# HT24C02ARZ

**HTCSEMI** · EEPROM · SOP-8

HT24C02ARZ from HTCSEMI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A0 | input | Device address input bit 0. Hard-wire to VCC or VSS to set the chip's 2-wire slave address; up to eight HT24C02 devices can share one bus. Floating pin is internally read as VSS (low). |
| 2 | A1 | input | Device address input bit 1. Hard-wire to VCC or VSS to set the chip's 2-wire slave address. Floating pin is internally read as VSS (low). |
| 3 | A2 | input | Device address input bit 2. Hard-wire to VCC or VSS to set the chip's 2-wire slave address. Floating pin is internally read as VSS (low). |
| 4 | VSS | power_in | Negative power supply, ground reference. |
| 5 | SDA | bidirectional | Bidirectional 2-wire serial data. Open-drain output; requires an external pull-up resistor to VCC. Can be wire-OR'd with other open-drain/collector devices. |
| 6 | SCL | input | Serial clock input. Positive edge clocks data into the EEPROM; negative edge clocks data out. Max 400 kHz at 1.8-5.0V, up to 1 MHz at 2.5-5.0V. |
| 7 | WP | input | Hardware write protect. Tie to VCC to inhibit writes to the full 2K array (device acts as a serial ROM); tie to VSS or leave floating to allow normal read/write. |
| 8 | VCC | power_in | Positive power supply, 1.8V to 5.5V over -40 to +85 degC. Max 5 mA operating (write at 400 kHz), 3 uA standby. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HTCSEMI |
| Package | SOP-8 |
| Category | Memory |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `HT24C02ARZ`
- `HT24C02ARZNZ`
- `HT24C02ARZRTZ`
- `HT24C02ARZRMZ`
- `HT24C02ARZRDZ`

## CAD (KiCad official)

- Symbol: `HT24C02ARZ`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `ht24c02arz-etched.step` / `ht24c02arz-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ht24c02arz.step` / `ht24c02arz.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HTCSEMI datasheet](docs/ht24c02arz-datasheet.pdf) (10 pp, sha256 `be1286d196ee2c5e`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ht24c02arz-datasheet.pdf)