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HT8835ARDZ

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HTCSEMI Stepper Motor Driver, WSON-12-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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HT8835ARDZ

HTCSEMI · Stepper Motor Driver · WSON-12-EP(2x3)

HT8835ARDZ from HTCSEMI, in a WSON-12-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VM power_in Motor supply pin, recommended operating range 0 V to 11 V (absolute maximum 12 V), to be bypassed to GND with at least 0.1 µF ceramic capacitor.
2 AOUT1 output Bridge A output 1, connected to motor winding A.
3 AOUT2 output Bridge A output 2 of H-bridge A, shown with the datasheet's motor winding A connection note.
4 BOUT1 output Bridge B output 1, connected to motor winding B.
5 BOUT2 output Bridge B output 2 of H-bridge B, shown with the datasheet's motor winding B connection note.
6 GND power_in Device ground.
7 BIN2/BENBL input Bridge B input 2 / enable input: in IN/IN mode logic high sets BOUT2 high, in PH/EN mode logic high enables H-bridge B; has an internal pulldown resistor (100 kΩ typical).
8 BIN1/BPHASE input Bridge B input 1 / phase input: in IN/IN mode logic high sets BOUT1 high, in PH/EN mode it sets the direction of H-bridge B; has an internal pulldown resistor.
9 AIN2/AENBL input Bridge A input 2 / enable input: in IN/IN mode logic high sets AOUT2 high, in PH/EN mode logic high enables H-bridge A; has an internal pulldown resistor.
10 AIN1/APHASE input Bridge A input 1 / phase input: in IN/IN mode logic high sets AOUT1 high, in PH/EN mode it sets the direction of H-bridge A; has an internal pulldown resistor.
11 MODE input Input mode select: logic low selects IN/IN mode, logic high selects PH/EN mode; has an internal pulldown resistor.
12 VCC power_in Device logic supply, recommended operating range 2 V to 7 V, to be bypassed to GND with at least 0.1 µF ceramic capacitor.
13 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer HTCSEMI
Package WSON-12-EP(2x3)
Category Motor Driver ICs
Pins 13

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Absolute max: Motor power supply voltage VM -0.3 12 V 2
Absolute max: Power supply voltage VCC -0.3 7 V 2
Absolute max: Operating ambient Temperature Range TA -40 125 ℃ 2
Absolute max: Storage Temperature TSTG -65 150 ℃ 2
Recommended: Device power supply voltage VCC 2 7 V 2
Recommended: Motor power supply voltage VM 0 11 V 2
Recommended: Logic level input voltage VIN 0 V 2
Recommended: H-bridge output current IOUT 0 1.5 A 2
Recommended: Externally applied PWM frequency fPWM 0 250 kHz 2
Recommended: Operating ambient Temperature Range TA -40 85 ℃ 2
VM operating supply current IVM 194 µA No PWM, no load 3
VM operating supply current IVM 350 µA 50 kHz PWM, no load 3
VM sleep mode supply current IVMQ 5 nA VM=2V, VCC=0V, all inputs 0V 3
VM sleep mode supply current IVMQ 10 95 nA VM=5V, VCC=0V, all inputs 0V 3
VCC operating supply current IVCC 372 µA 3
VCC undervoltage lockout voltage VUVLO 1.5 V VCC rising 3
VCC undervoltage lockout voltage VUVLO 1.7 V VCC falling 3
Input low voltage VIL 0.3 x VCC 3
Input high voltage VIH 0.5 x VCC 3
Input low current IIL 5 µA VIN=0 3
Input high current IIH 50 µA VIN=3.3V 3
Pulldown resistance RPD 100 KΩ 3
HS+LS FET on resistance RDS(ON) 337 400 mΩ VCC=3V, VM=3V, IO=800mA, TJ=25℃ 3
HS+LS FET on resistance RDS(ON) 300 360 mΩ VCC=5V, VM=5V, IO=800mA, TJ=25℃ 3
OFF-state leakage current IOFF 200 nA 3
Overcurrent protection trip level IOCP 1.6 3.5 A 3
Overcurrent de-glitch time tDEG 1 µs 3
Overcurrent protection retry time tOCR 1 ms 3
Output dead time tDEAD 100 ns 3
Thermal shutdown temperature tTSD 150 160 180 ℃ 3
Delay time, xPHASE high to xOUT1 low t1 300 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xPHASE high to xOUT2 high t2 200 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xPHASE low to xOUT1 high t3 200 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xPHASE low to xOUT2 low t4 300 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xENBL low to xOUTx high t5 200 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xENBL low to xOUTx low t6 300 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Output enable time t7 300 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Output disable time t8 300 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xINx high to xOUTx high t9 160 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Delay time, xINx low to xOUTx low t10 160 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Output rise time tR 30 188 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Output fall time tF 30 188 ns TA=+25℃, VM=5V, VCC=3V, RL=20Ω 4
Junction-to-ambient thermal resistance RJA 65.3 ℃/W 2
Junction-to-thermal resistance RJC 45.8 ℃/W 2

CAD (KiCad official)

  • Symbol: HT8835ARDZ
  • Footprint: Package_SON:WSON-12-1EP_3x2mm_P0.5mm_EP1x2.65
  • 3D model: WSON-12-EP(2x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.75 mm nominal WSON height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: ht8835ardz-etched.step / ht8835ardz-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ht8835ardz.step / ht8835ardz.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HTCSEMI datasheet (10 pp, sha256 978649a58737b843, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF