component
HT8835ARDZ
Public Made by Adomby adom
HTCSEMI Stepper Motor Driver, WSON-12-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HT8835ARDZ
HTCSEMI · Stepper Motor Driver · WSON-12-EP(2x3)
HT8835ARDZ from HTCSEMI, in a WSON-12-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | power_in | Motor supply pin, recommended operating range 0 V to 11 V (absolute maximum 12 V), to be bypassed to GND with at least 0.1 µF ceramic capacitor. |
| 2 | AOUT1 | output | Bridge A output 1, connected to motor winding A. |
| 3 | AOUT2 | output | Bridge A output 2 of H-bridge A, shown with the datasheet's motor winding A connection note. |
| 4 | BOUT1 | output | Bridge B output 1, connected to motor winding B. |
| 5 | BOUT2 | output | Bridge B output 2 of H-bridge B, shown with the datasheet's motor winding B connection note. |
| 6 | GND | power_in | Device ground. |
| 7 | BIN2/BENBL | input | Bridge B input 2 / enable input: in IN/IN mode logic high sets BOUT2 high, in PH/EN mode logic high enables H-bridge B; has an internal pulldown resistor (100 kΩ typical). |
| 8 | BIN1/BPHASE | input | Bridge B input 1 / phase input: in IN/IN mode logic high sets BOUT1 high, in PH/EN mode it sets the direction of H-bridge B; has an internal pulldown resistor. |
| 9 | AIN2/AENBL | input | Bridge A input 2 / enable input: in IN/IN mode logic high sets AOUT2 high, in PH/EN mode logic high enables H-bridge A; has an internal pulldown resistor. |
| 10 | AIN1/APHASE | input | Bridge A input 1 / phase input: in IN/IN mode logic high sets AOUT1 high, in PH/EN mode it sets the direction of H-bridge A; has an internal pulldown resistor. |
| 11 | MODE | input | Input mode select: logic low selects IN/IN mode, logic high selects PH/EN mode; has an internal pulldown resistor. |
| 12 | VCC | power_in | Device logic supply, recommended operating range 2 V to 7 V, to be bypassed to GND with at least 0.1 µF ceramic capacitor. |
| 13 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | WSON-12-EP(2x3) |
| Category | Motor Driver ICs |
| Pins | 13 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Absolute max: Motor power supply voltage | VM | -0.3 | 12 | V | 2 | ||
| Absolute max: Power supply voltage | VCC | -0.3 | 7 | V | 2 | ||
| Absolute max: Operating ambient Temperature Range | TA | -40 | 125 | ℃ | 2 | ||
| Absolute max: Storage Temperature | TSTG | -65 | 150 | ℃ | 2 | ||
| Recommended: Device power supply voltage | VCC | 2 | 7 | V | 2 | ||
| Recommended: Motor power supply voltage | VM | 0 | 11 | V | 2 | ||
| Recommended: Logic level input voltage | VIN | 0 | V | 2 | |||
| Recommended: H-bridge output current | IOUT | 0 | 1.5 | A | 2 | ||
| Recommended: Externally applied PWM frequency | fPWM | 0 | 250 | kHz | 2 | ||
| Recommended: Operating ambient Temperature Range | TA | -40 | 85 | ℃ | 2 | ||
| VM operating supply current | IVM | 194 | µA | No PWM, no load | 3 | ||
| VM operating supply current | IVM | 350 | µA | 50 kHz PWM, no load | 3 | ||
| VM sleep mode supply current | IVMQ | 5 | nA | VM=2V, VCC=0V, all inputs 0V | 3 | ||
| VM sleep mode supply current | IVMQ | 10 | 95 | nA | VM=5V, VCC=0V, all inputs 0V | 3 | |
| VCC operating supply current | IVCC | 372 | µA | 3 | |||
| VCC undervoltage lockout voltage | VUVLO | 1.5 | V | VCC rising | 3 | ||
| VCC undervoltage lockout voltage | VUVLO | 1.7 | V | VCC falling | 3 | ||
| Input low voltage | VIL | 0.3 | x VCC | 3 | |||
| Input high voltage | VIH | 0.5 | x VCC | 3 | |||
| Input low current | IIL | 5 | µA | VIN=0 | 3 | ||
| Input high current | IIH | 50 | µA | VIN=3.3V | 3 | ||
| Pulldown resistance | RPD | 100 | KΩ | 3 | |||
| HS+LS FET on resistance | RDS(ON) | 337 | 400 | mΩ | VCC=3V, VM=3V, IO=800mA, TJ=25℃ | 3 | |
| HS+LS FET on resistance | RDS(ON) | 300 | 360 | mΩ | VCC=5V, VM=5V, IO=800mA, TJ=25℃ | 3 | |
| OFF-state leakage current | IOFF | 200 | nA | 3 | |||
| Overcurrent protection trip level | IOCP | 1.6 | 3.5 | A | 3 | ||
| Overcurrent de-glitch time | tDEG | 1 | µs | 3 | |||
| Overcurrent protection retry time | tOCR | 1 | ms | 3 | |||
| Output dead time | tDEAD | 100 | ns | 3 | |||
| Thermal shutdown temperature | tTSD | 150 | 160 | 180 | ℃ | 3 | |
| Delay time, xPHASE high to xOUT1 low | t1 | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xPHASE high to xOUT2 high | t2 | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xPHASE low to xOUT1 high | t3 | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xPHASE low to xOUT2 low | t4 | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xENBL low to xOUTx high | t5 | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xENBL low to xOUTx low | t6 | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Output enable time | t7 | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Output disable time | t8 | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xINx high to xOUTx high | t9 | 160 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Delay time, xINx low to xOUTx low | t10 | 160 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | ||
| Output rise time | tR | 30 | 188 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | |
| Output fall time | tF | 30 | 188 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 | |
| Junction-to-ambient thermal resistance | RJA | 65.3 | ℃/W | 2 | |||
| Junction-to-thermal resistance | RJC | 45.8 | ℃/W | 2 |
CAD (KiCad official)
- Symbol:
HT8835ARDZ - Footprint:
Package_SON:WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65 - 3D model: WSON-12-EP(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
ht8835ardz-etched.step/ht8835ardz-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ht8835ardz.step/ht8835ardz.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HTCSEMI datasheet (10 pp, sha256
978649a58737b843, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HT8835ARDZ
**HTCSEMI** · Stepper Motor Driver · WSON-12-EP(2x3)
HT8835ARDZ from HTCSEMI, in a WSON-12-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VM | power_in | Motor supply pin, recommended operating range 0 V to 11 V (absolute maximum 12 V), to be bypassed to GND with at least 0.1 µF ceramic capacitor. |
| 2 | AOUT1 | output | Bridge A output 1, connected to motor winding A. |
| 3 | AOUT2 | output | Bridge A output 2 of H-bridge A, shown with the datasheet's motor winding A connection note. |
| 4 | BOUT1 | output | Bridge B output 1, connected to motor winding B. |
| 5 | BOUT2 | output | Bridge B output 2 of H-bridge B, shown with the datasheet's motor winding B connection note. |
| 6 | GND | power_in | Device ground. |
| 7 | BIN2/BENBL | input | Bridge B input 2 / enable input: in IN/IN mode logic high sets BOUT2 high, in PH/EN mode logic high enables H-bridge B; has an internal pulldown resistor (100 kΩ typical). |
| 8 | BIN1/BPHASE | input | Bridge B input 1 / phase input: in IN/IN mode logic high sets BOUT1 high, in PH/EN mode it sets the direction of H-bridge B; has an internal pulldown resistor. |
| 9 | AIN2/AENBL | input | Bridge A input 2 / enable input: in IN/IN mode logic high sets AOUT2 high, in PH/EN mode logic high enables H-bridge A; has an internal pulldown resistor. |
| 10 | AIN1/APHASE | input | Bridge A input 1 / phase input: in IN/IN mode logic high sets AOUT1 high, in PH/EN mode it sets the direction of H-bridge A; has an internal pulldown resistor. |
| 11 | MODE | input | Input mode select: logic low selects IN/IN mode, logic high selects PH/EN mode; has an internal pulldown resistor. |
| 12 | VCC | power_in | Device logic supply, recommended operating range 2 V to 7 V, to be bypassed to GND with at least 0.1 µF ceramic capacitor. |
| 13 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | WSON-12-EP(2x3) |
| Category | Motor Driver ICs |
| Pins | 13 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Absolute max: Motor power supply voltage | VM | -0.3 | | 12 | V | | 2 |
| Absolute max: Power supply voltage | VCC | -0.3 | | 7 | V | | 2 |
| Absolute max: Operating ambient Temperature Range | TA | -40 | | 125 | ℃ | | 2 |
| Absolute max: Storage Temperature | TSTG | -65 | | 150 | ℃ | | 2 |
| Recommended: Device power supply voltage | VCC | 2 | | 7 | V | | 2 |
| Recommended: Motor power supply voltage | VM | 0 | | 11 | V | | 2 |
| Recommended: Logic level input voltage | VIN | 0 | | | V | | 2 |
| Recommended: H-bridge output current | IOUT | 0 | | 1.5 | A | | 2 |
| Recommended: Externally applied PWM frequency | fPWM | 0 | | 250 | kHz | | 2 |
| Recommended: Operating ambient Temperature Range | TA | -40 | | 85 | ℃ | | 2 |
| VM operating supply current | IVM | | 194 | | µA | No PWM, no load | 3 |
| VM operating supply current | IVM | | 350 | | µA | 50 kHz PWM, no load | 3 |
| VM sleep mode supply current | IVMQ | | 5 | | nA | VM=2V, VCC=0V, all inputs 0V | 3 |
| VM sleep mode supply current | IVMQ | | 10 | 95 | nA | VM=5V, VCC=0V, all inputs 0V | 3 |
| VCC operating supply current | IVCC | | 372 | | µA | | 3 |
| VCC undervoltage lockout voltage | VUVLO | | 1.5 | | V | VCC rising | 3 |
| VCC undervoltage lockout voltage | VUVLO | | 1.7 | | V | VCC falling | 3 |
| Input low voltage | VIL | | | 0.3 | x VCC | | 3 |
| Input high voltage | VIH | 0.5 | | | x VCC | | 3 |
| Input low current | IIL | | 5 | | µA | VIN=0 | 3 |
| Input high current | IIH | | 50 | | µA | VIN=3.3V | 3 |
| Pulldown resistance | RPD | | 100 | | KΩ | | 3 |
| HS+LS FET on resistance | RDS(ON) | | 337 | 400 | mΩ | VCC=3V, VM=3V, IO=800mA, TJ=25℃ | 3 |
| HS+LS FET on resistance | RDS(ON) | | 300 | 360 | mΩ | VCC=5V, VM=5V, IO=800mA, TJ=25℃ | 3 |
| OFF-state leakage current | IOFF | | 200 | | nA | | 3 |
| Overcurrent protection trip level | IOCP | 1.6 | | 3.5 | A | | 3 |
| Overcurrent de-glitch time | tDEG | | 1 | | µs | | 3 |
| Overcurrent protection retry time | tOCR | | 1 | | ms | | 3 |
| Output dead time | tDEAD | | 100 | | ns | | 3 |
| Thermal shutdown temperature | tTSD | 150 | 160 | 180 | ℃ | | 3 |
| Delay time, xPHASE high to xOUT1 low | t1 | | | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xPHASE high to xOUT2 high | t2 | | | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xPHASE low to xOUT1 high | t3 | | | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xPHASE low to xOUT2 low | t4 | | | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xENBL low to xOUTx high | t5 | | | 200 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xENBL low to xOUTx low | t6 | | | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Output enable time | t7 | | | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Output disable time | t8 | | | 300 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xINx high to xOUTx high | t9 | | | 160 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Delay time, xINx low to xOUTx low | t10 | | | 160 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Output rise time | tR | 30 | | 188 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Output fall time | tF | 30 | | 188 | ns | TA=+25℃, VM=5V, VCC=3V, RL=20Ω | 4 |
| Junction-to-ambient thermal resistance | RJA | | 65.3 | | ℃/W | | 2 |
| Junction-to-thermal resistance | RJC | | 45.8 | | ℃/W | | 2 |
## CAD (KiCad official)
- Symbol: `HT8835ARDZ`
- Footprint: `Package_SON:WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65`
- 3D model: WSON-12-EP(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `ht8835ardz-etched.step` / `ht8835ardz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ht8835ardz.step` / `ht8835ardz.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HTCSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588945748872740864) (10 pp, sha256 `978649a58737b843`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ht8835ardz-datasheet.pdf)