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HT8837CRDZ

Public Made by Adom

by adom

HTCSEMI Brushed DC Motor Drivers, DFN-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HT8837CRDZ

HTCSEMI · Brushed DC Motor Drivers · DFN-8-EP(2x2)

HT8837CRDZ from HTCSEMI, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM power_in Motor power supply, 0 to 11 V; bypass to GND with a 0.1-µF ceramic capacitor rated for VM.
2 OUT1 output H-bridge motor output 1; connect to the motor winding.
3 OUT2 output H-bridge motor output 2; connect to the motor winding.
4 GND power_in Device ground; must be connected to the PCB ground.
5 IN2 input IN2 control input that sets the OUT2 state, with an internal pulldown of about 100 kΩ.
6 IN1 input IN1 control input that sets the OUT1 state, with an internal pulldown of about 100 kΩ.
7 nSLEEP input Sleep mode input; logic low enters low-power sleep mode, logic high gives normal operation, with an internal pulldown resistor to GND.
8 VCC power_in Logic power supply, 1.8 to 7 V; bypass to GND with a 0.1-µF ceramic capacitor rated for VCC.
9 PAD passive Exposed thermal pad, shown as GND/PPAD in the block diagram; the datasheet gives no explicit connection instructions beyond this.

Key specifications

Parameter Value
Manufacturer HTCSEMI
Package DFN-8-EP(2x2)
Category Motor Driver ICs
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Motor power-supply voltage VM -0.3 12 V 3
Logic power-supply voltage VCC -0.3 7 V 3
Control pin voltage IN1, IN2, nSLEEP -0.5 7 V 3
Operating virtual junction temperature TJ -40 150 ºC 3
Storage temperature Tstg -60 150 ºC 3
Electrostatic discharge, Human-body model (HBM) V(ESD) -4000 4000 V Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 3
Electrostatic discharge, Charged-device model (CDM) V(ESD) -1000 1000 V Charged-device model (CDM), per JEDEC JESD22-C101 3
Motor power-supply voltage VM 0 11 V 3
Logic power-supply voltage VCC 1.8 7 V 3
Motor peak current IOUT 0 1 A 3
Externally applied PWM frequency fPWM 0 250 kHz 3
Logic level input voltage VLOGIC 0 5.5 V 3
Operating ambient temperature TA -40 85 °C 3
VM operating voltage VVM 0 11 V 4
VM operating supply current, No PWM IVM 40 100 μA VVM = 5 V; VCC = 3 V; No PWM 4
VM operating supply current, 50 kHz PWM IVM 0.8 1.5 mA VVM = 5 V; VCC = 3 V; 50 kHz PWM 4
VM sleep mode supply current IVMQ 30 95 nA VVM = 5 V; VCC = 3 V; nSLEEP = 0 4
VCC operating voltage VCC 1.8 7 V 4
VCC operating supply current, No PWM IVCC 300 500 μA VVM = 5 V; VCC = 3 V; No PWM 4
VCC operating supply current, 50 kHz PWM IVCC 0.7 1.5 mA VVM = 5 V; VCC = 3 V; 50 kHz PWM 4
VCC sleep mode supply current IVCCQ 5 25 nA VVM = 5 V; VCC = 3 V; nSLEEP = 0 4
Input logic-low current IIL -5 5 μA VINx = 0 V 4
Off-state leakage current IOFF -200 200 nA VOUTx = 0 V 4
Overcurrent protection trip level IOCP 1.2 A 4
Thermal shutdown temperature TSD 150 160 180 °C Die temperature TJ 4
Output enable time t7 300 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Output disable time t8 300 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Delay time, INx high to OUTx high t9 160 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Delay time, INx low to OUTx low t10 160 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Output rise time t11 20 188 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Output fall time t12 20 188 ns VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Wake time, nSLEEP rising edge to part active twake 30 μs VVM = 5 V, VCC = 3 V, RL = 20 Ω 5
Junction-to-ambient thermal resistance RθJA 60.9 °C/W 3
Junction-to-case (top) thermal resistance RθJC(top) 71.4 °C/W 3
Junction-to-board thermal resistance RθJB 32.2 °C/W 3
Junction-to-top characterization parameter ψJT 1.6 °C/W 3
Junction-to-board characterization parameter ψJB 32.8 °C/W 3
Junction-to-case (bottom) thermal resistance RθJC(bot) 9.8 °C/W 3

CAD (KiCad official)

  • Symbol: HT8837CRDZ
  • Footprint: Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm
  • 3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: ht8837crdz-etched.step / ht8837crdz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht8837crdz.step / ht8837crdz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HTCSEMI datasheet (13 pp, sha256 e7365e9c72013bf4, retrieved 2026-10-20, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF