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HT8837CRDZ
Public Made by Adomby adom
HTCSEMI Brushed DC Motor Drivers, DFN-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHT8837CRDZ
HTCSEMI · Brushed DC Motor Drivers · DFN-8-EP(2x2)
HT8837CRDZ from HTCSEMI, in a DFN-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | power_in | Motor power supply, 0 to 11 V; bypass to GND with a 0.1-µF ceramic capacitor rated for VM. |
| 2 | OUT1 | output | H-bridge motor output 1; connect to the motor winding. |
| 3 | OUT2 | output | H-bridge motor output 2; connect to the motor winding. |
| 4 | GND | power_in | Device ground; must be connected to the PCB ground. |
| 5 | IN2 | input | IN2 control input that sets the OUT2 state, with an internal pulldown of about 100 kΩ. |
| 6 | IN1 | input | IN1 control input that sets the OUT1 state, with an internal pulldown of about 100 kΩ. |
| 7 | nSLEEP | input | Sleep mode input; logic low enters low-power sleep mode, logic high gives normal operation, with an internal pulldown resistor to GND. |
| 8 | VCC | power_in | Logic power supply, 1.8 to 7 V; bypass to GND with a 0.1-µF ceramic capacitor rated for VCC. |
| 9 | PAD | passive | Exposed thermal pad, shown as GND/PPAD in the block diagram; the datasheet gives no explicit connection instructions beyond this. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | DFN-8-EP(2x2) |
| Category | Motor Driver ICs |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Motor power-supply voltage | VM | -0.3 | 12 | V | 3 | ||
| Logic power-supply voltage | VCC | -0.3 | 7 | V | 3 | ||
| Control pin voltage IN1, IN2, nSLEEP | -0.5 | 7 | V | 3 | |||
| Operating virtual junction temperature | TJ | -40 | 150 | ºC | 3 | ||
| Storage temperature | Tstg | -60 | 150 | ºC | 3 | ||
| Electrostatic discharge, Human-body model (HBM) | V(ESD) | -4000 | 4000 | V | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 | 3 | |
| Electrostatic discharge, Charged-device model (CDM) | V(ESD) | -1000 | 1000 | V | Charged-device model (CDM), per JEDEC JESD22-C101 | 3 | |
| Motor power-supply voltage | VM | 0 | 11 | V | 3 | ||
| Logic power-supply voltage | VCC | 1.8 | 7 | V | 3 | ||
| Motor peak current | IOUT | 0 | 1 | A | 3 | ||
| Externally applied PWM frequency | fPWM | 0 | 250 | kHz | 3 | ||
| Logic level input voltage | VLOGIC | 0 | 5.5 | V | 3 | ||
| Operating ambient temperature | TA | -40 | 85 | °C | 3 | ||
| VM operating voltage | VVM | 0 | 11 | V | 4 | ||
| VM operating supply current, No PWM | IVM | 40 | 100 | μA | VVM = 5 V; VCC = 3 V; No PWM | 4 | |
| VM operating supply current, 50 kHz PWM | IVM | 0.8 | 1.5 | mA | VVM = 5 V; VCC = 3 V; 50 kHz PWM | 4 | |
| VM sleep mode supply current | IVMQ | 30 | 95 | nA | VVM = 5 V; VCC = 3 V; nSLEEP = 0 | 4 | |
| VCC operating voltage | VCC | 1.8 | 7 | V | 4 | ||
| VCC operating supply current, No PWM | IVCC | 300 | 500 | μA | VVM = 5 V; VCC = 3 V; No PWM | 4 | |
| VCC operating supply current, 50 kHz PWM | IVCC | 0.7 | 1.5 | mA | VVM = 5 V; VCC = 3 V; 50 kHz PWM | 4 | |
| VCC sleep mode supply current | IVCCQ | 5 | 25 | nA | VVM = 5 V; VCC = 3 V; nSLEEP = 0 | 4 | |
| Input logic-low current | IIL | -5 | 5 | μA | VINx = 0 V | 4 | |
| Off-state leakage current | IOFF | -200 | 200 | nA | VOUTx = 0 V | 4 | |
| Overcurrent protection trip level | IOCP | 1.2 | A | 4 | |||
| Thermal shutdown temperature | TSD | 150 | 160 | 180 | °C | Die temperature TJ | 4 |
| Output enable time | t7 | 300 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | ||
| Output disable time | t8 | 300 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | ||
| Delay time, INx high to OUTx high | t9 | 160 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | ||
| Delay time, INx low to OUTx low | t10 | 160 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | ||
| Output rise time | t11 | 20 | 188 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | |
| Output fall time | t12 | 20 | 188 | ns | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | |
| Wake time, nSLEEP rising edge to part active | twake | 30 | μs | VVM = 5 V, VCC = 3 V, RL = 20 Ω | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 60.9 | °C/W | 3 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 71.4 | °C/W | 3 | |||
| Junction-to-board thermal resistance | RθJB | 32.2 | °C/W | 3 | |||
| Junction-to-top characterization parameter | ψJT | 1.6 | °C/W | 3 | |||
| Junction-to-board characterization parameter | ψJB | 32.8 | °C/W | 3 | |||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 9.8 | °C/W | 3 |
CAD (KiCad official)
- Symbol:
HT8837CRDZ - Footprint:
Package_DFN_QFN:DFN-8-1EP_2x2mm_P0.5mm_EP0.6x1.2mm - 3D model: DFN-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
ht8837crdz-etched.step/ht8837crdz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht8837crdz.step/ht8837crdz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (13 pp, sha256
e7365e9c72013bf4, retrieved 2026-10-20, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).