT (HX1118-3.3 channel, full temperature row) | VOUT | 3.235 | 3.3 | 3.365 | V |  | 6 |
| 输出电压 VOUT (HX1118-5.0 channel, 25°C row) | VOUT | 4.925 | 5 | 5.075 | V | IOUT=10mA,VIN=7V,TJ=25℃, 0≤ IOUT≤1A,6.5V≤VIN≤12V | 6 |
| 输出电压 VOUT (HX1118-5.0 channel, full temperature row) | VOUT | 4.9 | 5 | 5.1 | V |  | 6 |
| 线性调整 Line regulation | Rline |  | 9 | 18 | mV | VINMIN ≤VIN≤ 12V,VOUT=Fixed/Adj, IOUT=10mA | 6 |
| 负载调整 Load regulation | Rload |  | 10 | 18 | mV | 10mA≤IOUT≤ 1A,VOUT=Fixed/Adj | 6 |
| 漏失电压 Dropout voltage (100mA) | Vdrop |  | 1 | 1.2 | V | IOUT=100mA | 6 |
| 漏失电压 Dropout voltage (500mA) | Vdrop |  | 1.05 | 1.25 | V | IOUT=500mA | 6 |
| 漏失电压 Dropout voltage (800mA) | Vdrop |  | 1.2 | 1.3 | V | IOUT=800mA | 6 |
| 静态电流 Quiescent current | Iq |  | 5 | 10 | mA | 4.25V≤VIN≤ 6.5V | 6 |
| 纹波抑制比 Ripple rejection | PSRR | 60 | 75 |  | dB | fRIPPLE=120Hz,(VIN-VOUT)=3V, VRIPPLE=1VPP | 6 |
| 限流点 Current limit | Ilimit | 2.1 |  | 2.5 | A |  | 6 |
| 稳态输出电流 Steady-state output current (single channel) | IOC | 1 |  |  | A | 单路,VINMIN ≤VIN≤ 12V,TJ=25°C | 6 |
| 输入工作电压 Input voltage (absolute maximum) | VIN |  |  | 15 | V |  | 5 |
| 引脚温度 Lead temperature (soldering) | TLEAD |  |  | 260 | °C | 焊接 10 秒 | 5 |
| 工作结温范围 Operating junction temperature (absolute maximum) | TJ |  |  | 150 | °C |  | 5 |
| 储存温度 Storage temperature | TSTG | -65 |  | 150 | °C |  | 5 |
| ESD 能力 ESD capability | ESD | 2000 |  |  | V |  | 5 |
| 输入电压 Recommended input voltage | VIN |  |  | 12 | V |  | 5 |
| 工作结温范围 Recommended operating junction temperature | TJ | -40 |  | 125 | °C |  | 5 |

## CAD (KiCad official)

- Symbol: `HX1118D-3350RG`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`
- 3D model: ESOP-8 (KiCad packages3D, STEP)
- 3D model files: `hx1118d-3350rg-etched.step` / `hx1118d-3350rg-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hx1118d-3350rg.step` / `hx1118d-3350rg.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HANSCHIP semiconductor datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757796985598283776) (11 pp, sha256 `731fcbf28cb13a5b`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hx1118d-3350rg-datasheet.pdf)